Automotive

TDK is introducing two new DC link capacitor series optimized for on-board chargers (OBCs) in electric vehicles: the ultra compact B43655 and B43656 series. Both series are optimised for forced ... The post TDK aluminium electrolytic capacitors for DC links in OBCs appeared first on Electronics Weekly.

EE Journal

Infineon launches TEGRION™ SLI22 automotive security controller with post-quantum cryptography certified to Common Criteria EAL6+

Mar 06, 2026

Munich, Germany – 03 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 28nm TEGRION™ SLI22, the latest innovation in automotive security controllers, designed to protect the future of connected systems. With its Common Criteria (CC) certification at the German Federal Office for Information Security (BSI)...

EDN

MCU enables ASIL D safety and control

Mar 05, 2026

Built on a 28-nm process, the Renesas RH850/U2C automotive MCU delivers robust connectivity and security for modern E/E architectures. The post MCU enables ASIL D safety and control appeared first on EDN.

All About Circuits

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

Mar 07, 2026

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.

Semiconductor Engineering

Chip Industry Week In Review

Mar 06, 2026

AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared first on Semiconductor...

IEEE Spectrum Semiconductors

Raquel Urtasun on Level-4 Autonomous Trucks

Mar 13, 2026

Raquel Urtasun has spent 16 years in the self-driving space, long enough to navigate every metaphorical glorious hill and plunging valley. She took the trip from the early “pipe dream” dismissals, to the “we’re this close” certainty, and back again.The industry is now riding a new wave of optimism and...

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EE Journal

Driving the Code: Where the Rubber Meets the Software-Defined Road

Mar 13, 2026

In this week’s Fish Fry we’re casting our line into one of the most transformative shifts happening in the automotive industry today: the rise of software-defined systems! Nitish Rao from MathWorks and I take a closer look at which vehicle functions are best handled by AI-driven systems, and which still...

Electronics Weekly

Nissan joins Uber and Wayve for Tokyo robotaxi roll-out

Mar 13, 2026

Nissan, Uber and Wayve are to collaborate on a plan to put robotaxis on Tokyo streets this year. The plan is to use Nissan Leaf EVs with Wayve’s ADAS tech. ... The post Nissan joins Uber and Wayve for Tokyo robotaxi roll-out appeared first on Electronics Weekly.

EE Journal

HighTec Drives Automotive Software Development on Renesas RH850/U2x MCUs with LLVM-Based Rust and C/C++ Toolchains

Mar 12, 2026

Saarbruecken, Germany, March 9, 2026 – HighTec EDV-Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified LLVM-based HighTec Rust and C/C++ compiler toolchain available for Renesas RH850/U2x microcontrollers. Embedded developers working on this high-performance 32-bit...

Semiconductor Today

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

Mar 12, 2026

South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — has recently completed the development of its silicon carbide (SiC) planar MOSFET process platform, which it says is gaining traction in the next-generation compound power...

EE Journal

IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications

Mar 11, 2026

Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to help customers maintain stable, reproducible toolchains across long product lifecycles. Across safety-critical industries including automotive, industrial automation, and medical technology, embedded software must remain maintainable,...

Semiconductor Today

Sivers to supply lasers and optical amplifiers worth $53–138m over customer’s product life-cycle

Mar 11, 2026

Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) says that its strategic LiDAR (light detection and ranging) customer has incorporated its technology across their platforms and will ramp production from fourth-quarter 2026 for automotive and industrial applications....

SemiVision

NVIDIA Automotive: Smarter Cars, Bigger Responsibility

Mar 11, 2026

Original Article By SemiVision Research [Reading time: 10 mins]

All About Circuits

NXP Drives Zonal Computing Transition With New Reference System

Mar 10, 2026

Announced today, the new zonal reference system includes pre-validated hardware and software for automotive intelligent data handling and multi-volt power distribution.

EE Times

Synopsys Bets on AI Agents to Power Automotive Digital Twins

Mar 16, 2026

Synopsys leverages AI agents and digital twins to slash automotive software validation times. The post Synopsys Bets on AI Agents to Power Automotive Digital Twins appeared first on EE Times.

IEEE Spectrum Semiconductors

New Polymer Blend Could Help Store Energy for the Grid and EVs

Mar 17, 2026

As electronics demand higher energy density, one component has proved challenging to shrink: the capacitor. Making a smaller capacitor usually requires thinning the dielectric layer or electrode surface area, which has often resulted in a reduction of power. A new polymer material could help change that.In a study published 18...

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Semiconductor Today

Nagoya University and NU-Rei report first gallium oxide thin-film epi growth on silicon

Mar 16, 2026

At the Japan Society of Applied Physics (JSAP) Spring Meeting 2026 at the Insitute of Science Tokyo (15-18 March), a research group from Nagoya University’s Center for Low-temperature Plasma Sciences, in collaboration with university spinout NU-Rei Co Ltd, is presenting six advances in the growth of gallium oxide (Ga2O3), which...

