Latest semiconductor industry news and analysis
Page 33 of 34Imec and Atlas Data Storage, a specialist in production-scale DNA data storage, have joined forces to to accelerate the development of digital data storage using synthetic DNA. The collaboration combines ... The post Imec accelerates DNA data storage appeared first on Electronics Weekly.
Original Article By SemiVision Research [Reading time: 15 mins]
With smartphone and tablet news already discussed, what else did Apple unveil this week? Read on for all the goodies and their details. The post Apple’s spring 2026 soirée: The rest of the story appeared first on EDN.
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.
No one had very high career aspirations for teenager David A. Weston—except for Weston himself. Growing up in London, he scored low on the U.K. national assessment test given to students finishing primary school. The result meant that his next path was either to become a laborer or attend a...
SENTRON Electronic Circuit Protection Device (ECPD) will soon be available with integrated Residual Current Monitoring function A three-phase ECPD version for high-voltage (400V) applications is on the roadmap for upcoming releases First circular SIRIUS 3RW5 -Z R11 refurbished soft starter with identical product features but typically up to 50 percent...
The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More The post Reducing Risk Early:...
STMicro launches STM32C5 MCUs—triple performance, enhanced security, all for under $1. The post STMicro MCUs Aim to Redefine Entry-Level Performance For Less than $1 appeared first on EE Times.
Rivian designed its own autonomy SoC. Why?
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced what it claims is the industry’s first commercially available 10kV SiC power MOSFET. The firm says this unlocks architectural freedom, delivering unprecedented system durability, and advancing access to reliable and...
7 min read.
Built on a 28-nm process, the Renesas RH850/U2C automotive MCU delivers robust connectivity and security for modern E/E architectures. The post MCU enables ASIL D safety and control appeared first on EDN.
With 25-µs/point measurement speed, Copper Mountain’s three SC series VNAs enable efficient R&D and manufacturing testing. The post VNAs perform production test up to 9 GHz appeared first on EDN.
Infineon’s EZ-PD PMG1-B2 MCU integrates a USB-C PD controller with a 55-V buck-boost controller for charging Li-ion battery packs. The post MCU brings USB-C power to embedded devices appeared first on EDN.
Teledyne Microwave UK’s B3LT98026 wideband limiter protects sensitive receiver front ends in defense and military communication systems. The post Passive limiter shields electronics from RF threats appeared first on EDN.
Nordic expands its ultra-low-power cellular IoT portfolio with Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI. The post Nordic debuts multiple cellular IoT products appeared first on EDN.
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March...
Melville, NY (March 3, 2026) – Micross Components, Inc. (“Micross”), a global provider of Hi-Rel microelectronic products and services for aerospace, defense, space, medical, and industrial applications, has expanded its DC-DC converter portfolio with the new Class H+ AFLS28XX Series. This series provides a cost-effective, radiation-tolerant power conversion solution for low-earth-orbit (LEO)...
There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More...