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Semiconductor Engineering

Causal Inference for AMS Design (U. of Florida)

A new technical paper, “Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis,” was published by the University of Florida. Abstract “Analog-mixed-signal (AMS) circuits are highly non-linear and operate on continuous real-world signals, making them far more difficult to model with data-driven AI than digital blocks. To close the...

Semiconductor Today

Latest issue of Semiconductor Today now available

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month

All About Circuits

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.

Semiconductor Engineering

Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)

A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract “The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and...

Semiconductor Engineering

CP-Based Lot Scheduling Solutions For a Semiconductor Manufacturing (Infineon, U. of Klagenfurt)

A new technical paper, “Quantifying the Global Impact of Constraint Programming Based Local Scheduling in Semiconductor Manufacturing,” was published by Infineon and the University of Klagenfurt. Abstract “The efficiency of semiconductor frontend manufacturing highly depends on the optimization of resource allocation. In academic works, scheduling methods, i.e., based on Constraint...

Mechanical Stress in Semiconductor Development

3D NAND subarray structures tilt during slit processing, demonstrating stress evolution, including deformation. The post Mechanical Stress in Semiconductor Development appeared first on IMAPS 3D InCites Content Platform.

Semiconductor Today

AOI showcases 25dBm ultra-high-power ELSFP for next-gen AI infrastructure

At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) demonstrated how its solutions...

Electronics Weekly

ESA awards OHB Sweden the EPS‑Sterna constellation contract

The European Space Agency (ESA) has selected OHB Sweden to build 20 small satellites for the EUMETSAT Polar System – Sterna (EPS‑Sterna) constellation. EUMETSAT is the European Organisation for the ... The post ESA awards OHB Sweden the EPS‑Sterna constellation contract appeared first on Electronics Weekly.

No Contracts, No Problem: The Trust Behind NVIDIA and TSMC

Original Article By SemiVision Research [Reading time: 13 mins]

RISC-V Now! — Where Specification Meets Scale!

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible...

Electronics Weekly

Toshiba’s TPHR6704RL targets industrial switched-mode power supplies

Toshiba’s TPHR6704RL is a 40V, 0.67mΩ N-channel MOSFET aiming yo to improve efficiency for industrial power supplies. It uses U-MOS11-H technology, highlights Toshiba, to deliver ultra-low on-resistance, fast switching and ... The post Toshiba’s TPHR6704RL targets industrial switched-mode power supplies appeared first on Electronics Weekly.

Next-generation LED Drivers for Exterior Lighting in the SDV

The trend toward SDV has significant implications for automotive exterior lighting. ROHM is addressing these challenges with its new driver ICs. The post Next-generation LED Drivers for Exterior Lighting in the SDV appeared first on EE Times.

EnSilica joins UK CHERI Adoption Collective to accelerate secure-by-design silicon

Oxford, UK, March 31st, 2026: EnSilica, a leading maker of mixed-signal ASICs, has been selected to join the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the UK Department for Science, Innovation & Technology (DSIT). CHERI (Capability Hardware Enhanced RISC Instructions) is a processor technology that...

Electronics Weekly

President Trump

President Trump’s leadership skills, and mental and physical fitness score reasonably well on a survey of Americans published by Pew Research Center. However, his ability to pick good advisers, respect ... The post President Trump appeared first on Electronics Weekly.

STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications

Geneva, Switzerland, March 31, 2026 — STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance and small die size. The devices target space-constrained applications including power distribution and battery management in automotive products. The first device in the new...

Electronics Weekly

Where The Music Plays

The US is the largest recorded music market in the world, accounting for more than 3 in 10 paid streams globally last year, says Luminate, making it the largest premium ... The post Where The Music Plays appeared first on Electronics Weekly.

Rohm Joins Toshiba and Mitsubishi to Create a Power Chip Titan

The tie-up could bolster Japan’s global semiconductor footprint and address fragmented IC markets. The post Rohm Joins Toshiba and Mitsubishi to Create a Power Chip Titan appeared first on EE Times.

Nuclear Power and Design Automation

A couple of folks have asked me to write on nuclear power. Nuclear offers additional sources for power generation, a pressing concern thanks to demand from giant data centers. Also, investment by Microsoft, Sam Altman and others signals their urgency to accelerate past slow moving utilities plans. I have some...

IEEE Spectrum Semiconductors

The ’80s Submersible That Transformed Underwater Exploration

As a kid, I loved the 1980s aquatic adventure show Danger Bay. True to the TV show’s name, danger was always lurking at the Vancouver Aquarium, where the show was set. In one memorable episode, young Jonah and a friend get trapped in a sabotaged mini-submarine, and Jonah’s dad, a...

APEC 2026 showcases advances in power electronics

The annual Applied Power Electronics Conference & Exposition (APEC 2026) showcases hundreds of companies that exhibit their latest component andContinue Reading The post APEC 2026 showcases advances in power electronics appeared first on EDN.

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