Telecom operators are updating 5G infrastructure with AI and preparing for 6G. The post At MWC, Intel Outlines CPU-Driven Case for Telecom Networks appeared first on EE Times.
A panel of industry experts takes a sneak peek at system-level design challenges in EVs and outlines viable solutions. The post EV system design from components to modules to software appeared first on EDN.
Following up on the cardiac abnormality thankfully detected by wearable devices, this engineer details the system he donned for a month. The post Cardiac monitors: Inconspicuous, robust data collectors appeared first on EDN.
I’m feeling more than a little existential at the moment. Unfortunately, I don’t think there’s a cream for that. I was going to say, “Don’t worry, it’s not catching.” However, the more I think about what I’m about to tell you, the more I fear we might discover that it...
Rohde & Schwarz’s CMX500 radio communication tester can now cover all non-terrestrial network (NTN) technologies, the company highlights. It also features a Constellation Insight Tool to create a digital twin ... The post CMX500 radio communication tester covers all NTN technologies appeared first on Electronics Weekly.
TDK is introducing two new DC link capacitor series optimized for on-board chargers (OBCs) in electric vehicles: the ultra compact B43655 and B43656 series. Both series are optimised for forced ... The post TDK aluminium electrolytic capacitors for DC links in OBCs appeared first on Electronics Weekly.
Test System Architect is a graphical toolset developed for signal path design and deployment by signal switching and simulation specialist, Pickering Interfaces. The toolset is available free of charge and ... The post Pickering develops software tool for signal path testing appeared first on Electronics Weekly.
The Iran War is hitting the electronics industry, writes Paul Dempsey in Washington DC. Analyst IDC says that if it lasts only a few weeks, it will have a “modest” ... The post Counting the cost of war on Iran appeared first on Electronics Weekly.
Smart spectacles with a twist: the addition of audio, using speakers to send amplified sound into the wearer's ear. The open ear hearing aids are built into the frames themselves, avoiding the need for ear buds. The post Gadget Watch: Smart spectacles build hearing aids into the frames appeared first...
STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density Increased performance with cost efficiency Comprehensive ecosystem to enhance end-device capabilities and accelerate time to market Mar 5, 2026 (Geneva, Switzerland) — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has...
SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS) has collaborated with Qualcomm Technologies, Inc. to demonstrate machine learning (ML)-based Channel State Information (CSI) compression to enhance link adaptation efficiency in advanced Multiple-Input Multiple-Output (MIMO) systems at Mobile World Congress (MWC) Barcelona 2026. In a controlled lab validation, the ML-based CSI feedback...
Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth® LE High Data Throughput (HDT) feature. The companies will jointly showcase the setup based on the CMP180 radio communication tester from Rohde & Schwarz, characterizing Realtek’s next generation Bluetooth® solution RTL8922D and...
Munich, Germany – 03 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 28nm TEGRION™ SLI22, the latest innovation in automotive security controllers, designed to protect the future of connected systems. With its Common Criteria (CC) certification at the German Federal Office for Information Security (BSI)...
TOKYO, Mar 5, 2026 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced the successful development of “HPM-L111”, the world’s first metal*1 palladium (Pd) hydrogen permeable membrane capable of...
23 years ago, fostering good relations with China looked like a good idea, ‘A new initiative intended to foster Anglo-Chinese business joint ventures was recently launched in the UK,’ reported ... The post Cosying Up To China appeared first on Electronics Weekly.
Monheim am Rhein, Germany — March 5, 2026 — The STM32C5 series is the newest edition to STMicroelectronics’s widely adopted STM32 family of microcontrollers. Arm® Cortex®-M33-based and general purpose in nature, the STM32C5 series is simple, efficient, cost effective, and designed to address the needs of next-generation embedded and Artificial Intelligence of Things applications....
Hsinchu, Taiwan, March 5th, 2026 – oToBrite, a provider of Vision AI solutions for unmanned vehicles, off-highway machines, and robotics, today announced two plug-and-play GMSL2 camera enablement kits for NVIDIA Jetson Orin Nano and NVIDIA Jetson AGX Orin developer kits. Each kit combines a rugged oToBrite GMSL2 camera adapter built around an ADI/MAXIM MAX96724 deserializer with the corresponding NVIDIA Jetson developer kit in...
Bosch Sensortec’s high-performance BMP585 pressure sensor is validated for use with Qualcomm Technologies’ new Snapdragon Wear™ Elite Platform. The sensor delivers precise altitude data for enhanced fitness tracking (elevation), improved E911 emergency location (z-axis), and smarter user context awareness. Bosch Sensortec’s comprehensive portfolio of MEMS sensors provides the foundation for...
Embedded Systems take center stage in this week’s podcast! My guest is Rolf Segger from SEGGER! Rolf and I dive deep into their extensive embedded solutions portfolio. We also explore the fascinating concept of emApps, which represents an intriguing vision for embedded system design and is poised to shape the...
Denso, the Japanese auto parts supplier, has made an offer to buy Rohm for around $8.2 billion, reports the Nikkei. “We are considering various strategic options including the acquisition of ... The post Denso bids for Rohm appeared first on Electronics Weekly.
The Chief Engineer from a company Dunn contracted for dishonestly presents fake power supply test results as if they were real. The post Risk assessment in the workplace appeared first on EDN.
The telecom sector is divided on radio access network architecture. The post Nvidia Advances AI-Native Strategy at MWC appeared first on EE Times.
UK government agencies are announcing their intention to work together to support in-space manufacturing of pharmaceuticals. This is in terms of regulatory clarity and official support. It sees potential in ... The post Regulatory clarity promised for space manufacturing of pharmaceuticals appeared first on Electronics Weekly.
There's Rohm licensing TSMC’s GaN process technology, Nvidia building 6G wireless networks, and RS Group buying a specialist distributor of industrial automation and control. The post Most Read – RS buys BPX, Nvidia photonics, AI-RAN in 6G appeared first on Electronics Weekly.
Launched at MWC in Barcelona, the PentaG-NTN is a 5G-NTN (non-terrestrial network) modem IP subsystem for satellite user terminals supporting LEO and MEO constellations. It enables satellite operators, constellation and ... The post Ceva integrates modem IP for satellite and terrestrial terminals appeared first on Electronics Weekly.
LLC, positioned between external memory and internal subsystems, stores frequently accessed data close to compute resources. The post Last-level cache has become a critical SoC design element appeared first on EDN.
Shifting regulations will push the market beyond price comparisons toward providers offering flexibility, resilience, and clearer guidance. The post Is Your IoT Strategy Ready for the New Landscape? appeared first on EE Times.
Marktech Optoelectronics Inc of Latham, NY, USA has announced an expanded portfolio of high-power UV LED light sources with new UV emitters spanning 230nm to 400nm. These devices strengthen the firm’s offerings across the ultraviolet light spectrum — from deep-UV LED (DUV LED, far-UVC LED) sterilization wavelengths to longer UVB...
TI is combining its motor control, sensing and power technologies with Nvidia’s robotics compute, ethernet based sensing and simulation technologies to validate perception, actuation and safety of humanoid robots earlier and ... The post TI and Nvidia hook up on humanoid robots appeared first on Electronics Weekly.
NTT DOCOMO has developed a new system powered by FEEL TECH haptic technology that allows fans to experience physical sensations transmitted from artists, creating a stronger sense of closeness with ... The post Here come the Feelies appeared first on Electronics Weekly.
In the first two months of 2026, AI startups have attracted $220 billion, with $189 billion raised in February alone, says a report from BestBrokers.com. This is almost three times ... The post AI startups pull in $220 billion in Jan/Feb 2026 appeared first on Electronics Weekly.
Imec and Atlas Data Storage, a specialist in production-scale DNA data storage, have joined forces to to accelerate the development of digital data storage using synthetic DNA. The collaboration combines ... The post Imec accelerates DNA data storage appeared first on Electronics Weekly.
With smartphone and tablet news already discussed, what else did Apple unveil this week? Read on for all the goodies and their details. The post Apple’s spring 2026 soirée: The rest of the story appeared first on EDN.
SENTRON Electronic Circuit Protection Device (ECPD) will soon be available with integrated Residual Current Monitoring function A three-phase ECPD version for high-voltage (400V) applications is on the roadmap for upcoming releases First circular SIRIUS 3RW5 -Z R11 refurbished soft starter with identical product features but typically up to 50 percent...
STMicro launches STM32C5 MCUs—triple performance, enhanced security, all for under $1. The post STMicro MCUs Aim to Redefine Entry-Level Performance For Less than $1 appeared first on EE Times.
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced what it claims is the industry’s first commercially available 10kV SiC power MOSFET. The firm says this unlocks architectural freedom, delivering unprecedented system durability, and advancing access to reliable and...
Built on a 28-nm process, the Renesas RH850/U2C automotive MCU delivers robust connectivity and security for modern E/E architectures. The post MCU enables ASIL D safety and control appeared first on EDN.
With 25-µs/point measurement speed, Copper Mountain’s three SC series VNAs enable efficient R&D and manufacturing testing. The post VNAs perform production test up to 9 GHz appeared first on EDN.
Infineon’s EZ-PD PMG1-B2 MCU integrates a USB-C PD controller with a 55-V buck-boost controller for charging Li-ion battery packs. The post MCU brings USB-C power to embedded devices appeared first on EDN.
Teledyne Microwave UK’s B3LT98026 wideband limiter protects sensitive receiver front ends in defense and military communication systems. The post Passive limiter shields electronics from RF threats appeared first on EDN.
Nordic expands its ultra-low-power cellular IoT portfolio with Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI. The post Nordic debuts multiple cellular IoT products appeared first on EDN.
Based on assumptions on first-quarter memory prices (which indicate that pricing pressure and constrained supply will begin to ease in second-half 2026), Omdia’s latest outlook forecasts that global smartphone shipments will fall by about 7% year-on-year in 2026...
Satellite communication (Satcom) technology provider Circuits Integrated Hellas (CIH) of Athens, Greece and wireless power-at-a-distance technologies provider Reach Power of Redwood City, CA, USA, have announced a memorandum of understanding (MOU) establishing a multi-year strategic alliance. Focused on joint development of integrated radio frequency (RF)/millimeter-wave (mmWave) and wireless power and...
Mineral exploration company Volta Metals Ltd of Toronto, Canada (which owns, has optioned and is currently exploring a critical minerals portfolio of rare-earths, gallium, lithium, cesium and tantalum projects in Ontario) has begun laboratory-scale bioleaching recovery test work primarily targeting gallium and secondarily rare-earth elements (REEs) at Dr Vasu Appanna’s...
