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Meta's MTIA Roadmap

Inference-centric design. ROIC is clear. Implications for the industry.

D2D China: Show Don't Tell

A closer look at the PRC's Advanced Semis Packaging Industry

Four Months Into Its Comeback, Zapata Stakes Its Claim In Quantum Software

Path to Commercialization: LPKF Develops Glass Components for Quantum Computers in Funded QVLS-iLabs Future Cluster

LPKF develops glass components for ion traps, vacuum chambers and quantum sensors in three projects / Laser micromachining of glass provides the precision required for quantum computer components / Future cluster QVLS-iLabs (QVLS = Quantum Valley Lower Saxony) receives €15 million in funding to accelerate commercialization of quantum technologies. ANNOVER/...

Daily: Meta's in-house chips

6 min read.

University of Sheffield to lead £12.5m UK Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems

The University of Sheffield is leading a new £12.5m national research center to strengthen the UK’s ability to design the next generation of advanced electronic systems and support the ambitions of the UK Semiconductor Strategy...

Investing in Your Professional Community Yields Big Returns

Engineering is so much more than solving problems or writing efficient code. It is about creating solutions that affect billions of lives and contributing to a profession built on innovation, responsibility, and collaboration. Although technical skills remain critical, what truly will accelerate the growth of the next generation of engineers...

Low-cost MCUs enable smarter embedded devices

Leveraging ST’s 40-nm process and an Arm Cortex-M33 core, STM32C5 MCUs deliver increased speed for cost-sensitive embedded devices. The post Low-cost MCUs enable smarter embedded devices appeared first on EDN.

TinyEngine NPU powers AI in TI MCUs

TI’s MSPM0G5187 and AM13E23019 MCUs integrate the TinyEngine NPU, enabling efficient edge AI in systems ranging from simple to complex. The post TinyEngine NPU powers AI in TI MCUs appeared first on EDN.

Edge AI SoC integrates tri-radio

The i.MX 93W applications processor from NXP combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. The post Edge AI SoC integrates tri-radio appeared first on EDN.

200-V MOSFETs cut conduction losses

Two devices have joined iDEAL Semiconductor’s SuperQ 200-V MOSFET portfolio, offering very low RDS(on) in standard power packages. The post 200-V MOSFETs cut conduction losses appeared first on EDN.

Sfera Labs debuts industrial Raspberry Pi edge systems

Sfera Labs has introduced an industrial Raspberry Pi-based edge server and PLC for industrial IoT and edge applications. The post Sfera Labs debuts industrial Raspberry Pi edge systems appeared first on EDN.

Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2)

Multiple companies, including GUC, Marvell, and Samsung, are prepping their own custom memory solutions for demanding applications. The post Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2) appeared first on EE Times.

WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge

The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much …...

Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.

CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects

Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interconnects with integrated nanolasers for next-generation computing) have announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300mm integrated photonics process...

NewPower Worldwide Expands Credit Facility to $500 Million

NewPower Worldwide boosts credit facility to $500M, empowering faster, larger supply deals. The post NewPower Worldwide Expands Credit Facility to $500 Million appeared first on EE Times.

The Great AI Silicon Shortage

TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner

Ravi Subramanian on Trends that are Shaping AI at Synopsys

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More The post...

Fable: The Creative Founder

141 years ago this man  founded an electronics company which lasted for over 100 years: It led the world in many fields including AC transmission equipment, computing, radar and semiconductors. ... The post Fable: The Creative Founder appeared first on Electronics Weekly.