Latest semiconductor industry news and analysis
Page 13 of 34Original Article By SemiVision Reserach [Reading time: 10 mins]
Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...
Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) has introduced a flyback topology that extends the power range of flyback converters to 440W — well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback...
Last week’s Nvidia GTC conference highlighted new chip architectures to power AI. But as the chips become faster and more powerful, the remainder of data center infrastructure is playing catch-up. The power-delivery community is responding: Announcements from Delta, Eaton, and Vertiv showcased new designs for the AI era. Complex and...
The undying thirst for smarter (historically, that means larger) AI models and greater adoption of the ones we already have has led to an explosion in data-center construction projects, unparalleled both in number and scale. Chief among them is Meta’s planned 5-gigawatt data center in Louisiana, called Hyperion, announced in...
In booth #1753 at the Applied Power Electronics Conference (APEC 2026) at the Henry B. Gonzalez Convention Center in San Antonio, Texas, USA (22–25 March), Toshiba America Electronic Components Inc – the North American semiconductor and storage business of Tokyo-based semiconductor maker Toshiba Corp – is highlighting its latest power...
Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted as a platform for the industry’s brightest engineers, researchers, suppliers, and students from across the microelectronics packaging ecosystem to come together to share innovations shaping next-generation computing systems. With record...
WHEN KYIV-BORN ENGINEER Yaroslav Azhnyuk thinks about the future, his mind conjures up dystopian images. He talks about “swarms of autonomous drones carrying other autonomous drones to protect them against autonomous drones, which are trying to intercept them, controlled by AI agents overseen by a human general somewhere.” He also...
CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective, low-silver alloys, including SAC105 and SAC0307. Indium12.9HF is specifically formulated to accommodate fine feature printing, as seen with 01005 components. It offers unprecedented stencil...
OXIDE Corp of Yamanashi, Japan (which specializes in optical crystals and frequency-conversion technology) and Finland-based laser developer and manufacturer Vexlum (which was spun off from Tampere University of Technology’s Optoelectronics Research Centre in 2017) have officially entered into a strategic partnership agreement. The collaboration focuses on the development and manufacturing...
2.5 min read.
Original Article By SemiVision Reserach [Reading time: 10 mins]
Groq LP30, LPX Rack, Attention FFN Disaggregation, Oberon & Kyber Updates, Nvidia's CPO Roadmap, Vera ETL256, CMX & STX
These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.
k-Space Associates Inc of Dexter, MI, USA — which produces thin-film metrology instrumentation and software — says that Dylan James Scientific (DJS) will serve as its new sales representative for Europe...
Mel OlkenFormer executive director of the IEEE Power & Energy SocietyFellow, 92; died 9 JanuaryOlken became the first executive director of the IEEE Power & Energy Society (PES) in 1995. In 2002 he left the position to serve as founding editor in chief of the society’s Power & Energy Magazine....
Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.