High-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service provider Semtech Corp of Camarillo, CA, USA has acquired HieFo Corp of Alhambra, CA –which manufactures indium phosphide (InP) optoelectronic devices for optical transceivers used across data-center interconnects (DCI) and intra-data-center interconnects – for about $34m in cash...
In booth #2027 at the IEEE Applied Power Electronics Conference (APEC 2026) in San Antonio, Texas (22–26 March), Navitas Semiconductor Corp of Torrance, CA, USA is exhibiting a 250kW solid-state transformer (SST) platform developed by the Power Electronics Laboratory of Switzerland’s École Polytechnique Fédérale de Lausanne (EPFL) that enables the...
Apple's U.S.-based chips actually rely on Taiwan for final assembly. The post Apple’s First Made-in-U.S. Chips Fall Short of Claim appeared first on EE Times.
Researchers from KAUST and Compumacy for Artificial Intelligence Solutions have released “Joint Hardware-Workload Co-Optimization for In-Memory Computing Accelerators”. Abstract “Software-hardware co-design is essential for optimizing in-memory computing (IMC) hardware accelerators for neural networks. However, most existing optimization frameworks target a single workload, leading to highly specialized hardware designs that do not...
Researchers from University of Illinois Urbana-Champaign, UCLA, Stanford University, Nvidia, Google, et al. have released “AI+HW 2035: Shaping the Next Decade”. Abstract “Artificial intelligence (AI) and hardware (HW) are advancing at unprecedented rates, yet their trajectories have become inseparably intertwined. The global research community lacks a cohesive, long-term vision to...
Shurter is releasing its MSM II Switch with an 8-pin M12 connector and RGB status indication. The metal switch is a robust and installation-friendly component for industrial applications, writes the ... The post Shurter MSM II Switch features M12 connection appeared first on Electronics Weekly.
AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared first on Semiconductor...
In this week’s Fish Fry we’re casting our line into one of the most transformative shifts happening in the automotive industry today: the rise of software-defined systems! Nitish Rao from MathWorks and I take a closer look at which vehicle functions are best handled by AI-driven systems, and which still...
Baluns enable impedance matching, minimize signal distortion, and suppress common-mode noise in RF and high-frequency designs. The post Balun transformers: Linking balanced to unbalanced appeared first on EDN.
Hybrid Voice AI combines on-device reflex processing with cloud reasoning to create reliable, always-available smart home voice control. The post Designing the voice AI stack: Integrating spatial hearing AI with edge-based intent gating appeared first on EDN.
Geopolitics and the battle between GPUs and CPUs is defining the future of 6G and telco economics. The post MWC 2026 Concludes as Telcos Pivot to AI appeared first on EE Times.
At Space-Comms Expo, Filtronic was highlighting the latest version of its Cerus V solid state power amplifier (SSPA) for long range V-Band comms. This is for high-frequency links across land, ... The post Filtronic packs Cerus SSPA for gateway links to LEO appeared first on Electronics Weekly.
We're talking Oracle and OpenAI scrapping a datacentre project, TSMC hiring 8,000 more engineers, and Rapidus getting its first customer. There's also our news roundup from Embedded World 2026 and researchers using 3D imaging to detect atomic-scale defects in ICs... The post Most Read – IC defects, Rapidus customer, TSMC...
Data infrastructure semiconductor solutions provider Marvell Technology Inc of Santa Clara, CA, USA and Mojo Vision Inc of Cupertino, CA, USA — which is pioneering a wafers-in, wafers-out micro-LED platform designed to enable AI applications — have announced a long-term collaboration to develop a new class of optical interconnect solutions...
UMC has formed a partnership with HyperLight, a spin out from Harvard University’s Laboratory for Nanoscale Optics, to mass produce thin-film lithium niobate (TFLN) chiplets before the end of this ... The post UMC and Hyperlight hook up on TFLN appeared first on Electronics Weekly.
Nissan, Uber and Wayve are to collaborate on a plan to put robotaxis on Tokyo streets this year. The plan is to use Nissan Leaf EVs with Wayve’s ADAS tech. ... The post Nissan joins Uber and Wayve for Tokyo robotaxi roll-out appeared first on Electronics Weekly.
The leading ten foundries achieved around $169.5 billion in revenue in 2025, a 26.3% YoY increase that set a new industry record, reports TSMC. In Q4 the combined revenue of ... The post 26.3% 2025 revenue rise for ten top foundries appeared first on Electronics Weekly.
Antevia Networks, the telecoms equipment vendor, and Benetel, an Irish manufacturer of O-RAN compliant radio units, have hoooked up to deliver private 5G networks. The agreement follows successful integration testing ... The post Antevia Networks and Benetel hook up for private 5G deployments appeared first on Electronics Weekly.
The University of Sheffield is leading a £12.5 million national research centre to strengthen the UK’s ability to design electronic systems and support the UK Semiconductor Strategy. The Centre for ... The post Sheffield University to lead UK electronics design R&D push appeared first on Electronics Weekly.
Democrats currently lead voting intentions for the midterms by 7 percentage points, with 47% of those surveyed saying they would vote for a Democratic candidate if the election took place ... The post Dems Ahead In Mid-Terms appeared first on Electronics Weekly.
Taiwan remains the semiconductor industry's stronghold in 2026, with a tech roadmap aimed at next-generation AI systems. The post The Silicon Hegemon appeared first on EE Times.
The University of Sheffield is leading a new £12.5m national research center to strengthen the UK’s ability to design the next generation of advanced electronic systems and support the ambitions of the UK Semiconductor Strategy...
Leveraging ST’s 40-nm process and an Arm Cortex-M33 core, STM32C5 MCUs deliver increased speed for cost-sensitive embedded devices. The post Low-cost MCUs enable smarter embedded devices appeared first on EDN.
TI’s MSPM0G5187 and AM13E23019 MCUs integrate the TinyEngine NPU, enabling efficient edge AI in systems ranging from simple to complex. The post TinyEngine NPU powers AI in TI MCUs appeared first on EDN.
The i.MX 93W applications processor from NXP combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. The post Edge AI SoC integrates tri-radio appeared first on EDN.
Two devices have joined iDEAL Semiconductor’s SuperQ 200-V MOSFET portfolio, offering very low RDS(on) in standard power packages. The post 200-V MOSFETs cut conduction losses appeared first on EDN.
Sfera Labs has introduced an industrial Raspberry Pi-based edge server and PLC for industrial IoT and edge applications. The post Sfera Labs debuts industrial Raspberry Pi edge systems appeared first on EDN.
Multiple companies, including GUC, Marvell, and Samsung, are prepping their own custom memory solutions for demanding applications. The post Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2) appeared first on EE Times.
Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interconnects with integrated nanolasers for next-generation computing) have announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300mm integrated photonics process...
NewPower Worldwide boosts credit facility to $500M, empowering faster, larger supply deals. The post NewPower Worldwide Expands Credit Facility to $500 Million appeared first on EE Times.
141 years ago this man founded an electronics company which lasted for over 100 years: It led the world in many fields including AC transmission equipment, computing, radar and semiconductors. ... The post Fable: The Creative Founder appeared first on Electronics Weekly.
A roundup of all the latest electronics news from Embedded World in Nuremberg. The post Embedded World 2026: Get the full Electronics Weekly Guide appeared first on Electronics Weekly.
LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor announces the expansion of its SuperQ™ 200V MOSFET portfolio, delivering industry-leading on-resistance across the most widely used power semiconductor packages. The iS20M5R5S1T sets a new benchmark as the lowest RDS(on) 200V MOSFET available in the industry-standard TOLL package, while the newly introduced iS20M6R3S1P delivers the lowest RDS(on) for...
OXFORD, England-March 10, 2026-Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch. Designed to unlock peak performance in AI datacenters, Salience Labs’ all-optical switch technology improves network latency, throughput and reliability metrics while...
Saarbruecken, Germany, March 9, 2026 – HighTec EDV-Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified LLVM-based HighTec Rust and C/C++ compiler toolchain available for Renesas RH850/U2x microcontrollers. Embedded developers working on this high-performance 32-bit...
TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD...
Japan-based ROHM has begun online sales of new TRCDRIVE pack, HSDIP20 and DOT-247 silicon carbide (SiC) molded modules, available from distributors including DigiKey and Farnell...
Mechanical analogies to electronics are common. We might refer to this one as akin to a battery with an internal short circuit? The post A long-ago blow leads to water overflow: Who could know? appeared first on EDN.
I don’t like change. I know I’m starting to sound like an old codger, but that’s OK because I am an old codger (I know the secret handshake and I have the ceremonial undergarments T-Shirt to prove it). For example, I remember going to the Design Automation Conference (DAC) year...
As AI systems scale from single-rack scale-up network systems to multi-rack configurations up to thousands of AI processors, copper interconnects have reached their limits in speed, density and reach. Future scale-up networks require an optical architecture that delivers higher bandwidth density at lower power with maximum processor utilization...
Here is why gallium nitride (GaN) is the natural successor to silicon MOSFETs in the 100–650 V class of power devices. The post GaN fundamentals: 2DEG, crystal structure, and figure of merit appeared first on EDN.
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has appointed Tonya Stevens as chief financial officer (CFO), effective 30 March...
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has launched two new packages: top-side-cooled QDPAK and a low-profile TO-247-4L with asymmetrical leads in its 5th-generation GeneSiC technology platform. The latest 1200V SiC MOSFET products are claimed...
At MWC, Ericsson is all about AI-native networks, aiming to nail down 6G by 2029. The post At MWC, Ericsson Details AI-Native 6G Timeline appeared first on EE Times.
Taiwan is both a manufacturing center and a global platform for innovation in next-generation embedded systems. The post Taiwan Extends Its Reach from Advanced Chips to Embedded Systems appeared first on EE Times.
South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — has recently completed the development of its silicon carbide (SiC) planar MOSFET process platform, which it says is gaining traction in the next-generation compound power...
Optical MEMS microphones deliver studio-quality audio in ultra-small form. The post Beyond the Backplate: Optical MEMS Microphones Unlock High-fidelity Audio appeared first on EE Times.
A DIY PCB fixture using split-Kelvin technique enables accurate, repeatable LCR measurements for low-impedance SMD components. The post Custom DIY LCR SMD fixture for low-Z components appeared first on EDN.
First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement Pre-certified designs simplify wireless certification, eliminating RF complexity...
CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Kudelski Group (SIX:KUD.S) and a global leader in embedded security for semiconductors and connected devices, today announced that Axelera AI has integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new high-performance, Edge AI processing platform. The collaboration strengthens the security foundation of Europa, ensuring that...
Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to help customers maintain stable, reproducible toolchains across long product lifecycles. Across safety-critical industries including automotive, industrial automation, and medical technology, embedded software must remain maintainable,...
