Latest semiconductor industry news and analysis
Page 27 of 34A roundup of all the latest electronics news from Embedded World in Nuremberg. The post Embedded World 2026: Get the full Electronics Weekly Guide appeared first on Electronics Weekly.
LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor announces the expansion of its SuperQ™ 200V MOSFET portfolio, delivering industry-leading on-resistance across the most widely used power semiconductor packages. The iS20M5R5S1T sets a new benchmark as the lowest RDS(on) 200V MOSFET available in the industry-standard TOLL package, while the newly introduced iS20M6R3S1P delivers the lowest RDS(on) for...
Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely. The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More The post Axiomise Introduces nocProve to...
OXFORD, England-March 10, 2026-Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch. Designed to unlock peak performance in AI datacenters, Salience Labs’ all-optical switch technology improves network latency, throughput and reliability metrics while...
Saarbruecken, Germany, March 9, 2026 – HighTec EDV-Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified LLVM-based HighTec Rust and C/C++ compiler toolchain available for Renesas RH850/U2x microcontrollers. Embedded developers working on this high-performance 32-bit...
TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD...
Every generation of mobile networks, from 1G to 5G, has rewritten the rules of how the world lives and works. The coming 6G revolution, by decade’s end, will represent a new direction still, toward a universal data fabric where millions of agents collaborate in real-time across the digital and physical...
Japan-based ROHM has begun online sales of new TRCDRIVE pack, HSDIP20 and DOT-247 silicon carbide (SiC) molded modules, available from distributors including DigiKey and Farnell...
Mechanical analogies to electronics are common. We might refer to this one as akin to a battery with an internal short circuit? The post A long-ago blow leads to water overflow: Who could know? appeared first on EDN.
I don’t like change. I know I’m starting to sound like an old codger, but that’s OK because I am an old codger (I know the secret handshake and I have the ceremonial undergarments T-Shirt to prove it). For example, I remember going to the Design Automation Conference (DAC) year...
As AI systems scale from single-rack scale-up network systems to multi-rack configurations up to thousands of AI processors, copper interconnects have reached their limits in speed, density and reach. Future scale-up networks require an optical architecture that delivers higher bandwidth density at lower power with maximum processor utilization...
Here is why gallium nitride (GaN) is the natural successor to silicon MOSFETs in the 100–650 V class of power devices. The post GaN fundamentals: 2DEG, crystal structure, and figure of merit appeared first on EDN.
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has appointed Tonya Stevens as chief financial officer (CFO), effective 30 March...
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has launched two new packages: top-side-cooled QDPAK and a low-profile TO-247-4L with asymmetrical leads in its 5th-generation GeneSiC technology platform. The latest 1200V SiC MOSFET products are claimed...
At MWC, Ericsson is all about AI-native networks, aiming to nail down 6G by 2029. The post At MWC, Ericsson Details AI-Native 6G Timeline appeared first on EE Times.
The speed at which accelerators can be fed with data has become just as critical as raw compute capability. The post HBM4E Raises The Bar For AI Memory Bandwidth appeared first on Semiconductor Engineering.
The long-term objective is to let engineers spend more time on what really matters and less time on manual coordination. The post Human-Centered Agentic AI Comes To RTL Verification appeared first on Semiconductor Engineering.
Co-packaged optics technology will have a big impact on system power and the cost of data movement. The post CPO Is Extending The Limits Of What’s Possible In AI Data Centers appeared first on Semiconductor Engineering.
Achieve low-latency, human-like dialogue without sending data outside the local environment. The post Rethinking Voice AI At The Edge: A Practical Offline Pipeline appeared first on Semiconductor Engineering.
A compact, two-pin interface provides efficient access to debug and trace features while minimizing pin count. The post Serial Wire Debug (SWD) Protocol: Efficient Debug Interface For Arm-Based Systems appeared first on Semiconductor Engineering.