Latest semiconductor industry news and analysis
Page 21 of 34Farnell has signed a new distribution agreement with Hongfa, a leading manufacturer of relays and electromechanical components. The agreement comes as demand for high-performance, reliable relay solutions continues to grow ... The post Farnell signs Hongfa appeared first on Electronics Weekly.
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic partnership with optical communication device, module and subsystem maker O-Net Technologies (Group) Co Ltd of Shenzhen, China and Enablence Technologies Inc of Ottawa, Ontario, Canada...
Edge AI, robotics, and digital twins are converging to enable physical AI-driven manufacturing systems. The post From DX to AX: AW 2026 Signals the Rise of Autonomous Manufacturing appeared first on EE Times.
As electronics demand higher energy density, one component has proved challenging to shrink: the capacitor. Making a smaller capacitor usually requires thinning the dielectric layer or electrode surface area, which has often resulted in a reduction of power. A new polymer material could help change that.In a study published 18...
A precision op-amp replaces thermal drift issues in RTD circuits, enabling accurate temperature readings across wide ranges. The post Newer, shinier DMM RTDs—part 2 appeared first on EDN.
I think most of us have come to appreciate how incredibly useful AI can be, and it’s getting more efficacious every day. The funny thing is that it’s becoming harder to remember a time before AI (much like younger people being unable to visualize a world without high-definition flat-screen TVs,...
The European Space Agency has signed Tyvak International to further develop Farinella. This is a 6U CubeSat that will support ESA’s RAMSES planetary defence mission to the near-Earth asteroid Apophis. ... The post Tyvak to develop Farinella CubeSat for RAMSES asteroid mission appeared first on Electronics Weekly.
Looming over the internet lasers and firestarting phones companies were touting at Mobile World Congress in Barcelona this month, was a more nebulous but much larger announcement: a pan-European cloud called EURO-3C.EURO-3C’s backers – Spanish telecoms giant Telefónica, dozens of other European companies, and the European Commission (EC) – aim...
Ensure you receive the latest and greatest Gadget Master posts, hot and fresh, straight into your inbox! The post Get the Gadget Master newsletter! appeared first on Electronics Weekly.
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has announced its latest DC–DC power delivery board (PDB) powered by GaNFast technology, enabling direct conversion from 800V to 6V in one power stage. This eliminates the traditional...
Specialty semiconductor and performance materials producer 5N Plus Inc (5N+) of Montréal, Québec, Canada has announced upcoming changes to its board of directors. Michael Hanley will be proposed for election as a new independent director at the annual meeting of shareholders on 7 May. Jean-Marie Bourassa, a board member since...
This special section will review key building blocks of chiplet design while separating hype from reality. The post What the special section on chiplets design has to offer appeared first on EDN.
Micron has begun volume shipment of its HBM4 36GB 12H designed for NVIDIA Vera Rubin and capable of over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s. ... The post Micron in volume production of HBM4 for Vera Rubin appeared first on Electronics Weekly.
NVIDIA today announced the NVIDIA Vera Rubin platform is opening the next frontier of agentic AI, with seven new chips now in full production. They are: the NVIDIA Vera CPU, ... The post Nvidia announces seven Vera Rubin chips in volume production appeared first on Electronics Weekly.
Step-by-step application of AI in EDA. The post How AI Will Automate Chip Design appeared first on Semiconductor Engineering.
Embedding AI agents to improve productivity without sacrificing reliability. The post Human-Centered Agentic AI Workflows For RTL Verification appeared first on Semiconductor Engineering.
A new technical paper, “Oxide induced degradation in MoS2 field-effect transistors,” was published by researchers at imec and ETH Zurich. Abstract excerpt “Transition Metal Dichalcogenides (TMDC) are promising candidates for future scaled transistor channels but their performance is often degraded by imperfections such as the interface with amorphous gate oxides....
Photonics: Ski jump structure; on-chip nanolasers; neural networks. The post Research Bits: Mar. 17 appeared first on Semiconductor Engineering.
Industrial robotics leap into physical AI, empowering factories with real-time smarts. The post Industrial Robotics Drive Shift Toward Physical AI appeared first on EE Times.
The government announced today that it is to spend £2 billion on quantum computing research over the next four years. The Department of Science, Innovation and Technology says it is ... The post Government to spend £2bn on quantum computing appeared first on Electronics Weekly.