EE Times

Telink TL322X+ML3228A Launched at Embedded World 2026

Mar 20, 2026

Telink unveiled TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V, multi-protocol support including Bluetooth, Zigbee, Thread, Matter, 2.4GHz Proprietary, and automotive-grade AEC-Q100 certification for IoT applications. The post Telink TL322X+ML3228A Launched at Embedded World 2026 appeared first on EE Times.

Semiconductor Today

Warwick secures funding to boost UK wide-bandgap power semiconductor reliability testing

Mar 20, 2026

The University of Warwick has secured new funding to boost the UK’s ability to test the reliability of advanced semiconductors used in electric vehicles, renewable energy, and other critical technologies...

IEEE Spectrum Semiconductors

Nigerian Firms Embrace Kit-Based EV Assembly for Cost Savings

Mar 19, 2026

A growing number of Nigerian companies are turning to kit-based assembly to bring electric vehicles to market in Africa. Lagos-based Saglev Micromobility Nigeria recently partnered with Dongfeng Motor Corporation, in Wuhan, China, to assemble 18-seat electric passenger vans from imported kits.Kit-based assembly allows Nigerian firms to reduce costs, create jobs,...

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EDN

UWB SoCs extend ranging and radar performance

Mar 19, 2026

The ST64UWB family of ultra-wideband SoCs from ST provides increased range and processing capability for automotive applications. The post UWB SoCs extend ranging and radar performance appeared first on EDN.

IEEE Spectrum Semiconductors

How Your Virtual Twin Could One Day Save Your Life

Mar 19, 2026

One morning in May 2019, a cardiac surgeon stepped into the operating room at Boston Children’s Hospital more prepared than ever before to perform a high-risk procedure to rebuild a child’s heart. The surgeon was experienced, but he had an additional advantage: He had already performed the procedure on this...

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EE Times

Next-generation LED Drivers for Exterior Lighting in the SDV

Mar 31, 2026

The trend toward SDV has significant implications for automotive exterior lighting. ROHM is addressing these challenges with its new driver ICs. The post Next-generation LED Drivers for Exterior Lighting in the SDV appeared first on EE Times.

EE Journal

STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications

Mar 31, 2026

Geneva, Switzerland, March 31, 2026 — STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance and small die size. The devices target space-constrained applications including power distribution and battery management in automotive products. The first device in the new...

EE Journal

HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera

Mar 30, 2026

The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of the most critical applications of robots is material handling, where grippers are used to move objects, such as automotive parts, logistics packages, food ingredients, and...

EE Journal

Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option

Mar 30, 2026

RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition targets engineers developing high-reliability power systems where component qualification is a formal requirement—giving them a path to AEC-Q compliance without rebuilding their qualification process from...

All About Circuits

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Mar 30, 2026

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.

EDN

Radar transceiver scales for automated driving

Mar 30, 2026

NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation. The post Radar transceiver scales for automated driving appeared first on EDN.

EDN

Automotive HMI SiP packs MPU and DDR2 memory

Mar 30, 2026

The SAM9X75D5M from Microchip is a hybrid SiP integrating an 800-MHz ARM926EJ-S 32-bit processor with 512 Mbits of DDR2 SDRAM. The post Automotive HMI SiP packs MPU and DDR2 memory appeared first on EDN.

Semiconductor Engineering

Integrating Error Propagation Theory Into the FMEDA Framework (Robert Bosch GmbH)

Mar 28, 2026

A new technical paper, “Quantifying Uncertainty in FMEDA Safety Metrics: An Error Propagation Approach for Enhanced ASIC Verification,” was published by Robert Bosch GmbH. Abstract “Accurate and reliable safety metrics are paramount for functional safety verification of ASICs in automotive systems. Traditional FMEDA (Failure Modes, Effects, and Diagnostic Analysis) metrics,...

Semiconductor Today

Taiwan Semiconductor introduces AEC-Q-qualified 1200V SiC Schottky rectifiers in SOD-128 packages

Mar 26, 2026

Taiwan Semiconductor Co Ltd (TSC) of New Taipei City, Taiwan — which supplies discrete power electronics devices, LED drivers, analog ICs, transient voltage suppressor (TVS), and electrostatic discharge (ESD) protection — has added to its growing series of automotive-grade 1200V-rated silicon carbide (SiC) Schottky diodes with 1A and 2A models....

IEEE Spectrum Semiconductors

Training Driving AI at 50,000× Real Time

Mar 26, 2026

This is a sponsored article brought to you by General Motors. Visit their new Engineering Blog for more insights.Autonomous driving is one of the most demanding problems in physical AI. An automated system must interpret a chaotic, ever-changing world in real time—navigating uncertainty, predicting human behavior, and operating safely across...

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Semiconductor Today

Infineon partners with Zenergize on power electronics for India’s energy transition

Mar 25, 2026

At the Bharat Electricity Summit (BES 2026) in Yashobhoomi, New Delhi (19–21 March), Infineon Technologies AG of Munich, Germany announced a strategic technology partnership with Zenergize, an emerging Indian company designing and manufacturing AI-integrated power electronics hardware for the solar, EV charging, and renewable energy sectors. Infineon has had a...

