All News

Latest semiconductor industry news and analysis

Page 18 of 34
EE Journal

STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads

Mar 19, 2026

Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24V loads. Leveraging synchronous...

EE Journal

2026 IEEE Electronic Components and Technology Conference To Feature a Keynote Address by Dr. Tien Wu, CEO of ASE

Mar 19, 2026

The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for...

Semiconductor Today

BluGlass partners with US government relations, corporate advisory and public affairs firm

Mar 19, 2026

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has partnered with US government relations, corporate advisory and public affairs firm Michael Best Strategies to enhance engagement with key decision...

IEEE Spectrum Semiconductors

Overcoming Core Engineering Barriers in Humanoid Robotics Development

Mar 19, 2026

A technical examination of the sensing, motion control, power, and thermal challenges facing humanoid robotics engineers — with component-level design strategies for real-world deployment.What Attendees will LearnWhy motion control remains the hardest unsolved problem — Explore the modelling complexity, real-time feedback requirements, and sensor fusion demands of maintaining stable bipedal...