Latest semiconductor industry news and analysis
Page 6 of 34How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support certification, and ensure your silicon meets its security requirements from day one. The post Secure at First Silicon: Reducing Cost and Risk appeared first on Semiconductor Engineering.
How physical AI systems combine sensors, edge processing, and connectivity to enable real-time, intelligent decision-making directly on devices like robots and smart edge systems. The post Enabling Physical AI and Robotics: Platform for the Intelligent Edge appeared first on Semiconductor Engineering.
A road-vehicle standard-based unified AI safety lifecycle and blueprint for integrating both robustness and resilience into AI systems deployed in safety-critical domains. The post Ensuring Trustworthiness of AI-Enhanced Embedded Systems appeared first on Semiconductor Engineering.
6 min read.
How a next‑gen SRAM compiler IP for TSMC N5A and N3A helps design teams with measurable gains in PPA, reliability, and system robustness. The post Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs appeared first on Semiconductor Engineering.
Key considerations for secure AI, along with limitations and recommendations to overcome the limitations for secure AI deployments. The post Hardware Deployment for Secure AI Using Confidential Computing appeared first on Semiconductor Engineering.
A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications. The post Radar SLAM Application on Vision DSPs based on Novel IO-ICP appeared first on Semiconductor Engineering.
Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering.
Full automation is still a goal, but humans will still be in the loop for the foreseeable future. The post AI’s Potential And Limitations In Chip Design appeared first on Semiconductor Engineering.
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. The post Preparing For The Multiphysics Future of 3D ICs appeared first on Semiconductor Engineering.
Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ... The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.
Semiconductor industry capex was $166 billion in 2025, up 7% YoY, says Semiconductor Intelligence (SI). SI estimates 2026 capex will be $200 billion, up 20% from 2025. TSMC was the ... The post 2026 semiconductor capex to increase 20% YoY appeared first on Electronics Weekly.
IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the ... The post NIST develops high temperature photonics packaging appeared first on Electronics Weekly.
Notebook shipments are set to fall 14.8% YoY, says TrendForce. Further price hikes are expected in the coming quarters. A tight memory supply continues to push up system costs, while ... The post Notebook shipments to fall 14.8% appeared first on Electronics Weekly.
Is Arm getting its hands on its customers' business?
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.
Microbenchmarking, tcgen05, 2SM MMA, UMMA, TMA, LDGSTS, UBLKCP, Speed of Light, Distributed Shared Memory, GPC Floorsweeps, SM Yield
Arm’s new AGI CPU signals a bold move into the $100B AI silicon market, balancing high-performance orchestration for agentic AI. The post AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees appeared first on EE Times.
Metallium Ltd of Subiaco, Western Australia, says that its US subsidiary Flash Metals USA Inc of Houston, TX, USA has executed a long-term offtake agreement with materials refiner and manufacturer Indium Corp of Clinton, NY, USA, covering the supply of gallium (Ga), germanium (Ge) and other critical metals recovered using...