Seoul, South Korea and Austin, TX — March 10, 2026 — BANF, a Korean intelligent tire system company, and Silicon Labs, the leading innovator in low-power wireless, today announced a breakthrough in tire monitoring technology. By integrating Silicon Labs’ ultra-low-power Bluetooth® LE SoC, the BG22, into its in-tire sensor platform, BANF...
Strategic focus on custom silicon allows operators to manage 5G costs preparing for 6G and AI-driven data surge. The post Arm Positions Neoverse for AI and Telco Networks at MWC appeared first on EE Times.
Photonic integration firm Photon Bridge of Eindhoven, The Netherlands has announced a strategic partnership with CPFC, the Canadian Photonics Fabrication Centre, as the indium phosphide (InP) laser foundry partner for its multi-wavelength external laser sources (ELS). The firm says that the cooperation highlights the manufacturability and volume scalability of its...
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) says that its strategic LiDAR (light detection and ranging) customer has incorporated its technology across their platforms and will ramp production from fourth-quarter 2026 for automotive and industrial applications....
In booth 339 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (16–19 March), POET Technologies Inc of Toronto, Ontario, Canada –– which designs and implementats highly integrated optical engines and light sources for artificial intelligence networks –– is giving live demonstrations of...
In booth #1155 at the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles, CA, USA (15–19 March), photonic simulation CAD software developer Photon Design Ltd of Oxford, UK is showcasing its newly released HAROFLD QD laser simulator and silicon modulator design tool. It is also featuring its...
La Luce Cristallina of Austin, TX, USA says that the beta-version of its 200mm (8-inch) barium titanate (BaTiO3) wafer is now available to customers for evaluation in advanced electro-optic modulators for telecoms and datacoms applications. By enabling ultra-low-voltage operation, La Luce Cristallina’s BaTiO3 platform is said to advance co-packaged optics...
Open-source AI and small language models challenge costly closed systems. The post Open-Source AI Gains Ground as Rising Costs Push Shift to Smaller Models appeared first on EE Times.
Humanoid robots stun at AW 2026, showing off embodied AI breakthroughs. The post Humanoid Robots Exit Labs: Mapping the Technical Path to Embodied AI at AW 2026 appeared first on EE Times.
NUBURU Inc of Centennial, CO, USA (a dual-use defense & security platform company focused on non-kinetic effects, directed-energy technologies, and software-orchestrated defense systems) says that its subsidiary Lyocon S.r.l. (an Italian laser-technology company specializing in the design, manufacturing and integration of high-power blue laser systems for industrial applications) has completed...
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade...
Lumentum Holdings Inc of San Jose, CA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) has been selected to join the S&P 500 index. According to S&P Dow Jones Indices, Lumentum will be added to the benchmark index before the market opens...
Fabless photonic integrated circuit (PIC) design, prototyping, testing and packaging house VLC Photonics S.L. of Valencia, Spain (which has experience with various material platforms including silicon photonics, indium phosphide, silicon nitride, PLC and polymer) has announced a strategic collaboration in North America with Hitachi High-Tech America Inc (HTA), which sells...
Spain-based multi-national Indra Group is leading the research, development and innovation (RDI) project GIGaNTE (Gallium Nitride and Advanced Packaging Technologies Research Initiative), a strategic initiative to provide Spain with the necessary capabilities to autonomously develop technologies based on gallium nitride (GaN) for advanced defence applications, especially in high-reliability radar and...
NVIDIA of Santa Clara, CA, USA and materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA have announced a multi-year strategic agreement to advance the frontier of advanced optics technologies, including manufacturing capacity and R&D, to enable next-generation AI infrastructure...
AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials at plants in China — has reported an 11% drop in full-year revenue, from $99.4m in 2024 to $88.3m in 2025...
BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has entered a new AUS$1.25m multi-phased development program, expected to progress over a 14–24-month period, to deliver its gallium nitride (GaN)...
Global smartphone production grew 2.7% quarter-on-quarter from 328 million units in third-quarter 2025 to 337 million units in fourth-quarter 2025, supported by strong shipments of Apple’s new iPhone lineup, according to market research firm TrendForce...
Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) is showcasing an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at the Mobile World Congress 2026 (MWC26) in Barcelona, Spain (2–5 March). Presented in collaboration with Taiwanese fabless semiconductor company MediaTek Inc —...
Synopsys leverages AI agents and digital twins to slash automotive software validation times. The post Synopsys Bets on AI Agents to Power Automotive Digital Twins appeared first on EE Times.
In 1990, there were 9.8 landline subscriptions per 100 people worldwide, a figure that nearly doubled to 19.2 by 2006, according to the International Telecommunication Union. While landline subscriptions peaked ... The post Mobile Tops Peak Landline appeared first on Electronics Weekly.
Capacitive displacement sensor’s touch-free nature makes it ideal for fragile surfaces and high-speed machinery. The post From gap to signal: Non-contact capacitive displacement sensors appeared first on EDN.
Surrey Satellite Technology (SSTL) is joining Lazuli, an initiative of the Eric and Wendy Schmidt Observatory System, which aims to deliver a privately funded telescope into deep space. Working as ... The post SSTL joins plan for Lazuli private space telescope larger than Nasa’s Hubble appeared first on Electronics Weekly....
Here is how a prolonged war in the Middle East could turn into a disaster for the semiconductor business. The post Middle East Turmoil: Materials Shortage, Fuel Price Hike Disrupting Chip Industry appeared first on EE Times.
AI is impacting semiconductor design in terms of workflows, new roles, and unique data management challenges. The post AI Design Reshapes Data Management appeared first on Semiconductor Engineering.
Elon Musk said he’ll start building a fab in the next seven days. In a very brief announcement on X, he wrote: ‘Terafab Project launches in 7 days’. He’s starting ... The post Elon Musk to start building Terafab project this week appeared first on Electronics Weekly.
Honda has cancelled three US EV model launches – the Honda 0 Saloon, Honda 0 SUV and Acura RSX – and said it expected expenses and losses totalling $15.7 billion, ... The post Honda cancels three new EV model launches and takes $15.7bn hit appeared first on Electronics Weekly.
IBM has published a quantum‑centric supercomputing reference architecture – a blueprint for integrating quantum computing into modern supercomputing environments. IBM’s progress in extending useful quantum computing to HPC is discussed ... The post IBM publishes blueprint for integrating quantum computers into supercomputer clusters appeared first on Electronics Weekly.
United States Patent and Trademark Office (USPTO) is requesting input from interested parties on the World Intellectual Property Organisation (WIPO) Riyadh Design Law Treaty (RDLT), adopted by WIPO member states ... The post USPTO seeks input on WIPO Riyadh Design Law Treaty (RDLT) appeared first on Electronics Weekly.
Ethernet switch sales in AI back-end networks more than tripled and accounted for more than two-thirds of datacentre switch sales in AI clusters during 2025, says Dell’Oro. “The growing size ... The post Ethernet takes two thirds of datacentre switch sales appeared first on Electronics Weekly.
I am putting it about that the NBT in computing is not quantum but biocomputing -.computers made using human brain cells or rather artificial brain cells grown in laboratories, Ed ... The post Ed’s Brainy Scam appeared first on Electronics Weekly.
The post CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin. appeared first on Electronics Weekly.
IBM and Lam Research have a five-year agreement focused on developing new materials and fabrication processes. The post IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes appeared first on EE Times.
I knew nothing about Ghidra, but learning it's about reverse-engineering (disassemblers and decompilers) made me think I could include this one in the virtual Gadget Master library. It's The Ghidra Book, The Definitive Guide. The post Gadget Book: The Ghidra Book for reverse engineering appeared first on Electronics Weekly.
Agnitron Technology Inc of Chanhassen, MN, USA says that its Agilis 100 MOCVD system has been selected by the Institute for Materials Chemistry (IMC) at the Leibniz Institute for Solid State and Materials Research (IFW) Dresden, Germany, for its MOCVD and ALD Competence Centre...
The research institute TNO (the Netherlands Organization for Applied Scientific Research in Delft) and High Tech Campus Eindhoven are starting construction of what is reckoned will be the world’s first foundry for producing indium phosphide photonic chips on 6-inch wafers. The official opening was attended by European Commission executive vice-president...
Discover the biggest trends in physical AI and robotics from Embedded World 2026. The post Embedded World 2026 Wrap: Key Highlights appeared first on EE Times.
Preparing for sub-1nm; Iran war fallout on chips; Embedded World announcements; ramping Japan; foundry rankings; MIPI PHY IP; clocking tech; cybersecurity policy; imec's new consortium; neuromorphic computing. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
The speed at which accelerators can be fed with data has become just as critical as raw compute capability. The post HBM4E Raises The Bar For AI Memory Bandwidth appeared first on Semiconductor Engineering.
The long-term objective is to let engineers spend more time on what really matters and less time on manual coordination. The post Human-Centered Agentic AI Comes To RTL Verification appeared first on Semiconductor Engineering.
Co-packaged optics technology will have a big impact on system power and the cost of data movement. The post CPO Is Extending The Limits Of What’s Possible In AI Data Centers appeared first on Semiconductor Engineering.
Achieve low-latency, human-like dialogue without sending data outside the local environment. The post Rethinking Voice AI At The Edge: A Practical Offline Pipeline appeared first on Semiconductor Engineering.
A compact, two-pin interface provides efficient access to debug and trace features while minimizing pin count. The post Serial Wire Debug (SWD) Protocol: Efficient Debug Interface For Arm-Based Systems appeared first on Semiconductor Engineering.
Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem. The post AI Power on the Edge appeared first on Semiconductor Engineering.
For reaching farther into another data center, developers are now talking about scale-across. The post Scale-Up, Scale-Out Get a New Partner appeared first on Semiconductor Engineering.
A case study on adapting memory compilers and logic libraries for power-critical optical networking chips. The post Customizing Foundation IP For Ultra-Low-Voltage Designs appeared first on Semiconductor Engineering.
Pain, such as back pain, headaches and joint pain, are the most common medical symptoms in Germany, the UK, US, Mexico, India and China according to a survey conducted by ... The post Commonest Medical Symptoms appeared first on Electronics Weekly.
Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens’ complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off, increasing engineering efficiency and design quality Builds on top of the Fuse EDA AI system, which provides an advanced retrieval-augmented generation (RAG) framework, multimodal EDA data support, secure...
Farnell has signed a new distribution agreement with Hongfa, a leading manufacturer of relays and electromechanical components. The agreement comes as demand for high-performance, reliable relay solutions continues to grow ... The post Farnell signs Hongfa appeared first on Electronics Weekly.
