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Semiconductor Engineering

How SW and HW Vulnerabilities Can Complement LLM-Specific Algorithmic Attacks (UT Austin, Intel et al.)

Mar 21, 2026

A new technical paper, “Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems,” was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract “Rapid progress in generative AI has given rise to Compound AI systems – pipelines comprised of...

Semiconductor Engineering

Bias- and Temperature-Dependent Noise Measurements to Investigate Carrier Transport at the Tellurium Interface (POSTECH)

Mar 21, 2026

A new technical paper, “Revealing and Engineering Contact-Origin Noise in Ultrathin Tellurium Transistors,” was published by researchers at Pohang University of Science and Technology. Abstract “Tellurium (Te) has emerged as a promising p-type semiconductor for ultrathin electronics owing to its strong air stability, excellent hole transport, narrow bandgap, and BEOL-integration...

Semiconductor Today

OpenLight sampling first heterogeneously integrated silicon photonics-based 3.2T DR8 PIC

Mar 20, 2026

Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced sample availability of its first heterogeneously...

Semiconductor Today

OpenLight receives first volume production orders Tower’s PH18DA InP-on-silicon photonic platform

Mar 20, 2026

Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced the first volume production orders by...