Latest semiconductor industry news and analysis
Page 28 of 34Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem. The post AI Power on the Edge appeared first on Semiconductor Engineering.
For reaching farther into another data center, developers are now talking about scale-across. The post Scale-Up, Scale-Out Get a New Partner appeared first on Semiconductor Engineering.
A case study on adapting memory compilers and logic libraries for power-critical optical networking chips. The post Customizing Foundation IP For Ultra-Low-Voltage Designs appeared first on Semiconductor Engineering.
Original Article By SemiVision Research [Reading time: 10 mins]
Taiwan is both a manufacturing center and a global platform for innovation in next-generation embedded systems. The post Taiwan Extends Its Reach from Advanced Chips to Embedded Systems appeared first on EE Times.
Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.
South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — has recently completed the development of its silicon carbide (SiC) planar MOSFET process platform, which it says is gaining traction in the next-generation compound power...
Optical MEMS microphones deliver studio-quality audio in ultra-small form. The post Beyond the Backplate: Optical MEMS Microphones Unlock High-fidelity Audio appeared first on EE Times.
In 2025 IEEE launched its first virtual career fair to help strengthen the engineering workforce and connect top talent with industry professionals. The event, which was held in the United States, attracted thousands of students and professionals. They learned about more than 500 job opportunities in high-demand fields including artificial...
The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important,...
To complete this project, we add backlight control and temperature-sensing functionality to the clock we built in the previous installments.
This article is crossposted from IEEE Spectrum’s careers newsletter. Sign up now to get insider tips, expert advice, and practical strategies, written in partnership with tech career development company Parsity and delivered to your inbox for free!How to Keep Your Engineering Skills Sharp in an AI WorldEngineers today are caught...
A DIY PCB fixture using split-Kelvin technique enables accurate, repeatable LCR measurements for low-impedance SMD components. The post Custom DIY LCR SMD fixture for low-Z components appeared first on EDN.
March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)– Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer...
First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement Pre-certified designs simplify wireless certification, eliminating RF complexity...
CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Kudelski Group (SIX:KUD.S) and a global leader in embedded security for semiconductors and connected devices, today announced that Axelera AI has integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new high-performance, Edge AI processing platform. The collaboration strengthens the security foundation of Europa, ensuring that...
Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to help customers maintain stable, reproducible toolchains across long product lifecycles. Across safety-critical industries including automotive, industrial automation, and medical technology, embedded software must remain maintainable,...
Seoul, South Korea and Austin, TX — March 10, 2026 — BANF, a Korean intelligent tire system company, and Silicon Labs, the leading innovator in low-power wireless, today announced a breakthrough in tire monitoring technology. By integrating Silicon Labs’ ultra-low-power Bluetooth® LE SoC, the BG22, into its in-tire sensor platform, BANF...
There’s a moment in John Williams’s Star Wars overture when the brass surges upward. You don’t just hear it; you feel propulsion turning into pure possibility.On 16 March 1926, in a snow-dusted field in Auburn, Mass., Robert Goddard created an earlier version of that same feeling. His first liquid-fueled rocket—a...