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic partnership with optical communication device, module and subsystem maker O-Net Technologies (Group) Co Ltd of Shenzhen, China and Enablence Technologies Inc of Ottawa, Ontario, Canada...
Edge AI, robotics, and digital twins are converging to enable physical AI-driven manufacturing systems. The post From DX to AX: AW 2026 Signals the Rise of Autonomous Manufacturing appeared first on EE Times.
A precision op-amp replaces thermal drift issues in RTD circuits, enabling accurate temperature readings across wide ranges. The post Newer, shinier DMM RTDs—part 2 appeared first on EDN.
I think most of us have come to appreciate how incredibly useful AI can be, and it’s getting more efficacious every day. The funny thing is that it’s becoming harder to remember a time before AI (much like younger people being unable to visualize a world without high-definition flat-screen TVs,...
The European Space Agency has signed Tyvak International to further develop Farinella. This is a 6U CubeSat that will support ESA’s RAMSES planetary defence mission to the near-Earth asteroid Apophis. ... The post Tyvak to develop Farinella CubeSat for RAMSES asteroid mission appeared first on Electronics Weekly.
Ensure you receive the latest and greatest Gadget Master posts, hot and fresh, straight into your inbox! The post Get the Gadget Master newsletter! appeared first on Electronics Weekly.
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has announced its latest DC–DC power delivery board (PDB) powered by GaNFast technology, enabling direct conversion from 800V to 6V in one power stage. This eliminates the traditional...
Specialty semiconductor and performance materials producer 5N Plus Inc (5N+) of Montréal, Québec, Canada has announced upcoming changes to its board of directors. Michael Hanley will be proposed for election as a new independent director at the annual meeting of shareholders on 7 May. Jean-Marie Bourassa, a board member since...
This special section will review key building blocks of chiplet design while separating hype from reality. The post What the special section on chiplets design has to offer appeared first on EDN.
Micron has begun volume shipment of its HBM4 36GB 12H designed for NVIDIA Vera Rubin and capable of over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s. ... The post Micron in volume production of HBM4 for Vera Rubin appeared first on Electronics Weekly.
NVIDIA today announced the NVIDIA Vera Rubin platform is opening the next frontier of agentic AI, with seven new chips now in full production. They are: the NVIDIA Vera CPU, ... The post Nvidia announces seven Vera Rubin chips in volume production appeared first on Electronics Weekly.
Step-by-step application of AI in EDA. The post How AI Will Automate Chip Design appeared first on Semiconductor Engineering.
Embedding AI agents to improve productivity without sacrificing reliability. The post Human-Centered Agentic AI Workflows For RTL Verification appeared first on Semiconductor Engineering.
A new technical paper, “Oxide induced degradation in MoS2 field-effect transistors,” was published by researchers at imec and ETH Zurich. Abstract excerpt “Transition Metal Dichalcogenides (TMDC) are promising candidates for future scaled transistor channels but their performance is often degraded by imperfections such as the interface with amorphous gate oxides....
Photonics: Ski jump structure; on-chip nanolasers; neural networks. The post Research Bits: Mar. 17 appeared first on Semiconductor Engineering.
Industrial robotics leap into physical AI, empowering factories with real-time smarts. The post Industrial Robotics Drive Shift Toward Physical AI appeared first on EE Times.
The government announced today that it is to spend £2 billion on quantum computing research over the next four years. The Department of Science, Innovation and Technology says it is ... The post Government to spend £2bn on quantum computing appeared first on Electronics Weekly.
The memory shortage could last another four to five years, says the chairman of SK Group, Chey Tae-won. The supply of base wafers is lagging demand by more than 20%, ... The post Memory shortage to last 4-5 years says SK boss appeared first on Electronics Weekly.
Imec has launched a consortium with 26 European university groups that will work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and ... The post Imec launches university consortium appeared first on Electronics Weekly.
Following the 14% revenue decline between 2022 and 2024, telecom equipment investment conditions improved in 2025, says Dell’Oro. Telecon equipment revenues across the six programs tracked by Dell’Oro Group—Broadband Access, ... The post Two-year telecom drought ends with 2025 growth appeared first on Electronics Weekly.
Secure, reliable real-time data processing and transport solutions for next-generation physical AI applications, developed in collaboration with NVIDIA NVIDIA humanoid robotics solutions integrated into NXP’s safe, secure edge portfolio cut development costs and speed time to market First in a series of NXP’s foundational robotics solutions designed to accelerate physical...
Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform Geneva, March 16, 2026 – STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid...
Embedded World 2026 reveals rising AI integration challenges. The post Embedded World 2026 Confronts Mounting Integration Complexity appeared first on EE Times.
A new technical paper, “System-Technology Co-Optimization of Bitline Routing and Bonding Pathways in Monolithic 3D DRAM Architectures,” was published by researchers at Georgia Tech. Abstract “3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery,...
A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was published by researchers at RWTH Aachen University and RIF e.V. Abstract “Artificial intelligence (AI) has emerged as a pivotal technology for autonomous systems across various domains, but quality assurance remains challenging due to...
A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate (BER). Meeting stringent...
An archaic DieHard device has seemingly died hard; is hacking it to resurrect a portion of its original function a worthwhile endeavor? The post A battery charger that loudly hums: Dump it or just make it dumb? appeared first on EDN.
At the Japan Society of Applied Physics (JSAP) Spring Meeting 2026 at the Insitute of Science Tokyo (15-18 March), a research group from Nagoya University’s Center for Low-temperature Plasma Sciences, in collaboration with university spinout NU-Rei Co Ltd, is presenting six advances in the growth of gallium oxide (Ga2O3), which...
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has introduced the EPC91202 evaluation board, a complete three-phase brushless DC (BLDC) motor drive inverter designed to accelerate the...
ABLIC develops high-value-added analog semiconductors and has become a global leader in niche fields. Over the past few years, the company has laid the groundwork for business expansion through acquisitions and organizational restructuring. In 2026, ABLIC is poised to translate these efforts into a clear growth trajectory while accelerating business expansion in Europe and the United States. We spoke with Seiji Tanaka, Representative Director and President of ABLIC,...
The March 2026 Edition of EE Times Europe Magazine analyzes how AI is transforming factory automation and operations and reviews Europe's de-risking semiconductor strategy. The post EE Times Europe Magazine – March 2026 appeared first on EE Times.
A new technical paper, “Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems,” was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract “Rapid progress in generative AI has given rise to Compound AI systems – pipelines comprised of...
A new technical paper, “Revealing and Engineering Contact-Origin Noise in Ultrathin Tellurium Transistors,” was published by researchers at Pohang University of Science and Technology. Abstract “Tellurium (Te) has emerged as a promising p-type semiconductor for ultrathin electronics owing to its strong air stability, excellent hole transport, narrow bandgap, and BEOL-integration...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced sample availability of its first heterogeneously...
For fourth-quarter 2025, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $165m, down 9.4% on $182.1m a year ago but roughly flat on Q3/2025’s $165.9m...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced the first volume production orders by...
Synaptics is introducing its SYN765x single-chip device for using AI at the edge with smart IoT devices. It combines support for real-time intelligence with integrated Wi-Fi 7, aiming at battery-powered ... The post Synaptics SYN765x integrates Wi-Fi 7 and AI for smart devices appeared first on Electronics Weekly.
Jensen Huang was crowned 'The Inference King' with Groq-powered Rubin CPUs, unveiling dramatic architectural leaps at GTC this year. The post GTC 2026 Keynote: Long Live the Inference King appeared first on EE Times.
DigiKey has collaborated with STMicroelectronics and Ultra Librarian for a new version of the eDesignSuite tool. eDesignSuite This is a free no-license-required online design platform developed by ST. It aims ... The post DigiKey, ST, Ultra Librarian partner for eDesignSuite integration appeared first on Electronics Weekly.
Intel’s efforts in the phone business did not end well, but 21 years ago, the company’s mobile targets were ambitious: ‘Thecnext decade will see the way people interact with computers ... The post When Intel Was Bullish On Phones appeared first on Electronics Weekly.
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique...
WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration...
My podcast guest this week is Ferric CEO Noah Sturcken. Noah and I discuss how Ferric’s innovations—specifically their ferromagnetic materials and on-chip power converters—are addressing the critical power, efficiency, and integration hurdles facing today’s AI processors. We also explore how IVRs enable higher instantaneous power delivery, simplify board design, and...
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by...
Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots Infineon enables the key functional blocks...
Telink unveiled TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V, multi-protocol support including Bluetooth, Zigbee, Thread, Matter, 2.4GHz Proprietary, and automotive-grade AEC-Q100 certification for IoT applications. The post Telink TL322X+ML3228A Launched at Embedded World 2026 appeared first on EE Times.
A TLV431-based circuit solved LSI chip power-up failures by ensuring a sufficiently steep 5V rail rise time. The post Vcc delay appeared first on EDN.
An edge server and PLC controller for industrial automation, field comms and IoT edge applications by Sefra Labs are based on Raspberry Pi 4 and 5. The Strato Pi Plus ... The post Embedded: Raspberry Pi duo extends industrial IoT reach appeared first on Electronics Weekly.
SWISSto12, the Swiss manufacturer of satellite and payload systems, has officially opened its purpose-built assembly facility at company headquarters in Renens, Switzerland. The facility will support the industrial-scale production of ... The post SWISSto12 opens assembly facility for GEO satellites in Switzerland appeared first on Electronics Weekly.
The second part on GaN basics explains hybrid structures and RDS(on) penalty while proving further details on HEMTs and substrate choices. The post GaN fundamentals: Hybrid structures, HEMT, and substrate choices appeared first on EDN.
the most read stories on our website cover TI's 800V DC power architecture for AI data centers, a quantum‑centric supercomputing reference architecture and Honda cancelling EV models. The post Most Read – Honda cancels EVs, IBM quantum blueprint, Elon Musk fab appeared first on Electronics Weekly.
HENSOLDT of Taufkirchen near Munich, Germany (which develops sensor solutions, electronics and software for the air, land, sea, cyber and space domains) has signed a long-term supply agreement with United Monolithic Semiconductors GmbH (UMS, which designs and produces RF and millimeter-wave components and ICs at its facilities in Villebon sur...
The University of Warwick has secured new funding to boost the UK’s ability to test the reliability of advanced semiconductors used in electric vehicles, renewable energy, and other critical technologies...
The UK Semiconductor Centre (UKSC) has welcomed a new £6.6m investment from the UK Government Department for Science, Innovation and Technology (DSIT) to bolster the county’e core strengths in semiconductor innovation...
