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Electronics Weekly

Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems

Mar 31, 2026

As collaborative robots (cobots) are increasingly deployed alongside human operators, their system architectures continue to evolve toward higher integration, reduced size and greater modularity. These trends place growing demands on ... The post Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems appeared first on Electronics Weekly.

Semiconductor Today

MoU signed to discuss integrating Toshiba Electronic Devices & Storage’s semiconductor business, ROHM’s semiconductor business, and Mitsubishi Electric’s power device business

Mar 30, 2026

Toshiba Corp of Kawasaki, Japan has signed a memorandum of understanding (MoU) to start discussions regarding a business integration of the semiconductor business of its subsidiary Toshiba Electronic Devices & Storage Corp (TDSC), the semiconductor business of ROHM Co Ltd, and the power device business of Mitsubishi Electric Corp. The...