Semiconductor Today

Renesas unveils first bidirectional 650V-class GaN switch for solar power inverters, AI data centers and onboard EV chargers

Mar 24, 2026

Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...

EDN

MOSFET ensures automotive thermal reliability

Apr 02, 2026

Diodes has added a 100-V MOSFET to its lineup of 40-V to 80-V devices, all in 8×8-mm gullwing-leaded packages for automotive systems. The post MOSFET ensures automotive thermal reliability appeared first on EDN.

EE Journal

Vishay Intertechnology Automotive Grade Photovoltaic MOSFET Driver Boosts Reliability and Lowers Costs in High Voltage Systems

Apr 01, 2026

MALVERN, Pa. — April 1, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade photovoltaic MOSFET driver that is the first such device in the compact SMD-4 package to provide a creepage distance of 8 mm and mold compound with a comparative tracking index (CTI) of 600....

Electronics Weekly

Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs

Apr 01, 2026

Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches ... The post Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs appeared first on Electronics Weekly.

Semiconductor Engineering

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs

Apr 01, 2026

How a next‑gen SRAM compiler IP for TSMC N5A and N3A helps design teams with measurable gains in PPA, reliability, and system robustness. The post Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs appeared first on Semiconductor Engineering.

Semiconductor Engineering

Blog Review: Apr. 1

Apr 01, 2026

Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering.

Semiconductor Engineering

Chip Industry Week In Review

Apr 03, 2026

Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...

EE Journal

Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio

Apr 02, 2026

April 2, 2026 SANTA ROSA, Calif. – Keysight Technologies, Inc. (NYSE: KEYS) today announced Keysight Assembly, a new virtual process simulation solution designed to help manufacturers identify assembly issues earlier in development, before they become costly production problems. Late-stage assembly failures are an expensive problem in automotive and industrial manufacturing....

Semiconductor Engineering

World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security

Apr 02, 2026

Securing data in a way that preserves the predictable timing behavior required for AI-driven systems. The post World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security appeared first on Semiconductor Engineering.

Semiconductor Engineering

IC Security Threats Spike With Quantum, AI, And Automotive

Apr 02, 2026

Post-quantum cryptography emerges as top concern, followed by AI and automotive complexity. The post IC Security Threats Spike With Quantum, AI, And Automotive appeared first on Semiconductor Engineering.

IEEE Spectrum Semiconductors

Video Friday: Digit Learns to Dance—Virtually Overnight

Apr 03, 2026

Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNARSS 2026: 13–17 July 2026, SYDNEYSummer...

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Hot Topics

TDK aluminium electrolytic capacitors for DC links in OBCs

Infineon launches TEGRION™ SLI22 automotive security controller with post-quantum cryptography certified to Common Criteria EAL6+

MCU enables ASIL D safety and control

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

Chip Industry Week In Review

Raquel Urtasun on Level-4 Autonomous Trucks

Driving the Code: Where the Rubber Meets the Software-Defined Road

Nissan joins Uber and Wayve for Tokyo robotaxi roll-out

HighTec Drives Automotive Software Development on Renesas RH850/U2x MCUs with LLVM-Based Rust and C/C++ Toolchains

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications

Sivers to supply lasers and optical amplifiers worth $53–138m over customer’s product life-cycle

NVIDIA Automotive: Smarter Cars, Bigger Responsibility

NXP Drives Zonal Computing Transition With New Reference System

Synopsys Bets on AI Agents to Power Automotive Digital Twins

New Polymer Blend Could Help Store Energy for the Grid and EVs

Nagoya University and NU-Rei report first gallium oxide thin-film epi growth on silicon

Telink TL322X+ML3228A Launched at Embedded World 2026

Warwick secures funding to boost UK wide-bandgap power semiconductor reliability testing

Nigerian Firms Embrace Kit-Based EV Assembly for Cost Savings

UWB SoCs extend ranging and radar performance

How Your Virtual Twin Could One Day Save Your Life

Next-generation LED Drivers for Exterior Lighting in the SDV

STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications

HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera

Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Radar transceiver scales for automated driving

Automotive HMI SiP packs MPU and DDR2 memory

Integrating Error Propagation Theory Into the FMEDA Framework (Robert Bosch GmbH)

Taiwan Semiconductor introduces AEC-Q-qualified 1200V SiC Schottky rectifiers in SOD-128 packages

Training Driving AI at 50,000× Real Time

Infineon partners with Zenergize on power electronics for India’s energy transition

Renesas unveils first bidirectional 650V-class GaN switch for solar power inverters, AI data centers and onboard EV chargers

MOSFET ensures automotive thermal reliability

Vishay Intertechnology Automotive Grade Photovoltaic MOSFET Driver Boosts Reliability and Lowers Costs in High Voltage Systems

Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs

Blog Review: Apr. 1

Chip Industry Week In Review

Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio

World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security

IC Security Threats Spike With Quantum, AI, And Automotive

Video Friday: Digit Learns to Dance—Virtually Overnight