Blue Moon Metals Inc of Toronto, ON, Canada has agreed to acquire the Gage Project in Washington County, Southern Utah, USA, from a subsidiary of Liberty Gold Corp in exchange for 420,935 common shares of Blue Moon and a 2.0% net smelter return royalty (NSR) on certain concessions...
HBM4 deal; war's impact on supply chain; U.S. AI framework; GPU smuggling; restart of H200 processors for China; SK hynix's memory prediction; TFLN photonics deal; test and metrology platforms; NoC verification automation; Tesla probe; AI distillation attacks. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
Escalating Middle East war exposes critical vulnerabilities in the semiconductor supply chain, driving re-shoring and fragmenting the global supply chains. The post Middle East Conflict Is Rewiring Global Supply Chains appeared first on EE Times.
Imec has received the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. The tool gives imec’s partners early access to the next generation of ... The post Imec gets the world’s most advanced litho tool appeared first on Electronics Weekly.
Yesterday Japan’s Prime Minister Sanae Takaichi and Singapore’s Prime Minister Lawrence Wong (pictured) agreed to form a strategic partnership in trade, technology and defence. ‘We uphold the international order based ... The post Singapore and Japan agree wide-ranging partnership appeared first on Electronics Weekly.
The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The ... The post 76th ECTC appeared first on Electronics Weekly.
Datacentre capex increased 57% in 2025 as AI deployments, complemented by general infrastructure investments, accelerated, says Dell’Oro, which expects hyperscalers and AI model developers to sustain strong capex momentum in ... The post 2025 datacentre capex up 57% appeared first on Electronics Weekly.
Marcel Franz takes the lead role at the Stewart Blusson Quantum Matter Institute The post Canada’s QMI Drives Quantum Advances, Global Collaboration appeared first on EE Times.
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has released its Phase 18 Reliability Report, providing new insights into eGaN device reliability. ..
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has entered into separate, privately negotiated subscription agreements with investors pursuant to which it will place (i) $379m of its 3.5% convertible 1.5 lien senior secured notes due 2031 and (ii) 3,250,030...
A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage. The post Single-stage design removes 48-V bus in servers appeared first on EDN.
The ST64UWB family of ultra-wideband SoCs from ST provides increased range and processing capability for automotive applications. The post UWB SoCs extend ranging and radar performance appeared first on EDN.
Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers. The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.
AOS has introduced two MOSFETs—the 25 V AONC40212 and 80 V AONC68816—in 3.3×3.3 mm source-down DFN packages with double-side cooling. The post Double-side cooled MOSFETs reduce server heat appeared first on EDN.
Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI data centers. The post Buck ICs improve AI data center power appeared first on EDN.
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24V loads. Leveraging synchronous...
The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for...
LEUVEN (Belgium), MARCH 18, 2026— Today, imec, a world-leading research and innovation hub in advanced semiconductor technologies, announces the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. With this strategic milestone, imec reinforces its position as the industry’s launchpad into the...
Each year, the construction industry builds $2.1 trillion worth of structures in the U.S., and more than three-quarters of those projects face delays, according to the Associated General Contractors of America. One solution could be robots. Virginia Tech researchers, in collaboration with Procon Consulting, are developing a coordinated team of...
BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has partnered with US government relations, corporate advisory and public affairs firm Michael Best Strategies to enhance engagement with key decision...
Learn the importance of integrating digital isolators in smart home devices to ensure safety and reliability. The post Integrating Digital Isolators in Smart Home Devices appeared first on EE Times.
A cellular data service upgrade prompts new hardware acquisitions: four total devices. Smart or superfluous? Read on! The post Cellular hotspots: Multi-option evaluation thoughts appeared first on EDN.
There are many ways to categorize engineers—to “slice and dice” them, if you will. I’m speaking figuratively, of course (we don’t want anyone to get any unfortunate ideas…especially since… the incident). Just sticking to the electronics realm, we have analog and digital, hardware and software, those who simulate and those...
In booth 1637 at SATShow Week in the Walter E. Washington Convention Center in Washington DC (24–26 March), MACOM Technology Solutions Inc of Lowell, MA, USA is showcasing its latest RF and optoelectronics solutions for satellite communications (SATCOM) that can enable higher frequency bands, improved power efficiency and more scalable...
German startup Q.ANT reaches full production capacity as demand surges for energy-efficient photonic AI processors. The post Q.ANT Hits Full Production Capacity for Photonic AI Processors appeared first on EE Times.
Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — says that it has expanded its focus and readiness to support the rapidly evolving satellite communications (SatCom) market. With a portfolio spanning low-noise...
The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs worldwide. The post Scoping out the chiplet-based design flow appeared first on EDN.
Closing the gap between warpage simulation results and actual measurement data. The post Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages appeared first on Semiconductor Engineering.
High‑NA EUV's reduced field size is driving new innovation in optical proximity correction and mask synthesis. The post Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026 appeared first on Semiconductor Engineering.
Matching a simulated device to its real-world counterpart with sub-nanometer accuracy. The post Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles appeared first on Semiconductor Engineering.
Co-packaged optics face scaling challenges such as bandwidth density mismatches, assembly complexity, and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering.
Chips that didn’t need cooling may require it now. The post Liquid Cooling Drives Other Localized Cooling appeared first on Semiconductor Engineering.
Progress is steady, but fundamental questions remain. The post 2D Semiconductors Inch Forward appeared first on Semiconductor Engineering.
Using AI to transform semiconductor operations, which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering.
Eyelit Technologies of Holmdel, N.J, USA (which provides AI-powered optimized planning, scheduling and execution systems) says that its software solution suite has been selected by laser-based silicon carbide (SiC) wafering firm Halo Industries Inc of Santa Clara, CA, USA (a 2014 spin-out from Stanford University) to support its rapidly scaling...
External AC/DC power converters are replacing internal units for safety, flexibility, and size. The post AC/DC Converters Are Coming Out of Their Host’s Box appeared first on EE Times.
NVIDIA of Santa Clara, CA, USA and STMicroelectronics of Geneva, Switzerland is presenting two new delivery boards for 800VDC architectures...
Infineon Technologies AG of Munich, Germany has introduced two new high-voltage intermediate bus converter (HV IBC) reference designs to help customers accelerate the transition to AI server power architectures powered by ±400V and 800V DC. Enabled by Infineon’s 650V CoolGaN switches, the designs target hyperscalers, power architects, and server OEMs...
Electronics companies should be prepared to prove real sustainability by 2026 with verified data. The post The Electronics Industry Prepares for ‘Verified Sustainability’ in 2026 appeared first on EE Times.
Automated test equipment and advanced robotics provider Teradyne Inc of North Reading, MA, USA has launched the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing...
Enabling IoT LPWAN scalability and security for future connectivity with NB-IoT, LTE-M, eREDCAP, and upcoming 6G networks. The post One Billion Cellular IoT LPWAN Connections appeared first on EE Times.
A single resistor linearizes the LMC555 timer's current-controlled oscillator, correcting internal delays across a five-decade range. The post Improve 555 frequency linearity appeared first on EDN.
Japan-based ROHM has released, via its website, the reference designs REF68005, REF68006 and REF68004 for three-phase inverter circuits featuring EcoSiC-brand silicon carbide (SiC) molded modules HSDIP20, DOT-247 and TRCDRIVE pack. Designers can use the data provided in the reference designs to create the drive circuit boards. When combined with ROHM's...
POET Technologies Inc of Toronto, Ontario, Canada –– which designs and implementats highly integrated optical engines and light sources for artificial intelligence networks –– has announced a strategic collaboration with optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan. The partnership aims to co-develop next-generation optical communication modules built...
In booth 1401 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA is highlighting the breadth and scalability of its indium phosphide (InP) innovations, showcasing a broad portfolio of...
In booth #1439 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) is showcasing technology and demonstrating...
In booth #1439 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) has announced an optical interconnect...
As AI moves from pilot projects to factory-wide deployment, GlobalFoundries’ VP of digital manufacturing explains in an exclusive interview how to decide what truly scales across global fabs. The post How GlobalFoundries Takes AI from Pilot to Global Scale appeared first on EE Times.
When a bathroom scale gives you multiple different weight-measurement results, is it cheating if you pick the lowest outcome? The post A scale that tells inconsistent-weight tales appeared first on EDN.
Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — and Wiwynn Corp of Taipei, Taiwan, a cloud IT infrastructure provider for data centers, have announced a strategic partnership to deliver optically connected, rack-scale AI systems...
The Eclipse Foundation announced updates to the Open VSX Registry, its vendor-neutral extension registry for tools built on the VS Code extension API. The registry is used in AI-enabled and ... The post Embedded: Security-infrastructure updates for Open VSX Registry appeared first on Electronics Weekly.
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced continued progress in its ecosystem partnership with...
U.K. photonics startups surge with investment and patents. The post U.K. Photonics: Innovation, Investment, and the IP Landscape appeared first on EE Times.
It will be fascinating to see which GPS alternatives, if any, take a dominant role in non-GPS settings, or will it be a balanced fusion? The post GPS-free systems to spur highly advanced sensors, fusion appeared first on EDN.
China’s dancing, jumping, performing humanoid robots are fun but useless, said TSMC CEO C C Wei (pictured) when accepting a doctorate from Asia University at the weekend. “It’s useless — ... The post China dancing robots useless appeared first on Electronics Weekly.
Sansung plans to invest $73 billion this year to keep up with TSMC in the chip business. TSMC expects to spend $52-56 billion on capex and $7 billion on R&D ... The post Samsung to spend $73bn on chip capex and R&D appeared first on Electronics Weekly.
PC units will fall 11.3% this year and tablet units will fall 7.6%, says the IDC Worldwide Quarterly Personal Computing Device Tracker. These reductions are driven by memory shortages, rising ... The post 2026 PC units down 11.3%, tablet units down 7.9%, but revenues up appeared first on Electronics Weekly....
Global foundry revenue is projected to grow 24.8% YoY to approximately $218.8 billion, with TSMC expected to post the largest increase of around 32% YoY, says TrendForce. Demand for advanced ... The post Foundry revenues to grow 24.8% appeared first on Electronics Weekly.
Mouser is sponsoring the Create the Future Design Contest. which challenges engineers and innovators to design the next great thing, with a chance to win the grand prize of $25,000. ... The post Create The Future Design Challenge appeared first on Electronics Weekly.
The great thing about being a Cabinet Minister is being ahead of the game, so the government’s announcement of a couple of billion quid for quantum computing came as no ... The post Ed Seeks The Solace Of Quantum appeared first on Electronics Weekly.
A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract “The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and...
