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HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera

The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of the most critical applications of robots is material handling, where grippers are used to move objects, such as automotive parts, logistics packages, food ingredients, and...

Fujitsu develops high-sensitivity, high-resolution infrared sensor to expand monitoring capabilities in defense and disaster prevention

KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields. This sensor is a Type-II superlattice (T2SL) infrared sensor with over 1 million pixels, capable of detecting both...

QSMP-20 module utilises DDR3 memory to avoid ongoing AI pressure on lead times and cost

Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module), providing a drop-in, pin-compatible upgrade for the QSMP-15 that now features an industrial-grade STM32MP2 MPU. The QSMP-20 also takes advantage of lower cost DDR3 RAM with shorter...

Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option

RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition targets engineers developing high-reliability power systems where component qualification is a formal requirement—giving them a path to AEC-Q compliance without rebuilding their qualification process from...

Sivers Semiconductors Announces Availability of DaybreakTM 5G/6G Advanced ICs For Emerging FR3 Applications

Kista, Sweden – March 30, 2026 – Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced general availability of its 7-15GHz DaybreakTM beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defense arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network...

Connecting the World Through Space – Qorvo and Mouser

In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers...

CEO Interview with Charlie Peppiatt of Gooch & Housego

Charlie Peppiatt has served as Chief Executive Officer of Gooch & Housego since September 2022. He joined the company from TT Electronics, where he was Executive Vice President following TT’s acquisition of Stadium Group plc. Prior to that, Charlie served as Chief Executive Officer of Stadium Group from 2013 until...

All About Circuits

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.

TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive

How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running. The post TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive appeared first on EDN.

BESI at the center of the Packaging Power Shift

Why the takeover interest in BESI reflects a broader transformation in semiconductor equipment Step by step, this industry is coalescing around a central battleground. As front-end and back-end technologies converge, control over key interconnect steps is emerging as a critical differentiator. In today’s article, Gabriela Pereira, Senior Technology & Market Analyst,...

Waymo Dominates California AV Test Data

California DMV reports AVs with permits drove over 9 million miles in 2025. The post Waymo Dominates California AV Test Data appeared first on EE Times.

Radar transceiver scales for automated driving

NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation. The post Radar transceiver scales for automated driving appeared first on EDN.

HWLLC topology pushes fast charging to 500 W

A half-wave LLC (HWLLC) platform from Renesas includes four controller ICs rated for up to 500 W for high-speed chargers. The post HWLLC topology pushes fast charging to 500 W appeared first on EDN.

SiC modules raise power density for AI servers

QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. The post SiC modules raise power density for AI servers appeared first on EDN.

Automotive HMI SiP packs MPU and DDR2 memory

The SAM9X75D5M from Microchip is a hybrid SiP integrating an 800-MHz ARM926EJ-S 32-bit processor with 512 Mbits of DDR2 SDRAM. The post Automotive HMI SiP packs MPU and DDR2 memory appeared first on EDN.

FET-based clamp protects 48-V USB PD EPR lines

Semtech’s TDS5311P circuit protection device delivers near-constant clamping voltage for 48-V USB PD EPR applications. The post FET-based clamp protects 48-V USB PD EPR lines appeared first on EDN.

The Silicon Desert

The Silicon Desert Map showcases Arizona technology companies that comprise Semiconductor, Hardware, Software, Emerging Technologies, IT, IoT, AI, Manufacturing, Research and Development, as well as all the supply chains. In addition, the map provides representation for HealthCare, Med Tech, Life Sciences, and pharmaceutical industries. Participants range from entrepreneurial Start-Ups to Fortune 100 multinationals, Academic...

CEO Interview with Jussi-Pekka Penttinen of Vexlum Ltd

Jussi-Pekka Penttinen is the chief executive officer, chief technical officer, and cofounder of Vexlum Ltd, an advanced laser technology company. With more than 15 years of experience, he is a leading researcher in the field of Vertical External Cavity Surface Emitting Laser (VECSEL) and successfully commercialized the technology.… Read More...

IEEE Spectrum Semiconductors

Facial Recognition Is Spreading Everywhere

Facial recognition technology (FRT) dates back 60 years. Just over a decade ago, deep-learning methods tipped the technology into more useful—and menacing—territory. Now, retailers, your neighbors, and law enforcement are all storing your face and building up a fragmentary photo album of your life.Yet the story those photos can tell...

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SRAM as the New Compute Fabric: A Comparative Architecture Study of Groq LPU, Cerebras WSE, and Google TPU

Original Article By SemiVision Research [Reading time: 22 mins]

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