A new technical paper, “Quantifying the Global Impact of Constraint Programming Based Local Scheduling in Semiconductor Manufacturing,” was published by Infineon and the University of Klagenfurt. Abstract “The efficiency of semiconductor frontend manufacturing highly depends on the optimization of resource allocation. In academic works, scheduling methods, i.e., based on Constraint...
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) demonstrated how its solutions...
The European Space Agency (ESA) has selected OHB Sweden to build 20 small satellites for the EUMETSAT Polar System – Sterna (EPS‑Sterna) constellation. EUMETSAT is the European Organisation for the ... The post ESA awards OHB Sweden the EPS‑Sterna constellation contract appeared first on Electronics Weekly.
Toshiba’s TPHR6704RL is a 40V, 0.67mΩ N-channel MOSFET aiming yo to improve efficiency for industrial power supplies. It uses U-MOS11-H technology, highlights Toshiba, to deliver ultra-low on-resistance, fast switching and ... The post Toshiba’s TPHR6704RL targets industrial switched-mode power supplies appeared first on Electronics Weekly.
The trend toward SDV has significant implications for automotive exterior lighting. ROHM is addressing these challenges with its new driver ICs. The post Next-generation LED Drivers for Exterior Lighting in the SDV appeared first on EE Times.
Oxford, UK, March 31st, 2026: EnSilica, a leading maker of mixed-signal ASICs, has been selected to join the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the UK Department for Science, Innovation & Technology (DSIT). CHERI (Capability Hardware Enhanced RISC Instructions) is a processor technology that...
President Trump’s leadership skills, and mental and physical fitness score reasonably well on a survey of Americans published by Pew Research Center. However, his ability to pick good advisers, respect ... The post President Trump appeared first on Electronics Weekly.
Geneva, Switzerland, March 31, 2026 — STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance and small die size. The devices target space-constrained applications including power distribution and battery management in automotive products. The first device in the new...
The US is the largest recorded music market in the world, accounting for more than 3 in 10 paid streams globally last year, says Luminate, making it the largest premium ... The post Where The Music Plays appeared first on Electronics Weekly.
The tie-up could bolster Japan’s global semiconductor footprint and address fragmented IC markets. The post Rohm Joins Toshiba and Mitsubishi to Create a Power Chip Titan appeared first on EE Times.
The annual Applied Power Electronics Conference & Exposition (APEC 2026) showcases hundreds of companies that exhibit their latest component andContinue Reading The post APEC 2026 showcases advances in power electronics appeared first on EDN.
Combining a VBE-referenced current source with a current mirror to implement a simple two-terminal, fully floating LED current sink or source The post A fully floating BJT-based LED current driver appeared first on EDN.
To understand what's really happening, we need to look at the full system, specifically total cost of ownership of an AI inference deployment. The post The truth about AI inference costs: Why cost-per-token isn’t what it seems appeared first on EDN.
Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) has received a new volume order from one of its major hyperscale customers for 800G single-mode data-center transceivers to...
When I was 10 years old, my parents decided I was old enough and responsible enough to catch the bus to school (silly parents). This was in England in the 1960s. We didn’t have dedicated school buses (unlike the bodacious yellow beauties in America); instead, we used standard buses with...
The date is fast approaching for the Women Leaders In Electronics Awards 2026 in central London: Wednesday 29 April, at One Moorgate Place. It’s time to secure your seat at ... The post Secure your seat at the Women Leaders In Electronics Awards 2026 appeared first on Electronics Weekly.
As collaborative robots (cobots) are increasingly deployed alongside human operators, their system architectures continue to evolve toward higher integration, reduced size and greater modularity. These trends place growing demands on ... The post Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems appeared first on Electronics Weekly.
Tria Technologies, the embedded compute board specialist, is expanding operating system support across its Qualcomm-based hardware. Yocto Linux, Windows 11 IoT, and Android are all now available, it announces. Android ... The post Tria Technologies extends multi-OS support for Qualcomm hardware appeared first on Electronics Weekly.
2D hard mask material; defect identification; extreme photonic packaging. The post Research Bits: Mar. 31 appeared first on Semiconductor Engineering.
Edge, in-sensor AI processors; TMDC-based transistors; DRAM read disturbance threshold; replay-based validation for chiplets; LLM-specific algorithmic attacks; noise in tellurium transistors; FMEDA safety metrics; HW reverse engineering; slowdowns in multi-GPU LLM inference. The post Chip Industry Technical Paper Roundup: Mar. 31 appeared first on Semiconductor Engineering.
Emergence AI launches Bengaluru research hub to build reliable, autonomous AI for mission-critical sectors. The post U.S. Startup Emergence AI Opens Research Hub in Bengaluru appeared first on EE Times.
Mistral AI, the French AI developer, says it has taken on debt of $830 million to run a datacentre. The datacentre, at Bruyeres-le-Chatel near Paris, is used to train of ... The post Mistral raises $830m appeared first on Electronics Weekly.
OQ Technology, a Luxembourg-based satellite operator pioneering 5G Non-Terrestrial Network (NTN) connectivity through its direct-to-device (D2D) global satellite network, has launched two satellites – ERMIS-1 and ERMIS-2 – aboard SpaceX’s ... The post Greeks launch satellites for D2D comms appeared first on Electronics Weekly.
A new technical paper, “Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor,” was published by Teikyo University and RIKEN. Abstract “We theoretically investigated the readout process of a spin–qubit structure based on a gate-all-around (GAA) transistor. Our study focuses on a logical qubit composed of two physical...
Musk unveils TeraFab, aiming to disrupt chipmaking with AI-driven, human-free fabs. The post TeraFab: What If It Is Done Differently? appeared first on EE Times.
Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centers. The TDM24745T is a new OptiMOS™ quad‑phase power module designed to meet the...
Toshiba Corp of Kawasaki, Japan has signed a memorandum of understanding (MoU) to start discussions regarding a business integration of the semiconductor business of its subsidiary Toshiba Electronic Devices & Storage Corp (TDSC), the semiconductor business of ROHM Co Ltd, and the power device business of Mitsubishi Electric Corp. The...
The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of the most critical applications of robots is material handling, where grippers are used to move objects, such as automotive parts, logistics packages, food ingredients, and...
KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields. This sensor is a Type-II superlattice (T2SL) infrared sensor with over 1 million pixels, capable of detecting both...
Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module), providing a drop-in, pin-compatible upgrade for the QSMP-15 that now features an industrial-grade STM32MP2 MPU. The QSMP-20 also takes advantage of lower cost DDR3 RAM with shorter...
RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition targets engineers developing high-reliability power systems where component qualification is a formal requirement—giving them a path to AEC-Q compliance without rebuilding their qualification process from...
Kista, Sweden – March 30, 2026 – Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced general availability of its 7-15GHz DaybreakTM beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defense arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network...
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers...
How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running. The post TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive appeared first on EDN.
California DMV reports AVs with permits drove over 9 million miles in 2025. The post Waymo Dominates California AV Test Data appeared first on EE Times.
NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation. The post Radar transceiver scales for automated driving appeared first on EDN.
A half-wave LLC (HWLLC) platform from Renesas includes four controller ICs rated for up to 500 W for high-speed chargers. The post HWLLC topology pushes fast charging to 500 W appeared first on EDN.
QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. The post SiC modules raise power density for AI servers appeared first on EDN.
The SAM9X75D5M from Microchip is a hybrid SiP integrating an 800-MHz ARM926EJ-S 32-bit processor with 512 Mbits of DDR2 SDRAM. The post Automotive HMI SiP packs MPU and DDR2 memory appeared first on EDN.
Semtech’s TDS5311P circuit protection device delivers near-constant clamping voltage for 48-V USB PD EPR applications. The post FET-based clamp protects 48-V USB PD EPR lines appeared first on EDN.
Simulation: Reality is in the interaction. The post The system architect’s sketchbook: Inside the simulation appeared first on EDN.
The EXPRESS program, a five-year, £10.4m UK Engineering and Physical Sciences Research Council (EPSRC)-funded project led by the University of Warwick and University of Southampton, is to support the development of next-generation transistor and optoelectronic devices...
As Brussels sharpens its de-risking agenda, analysts warn that the real test of Europe’s chip ambitions may come from market economics, not geopolitics. The post Europe’s Semiconductor Strategy Meets Market Reality appeared first on EE Times.
Scaling logic continues to deliver better performance per watt, but it's becoming harder, more expensive, and increasingly customized. The post Challenges In Scaling Chips To 2nm And Below appeared first on Semiconductor Engineering.
Any software that claims to be independent from hardware is inefficient, bloated software. The time for such software development is over. The post All Software Is Hardware-Dependent appeared first on Semiconductor Engineering.
A new technical paper, “Quantifying Uncertainty in FMEDA Safety Metrics: An Error Propagation Approach for Enhanced ASIC Verification,” was published by Robert Bosch GmbH. Abstract “Accurate and reliable safety metrics are paramount for functional safety verification of ASICs in automotive systems. Traditional FMEDA (Failure Modes, Effects, and Diagnostic Analysis) metrics,...
A new technical paper, “SoK: From Silicon to Netlist and Beyond Two Decades of Hardware Reverse Engineering Research,” was published by the Ruhr University Bochum and the Max Planck Institute for Security and Privacy. Abstract “As hardware serves as the root of trust in modern computing systems, Hardware Reverse Engineering...
A new technical paper, “Characterizing CPU-Induced Slowdowns in Multi-GPU LLM Inference,” was published by the Georgia Institute of Technology. Abstract “Large-scale machine learning workloads increasingly rely on multi-GPU systems, yet their performance is often limited by an overlooked component: the CPU. Through a detailed study of modern large language model...
The South Korean fabless startup reports accelerating global adoption of its DX-M1 AI chip across eight countries and seven application domains — and is now using Embedded World 2026 as the launchpad for its European commercial push. The post DEEPX Sets New Pace in Physical AI Commercialization—27 Global Deals in...
Discover which tech sectors absorb soaring memory prices and who cracks first in the new elasticity-driven supercycle. The post Who Breaks First in the Memory Supercycle? appeared first on EE Times.
AI is rapidly reshaping semiconductor defect detection, but not along a single trajectory. The post Why AI in Semiconductor Inspection Is Becoming a Two-Layer Game appeared first on EE Times.
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has completed its private placements (announced on 19 March) of...
Arm unleashes its first silicon AGI CPU to power agentic AI in data centers, challenging x86 rivals. The post Arm Launches First Silicon CPU, Targets Data Center Agentic AI Workloads appeared first on EE Times.
Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) plans to establish a new US manufacturing facility in Greensboro, North Carolina. The 240,000ft2 facility will produce indium phosphide (InP)-based optical devices that serve as critical...
To strengthen its global competitiveness, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany is to build a new manufacturing facility in Malaysia in order to tap into the fast growing semiconductor equipment ecosystem in South East Asia...
Polar Light Technologies AB — which stems from research by founder professor Per-Olof Holtz and his team at Linköping University (with support from Sweden’s innovation agency Vinnova) — has been awarded a European Union (EU) Eurostars grant.With a total budget of €1.1m, the 18-month project ‘2ndGenMicroLED’ aims to deliver the...
Taiwan Semiconductor Co Ltd (TSC) of New Taipei City, Taiwan — which supplies discrete power electronics devices, LED drivers, analog ICs, transient voltage suppressor (TVS), and electrostatic discharge (ESD) protection — has added to its growing series of automotive-grade 1200V-rated silicon carbide (SiC) Schottky diodes with 1A and 2A models....
Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has released the GRF2118, an ultra-low-noise X-band amplifier delivering what is claimed to be best-in-class noise figure performance across the 6.0–8.5GHz band. Targeting...
At the Bharat Electricity Summit (BES 2026) in Yashobhoomi, New Delhi (19–21 March), Infineon Technologies AG of Munich, Germany announced a strategic technology partnership with Zenergize, an emerging Indian company designing and manufacturing AI-integrated power electronics hardware for the solar, EV charging, and renewable energy sectors. Infineon has had a...
Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) has introduced a flyback topology that extends the power range of flyback converters to 440W — well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback...
In booth #1753 at the Applied Power Electronics Conference (APEC 2026) at the Henry B. Gonzalez Convention Center in San Antonio, Texas, USA (22–25 March), Toshiba America Electronic Components Inc – the North American semiconductor and storage business of Tokyo-based semiconductor maker Toshiba Corp – is highlighting its latest power...
Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...
OXIDE Corp of Yamanashi, Japan (which specializes in optical crystals and frequency-conversion technology) and Finland-based laser developer and manufacturer Vexlum (which was spun off from Tampere University of Technology’s Optoelectronics Research Centre in 2017) have officially entered into a strategic partnership agreement. The collaboration focuses on the development and manufacturing...
k-Space Associates Inc of Dexter, MI, USA — which produces thin-film metrology instrumentation and software — says that Dylan James Scientific (DJS) will serve as its new sales representative for Europe...
In booth #1935 at the IEEE Applied Power Electronics Conference (APEC 2026) in San Antonio, TX, USA (22–26 March), Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications —...
SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has launched the QSiC Dual3, a family of 1200V half-bridge MOSFET modules for motor drives in data-center cooling systems, grid converters in energy...
Renesas Electronics Corp of Tokyo, Japan has expanded its suite of AC/DC and power adapter solutions with a new gallium nitride (GaN)-based half-wave LLC (HWLLC) platform that supports 500W-or-higher operation across IoT, industrial and infrastructure systems...
Two TVS diode series from Littelfuse provide DO-160 Level 5 lightning protection for avionics, military, and other mission-critical systems. The post Lightning-resistant TVS diodes safeguard avionics appeared first on EDN.
Infineon’s TDM24745T quad-phase power module with TLVR magnetics provides high current density for AI workloads. The post TLVR power module supplies 320 A for AI processors appeared first on EDN.
Diodes has added a 100-V MOSFET to its lineup of 40-V to 80-V devices, all in 8×8-mm gullwing-leaded packages for automotive systems. The post MOSFET ensures automotive thermal reliability appeared first on EDN.
The 40 LHE linear position sensor from Vishay measures strokes from 0 to 40 mm with ±1% full-stroke accuracy. The post High-res linear sensor tracks small displacements appeared first on EDN.
Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices. The post Isolated DC/DC modules raise power density appeared first on EDN.
Q. With the increasing reliance on digital infrastructure, how is the UAE addressing digital sovereignty to protect its critical assets and data from external threats? Lt. Colonel Saeed M. Al Shebli: Digital sovereignty, in my view, is no longer a technical concept; it’s a cornerstone of national independence and strategic stability....
Anush Elangovan is taking on CUDA, one 'ROCm Sucks' tweet at a time. The post Taking on CUDA With ROCm: ‘One Step After Another’ appeared first on EE Times.
EPC Space LLC of Andover, MA, USA (which provides high-reliability radiation-hardened enhancement-mode gallium nitride-on-silicon discrete transistors, ICs and modular devices for power management in space and other harsh environments) has announced two new additions to its family of demonstration and evaluation boards supporting applications including half-bridge connected point-of-load (POL) converter...
Taipei, Taiwan (April 1, 2026) – ASRock Industrial today announced a collaboration with Collaborative Systems Integration (CSI), both members of the Open Process Automation Forum (OPAF) and the Coalition of Open Process Automation (COPA), to validate standards-based Open Process Automation Standard (O-PAS™) systems management architecture. Aligned with the O-PAS™ Standard, the...
Geneva, Switzerland, April 1, 2026 — STMicroelectronics has announced two new high-speed half-bridge gate drivers that bring gallium-nitride (GaN) efficiency, thermal performance, and miniaturization to a broad range of power and motion-control applications. The STDRIVEG212 and STDRIVEG612 deliver tightly controlled 5V gate-drive signals to enhanced-mode GaN HEMTs, powered from a high-side voltage up to 220V...
April 1, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new PIC32CM PL10 low-power Arm® Cortex®-M0+ based microcontrollers (MCUs) from Microchip Technologies. The PIC32CM PL10 series offers a balanced combination of performance, power efficiency, and peripherals for industrial, smart building, consumer, and sensor-based applications. The Microchip Technologies PIC32CM...
MALVERN, Pa. — April 1, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade photovoltaic MOSFET driver that is the first such device in the compact SMD-4 package to provide a creepage distance of 8 mm and mold compound with a comparative tracking index (CTI) of 600....
Tokyo, Japan, 1 April 2026 – eSOL, a leading developer of real-time embedded software solutions, will officially launch the industry’s first ever real-time 3D engine known as eXRP™ which has been enhanced for industrial use. eXRP™ is powered by the open source Godot game engine. eXRP is a real-time 3D engine...
NUBURU Inc of Centennial, CO, USA (a dual-use defense & security platform company focused on non-kinetic effects, directed-energy technologies, and software-orchestrated defense systems) says that its subsidiary Lyocon S.r.l. (an Italian laser-technology company specializing in the design, manufacturing and integration of high-power blue laser systems for industrial applications) has secured...
Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches ... The post Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs appeared first on Electronics Weekly.
Privacy and security concerns are expected to drive more on-premises AI workloads, bringing sensitive IP onto desktops. The post Micron Readies Client Storage for AI appeared first on EE Times.
50% of the countries that allow same-sex marriage are in Western Europe. Cuba and Mexico legalised same-sex marriage in 2022, Chile in 2021, Ecuador in 2019 and Costa Rica in ... The post Same-Sex Marriage appeared first on Electronics Weekly.
March 31, 2026 [New Albany, IN] — Samtec, Inc., the service leader in the connector industry, now offers in-house Upscreen Testing services to meet the highest levels of reliability assurance required for mission-critical applications. This new service is primarily designed for military and aerospace customers, and the testing is specifically designed...
March 31, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new PIC32CM PL10 low-power Arm® Cortex®-M0+ based microcontrollers (MCUs) from Microchip Technologies. The PIC32CM PL10 series offers a balanced combination of performance, power efficiency, and peripherals...
The most effective electronics manufacturers manage increasing complexity by building workflows and systems that scale with the business. The post How Small Electronics Manufacturers Manage Operational Complexity appeared first on EE Times.
Silvaco Group Inc of Santa Clara, CA, USA — which provides AI-enabled technology computer-aided design (TCAD), electronic design automation (EDA) software and semiconductor intellectual property (SIP) for process and device development — has announced an expanded strategic partnership with Taiwan-based silicon and silicon carbide power device developer and and manufacturer...
An LM555 timer paired with an NTC thermistor makes a simple, configurable ON/OFF thermostat for heating or cooling. The post LM555 begets basic bang bang thermostat appeared first on EDN.
When hardware plays offensive, even a ball needs architecture. The post The system architect’s sketchbook: The football has main character energy appeared first on EDN.
Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape. The post Alibaba Launches XuanTie C950 CPU for Agentic AI appeared first on EE Times.
Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in our ... The post EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult appeared first on Electronics Weekly.
Let our content come straight to you! Easily digestible newsletter emails straight to your inbox. And all the newsletters are mobile optimised. The post Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form appeared first on Electronics Weekly.
Four million Raspberry Pis were shipped in H2 2025, and a total of 7.6 million for FY 2025, up 9% over FY 2024. Revenue was $323 million – up 25% ... The post 2025 Raspberry Pi revenues up 25% YoY appeared first on Electronics Weekly.
Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received an initial order from a major new customer that is “a global leader in networking products and solutions” and a “major supplier to the data-center optical transceiver market”. The customer is developing advanced...
Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity. The post What is the EDA problem worth solving with AI? appeared first on EDN.
Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, ... The post Molex buys Smiths Interconnect appeared first on Electronics Weekly.
To help drive forward its goal of unlocking the full potential of the UK semiconductor industry, the UK Semiconductor Centre (UKSC) has appointed Martin O’Sullivan as director of investment and Steve Taylor as director of strategic marketing...
How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support certification, and ensure your silicon meets its security requirements from day one. The post Secure at First Silicon: Reducing Cost and Risk appeared first on Semiconductor Engineering.
How physical AI systems combine sensors, edge processing, and connectivity to enable real-time, intelligent decision-making directly on devices like robots and smart edge systems. The post Enabling Physical AI and Robotics: Platform for the Intelligent Edge appeared first on Semiconductor Engineering.
A road-vehicle standard-based unified AI safety lifecycle and blueprint for integrating both robustness and resilience into AI systems deployed in safety-critical domains. The post Ensuring Trustworthiness of AI-Enhanced Embedded Systems appeared first on Semiconductor Engineering.
How a next‑gen SRAM compiler IP for TSMC N5A and N3A helps design teams with measurable gains in PPA, reliability, and system robustness. The post Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs appeared first on Semiconductor Engineering.
Key considerations for secure AI, along with limitations and recommendations to overcome the limitations for secure AI deployments. The post Hardware Deployment for Secure AI Using Confidential Computing appeared first on Semiconductor Engineering.
A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications. The post Radar SLAM Application on Vision DSPs based on Novel IO-ICP appeared first on Semiconductor Engineering.
Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering.
Full automation is still a goal, but humans will still be in the loop for the foreseeable future. The post AI’s Potential And Limitations In Chip Design appeared first on Semiconductor Engineering.
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. The post Preparing For The Multiphysics Future of 3D ICs appeared first on Semiconductor Engineering.
Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ... The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.
Semiconductor industry capex was $166 billion in 2025, up 7% YoY, says Semiconductor Intelligence (SI). SI estimates 2026 capex will be $200 billion, up 20% from 2025. TSMC was the ... The post 2026 semiconductor capex to increase 20% YoY appeared first on Electronics Weekly.
IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the ... The post NIST develops high temperature photonics packaging appeared first on Electronics Weekly.
Notebook shipments are set to fall 14.8% YoY, says TrendForce. Further price hikes are expected in the coming quarters. A tight memory supply continues to push up system costs, while ... The post Notebook shipments to fall 14.8% appeared first on Electronics Weekly.
Arm’s new AGI CPU signals a bold move into the $100B AI silicon market, balancing high-performance orchestration for agentic AI. The post AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees appeared first on EE Times.
Metallium Ltd of Subiaco, Western Australia, says that its US subsidiary Flash Metals USA Inc of Houston, TX, USA has executed a long-term offtake agreement with materials refiner and manufacturer Indium Corp of Clinton, NY, USA, covering the supply of gallium (Ga), germanium (Ge) and other critical metals recovered using...
A new technical paper, “Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis,” was published by the University of Florida. Abstract “Analog-mixed-signal (AMS) circuits are highly non-linear and operate on continuous real-world signals, making them far more difficult to model with data-driven AI than digital blocks. To close the...
For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month
22 years ago people were concerned about the damage mobile phones would do to their ears, In 2004, the UK’s National Radiological Protection Board (NRPB) said that Swedish research indicating ... The post Phones & Tumours appeared first on Electronics Weekly.
Chandler, Ariz., April 2, 2026 – VIAVI Solutions Inc. (VIAVI) (NASDAQ: VIAV) today announced its partnership with satellite communications and positioning solutions provider Ground Control to integrate its Secure µPNT™ STL-1000 into the RockFLEET Assured asset tracking and assured navigation solution. In today’s contested global environment, resilient Position, Navigation and Timing (PNT) capabilities are crucial to safeguard critical...
In this week’s Fish Fry, I’m excited to welcome back Rob Knoth from Cadence Design Systems! Rob and I dive into a major shift in electronic design automation: the direct integration of artificial intelligence into the design workflow. Rob and I discuss the details of Cadence’s newest innovation – the...
Fairport, NY. Saelig Company, Inc. has introduced the Aim-TTi ADM1055 DMM, a next‑generation 5½‑digit bench multimeter engineered to deliver the measurement accuracy, flexible functionality, and seamless integration needed for development labs, production test environments, and educational establishments. The ADM1055 provides 0.02% basic DC accuracy, the precision needed for tasks such as device characterization, troubleshooting and...
Phoenix, AZ – March 31, 2026. DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced the availability of its Deos™ multi-core real-time operating system for the NXP S32G family of network application processors with verification evidence to DO-178C Design Assurance Level A (DAL...
Digital methods including oversampling, harmonic injection, and feedforward control reduce THD and improve power factor in PFC designs. The post How to design a digital-controlled PFC, Part 3 appeared first on EDN.
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has launched a new generation of 100V integrated GaN power-stage ICs (EPC23108, EPC23109, EPC23110 and EPC23111) targeting high-performance motion...
Hardware shortages are stimulating the AI chip counterfeit market. Experts believe a hardware root of trust could alleviate authenticity and security challenges. The post Hardware Root of Trust Essential for AI Chip Integrity appeared first on EE Times.
The Melexis MLX80339 fan driver is designed to produce efficient, low-noise motor control. Featuring pre-validated logic configurable via an intuitive interface, the code-free MLX80339 enables rapid deployment of BLDC motor ... The post Melexis fan driver enables code-free, three-phase fan design appeared first on Electronics Weekly.
Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...
Samsung says it has opened a foundry service for photonic integrated circuits (PICs) integrating modulators, waveguides, photodiodes and memory and has a PDK currently available for potential customers.. The company ... The post Samsung Foundry opens for photonics orders appeared first on Electronics Weekly.
In 2025, the total revenue of the top 10 fabless IC design houses grew 44% to $359.4 billion, says TrendForce. .Nvidia kept the No.1 slot with Broadcom and Qualcomm third. ... The post Top Ten Fabless Grew 44% In 2025 appeared first on Electronics Weekly.
Mouser has expanded its Autonomous Vehicle (AV) resource centre focused on the system architectures and design constraints shaping production-ready autonomy. The hub examines how sensing, in-vehicle networking, and vehicle-to-everything (V2X) ... The post Mouser expands Autonomous Vehicle resource centre appeared first on Electronics Weekly.
element14, has launched INSPIRE HER FUTURE, a global celebration recognizing women driving progress across science, technology, engineering and mathematics. Women are building, testing, teaching and advancing technology worldwide, yet many ... The post element14 launches Inspire Her Future appeared first on Electronics Weekly.
ST’s STPMIC1L and STPMIC2L PMICs help designers leverage its Arm CortexA-based MPUs in industrial applications. Tailored for the 32-bit STM32MP1x and 64-bit STM32MP2x series, the new PMICs deliver cost-effective power ... The post PMICs for ST Cortex-A MPUs appeared first on Electronics Weekly.
Consensual same‑sex relations remain criminalized in a number of countries, with some prescribing the death penalty, according to ILGA — the International Lesbian, Gay, Bisexual, Trans and Intersex Association. Over ... The post Where Homosexuality Is Illegal appeared first on Electronics Weekly.
Why transatlantic execution, not transatlantic symbolism, now matters to the electronics and semiconductor supply chain. The post From MOUs to Markets: Transatlantic Deals Face Reality Test appeared first on EE Times.
Düsseldorf, April 2, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in...
April 2, 2026 – Enschede, The Netherlands – QuiX Quantum, a leading provider of photonic quantum computing hardware, today announced it has demonstrated “below threshold” error mitigation for the first time on a photonic quantum computer, suppressing physical qubit errors to the level compatible with scalable, fault‑tolerant quantum computing. The achievement also...
RIVERSIDE, Calif., April 2, 2026 – Bourns today announced the SRP2008DP Series, its new line of high current shielded power inductors designed for high current applications that need to push the limits of board-space efficiency. Constructed with a metal-alloy powder core and packaged in a low-profile 0.8 mm footprint, the SRP2008DP Series delivers...
April 2, 2026 SANTA ROSA, Calif. – Keysight Technologies, Inc. (NYSE: KEYS) today announced Keysight Assembly, a new virtual process simulation solution designed to help manufacturers identify assembly issues earlier in development, before they become costly production problems. Late-stage assembly failures are an expensive problem in automotive and industrial manufacturing....
California & Chennai (March 31, 2026): e-con Systems®, a global leader in embedded vision solutions, launches STURDeCAM57, a 5MP global shutter RGB-IR GMSL2 camera designed to deliver reliable, context-rich vision from day to night for applications such as Driver Monitoring Systems (DMS) and Occupant Monitoring Systems (OMS). This new RGB-IR...
CHANDLER, Ariz., April 2, 2026 — As connected systems spread across residential, industrial and commercial environments, the need for independently verified cybersecurity assurance is becoming a core requirement. To help address this demand, Microchip Technology (Nasdaq: MCHP) has been certified by UL Solutions to the IEC 62443‑4‑1 Maturity Level 2 (ML2) Industrial Automation and...
A CEO who led his company into the then biggest ever US bankruptcy with investor losses of $180 billion, used two main techniques to ruin his company. In the accounts ... The post Fable: The Deceiver appeared first on Electronics Weekly.
Samtec is offering in-house upscreen testing services for mission-critical applications. This new service is primarily designed for military and aerospace customers, and the testing is specifically designed for customers using ... The post Samtec offers upscreen testing service appeared first on Electronics Weekly.
ISO/PAS 8800, focused on safety of AI applications in road vehicles, can also serve engineers in medical, industrial, rail, and defense. The post Why ISO/PAS 8800 is the new blueprint for AI safety in all critical industries appeared first on EDN.
Why does one battery in a battery pack always seem to drain faster than others? How does this outcome affect both its siblings? Read on. The post Single-battery failures in multi-battery arrangements: diagnosing selective cell derangements appeared first on EDN.
Rambus launches 16 GT/s HBM4E controller for AI and HPC, pushing 4 TB/s bandwidth per stack. The post Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E appeared first on EE Times.
Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA says that its hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430kW liquid-cooled string energy storage systems (ESS) and 320kW utility-scale solar inverter. The design win builds upon the long-standing collaboration between onsemi and Sineng...
AI may not solve the telecom industry’s revenue dilemma overnight, but it offers a credible path from infrastructure investment to tangible growth. The post Bell Called Watson; Today, We Call AI appeared first on EE Times.
Security must be addressed at the platform level to ensure every security-relevant chiplet has an identity that can be consistently validated. The post Developing A Security Framework For Chiplet-Based Systems appeared first on Semiconductor Engineering.
Managing power, heat, and complexity for reliability and performance. The post Automated Multiphysics For Successful 3D-IC Design appeared first on Semiconductor Engineering.
A focus on DRAM and NAND is squeezing NOR wafer capacity and backend test resources. The post AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability appeared first on Semiconductor Engineering.
Maliciously injected content can result in the transmission of sensitive user data to attacker-controlled endpoints. The post Agent Card Poisoning: A Metadata Injection Vulnerability In The Systems Using Google A2A Protocol appeared first on Semiconductor Engineering.
Securing data in a way that preserves the predictable timing behavior required for AI-driven systems. The post World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security appeared first on Semiconductor Engineering.
Why smarter charging, battery management, and power conversion are now the real differentiators in EVs and edge systems. The post Moving Electrons, Not Just Vehicles appeared first on Semiconductor Engineering.
A new embedded memory architecture with a three-transistor cell. The post Reinventing Embedded Memory: Solving The SRAM Scaling Wall appeared first on Semiconductor Engineering.
Post-quantum cryptography emerges as top concern, followed by AI and automotive complexity. The post IC Security Threats Spike With Quantum, AI, And Automotive appeared first on Semiconductor Engineering.
Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety critical operation, and the foundations of hardware security. The post The One Bit Problem That Can Break a System appeared first on Semiconductor Engineering.
A new technical paper, “Assertain: Automated Security Assertion Generation Using Large Language Models,” was published by University of Florida. Abstract “The increasing complexity of modern system-on-chip designs amplifies hardware security risks and makes manual security property specification a major bottleneck in formal property verification. This paper presents Assertain, an automated...
Discover how 75-year-old holography tech could finally unlock true AR smart glasses. The post Why Today’s AR Displays Fall Short and a 75-Year-Old Idea May Help appeared first on EE Times.