All News

Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026

High‑NA EUV's reduced field size is driving new innovation in optical proximity correction and mask synthesis. The post Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026 appeared first on Semiconductor Engineering.

Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles

Matching a simulated device to its real-world counterpart with sub-nanometer accuracy. The post Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles appeared first on Semiconductor Engineering.

Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration

Co-packaged optics face scaling challenges such as bandwidth density mismatches, assembly complexity, and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering.

Liquid Cooling Drives Other Localized Cooling

Chips that didn’t need cooling may require it now. The post Liquid Cooling Drives Other Localized Cooling appeared first on Semiconductor Engineering.

2D Semiconductors Inch Forward

Progress is steady, but fundamental questions remain. The post 2D Semiconductors Inch Forward appeared first on Semiconductor Engineering.

Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026

Using AI to transform semiconductor operations, which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering.

From Packets to Light Paths: OCS Reshaping AI Data Center Architecture at OFC 2026

Original Article By SemiVision Research [Reading time: 25 mins]

Daily: Samsung may shift to multi-year contract

4.5 min read.

What Illness Does Taiwan Really Have? A Structural Reflection on Dutch Disease, China Disease, and Taiwan Disease

Original Article By SemiVision Research [Reading time: 10 mins]

R&S and Realtek Validate First Test Setup for BLE High Data Throughput

Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature that can enable verification of data rates up to 7.5 Mbps.

Halo selects Eyelit to power scalable SiC wafering production with composable MES

Eyelit Technologies of Holmdel, N.J, USA (which provides AI-powered optimized planning, scheduling and execution systems) says that its software solution suite has been selected by laser-based silicon carbide (SiC) wafering firm Halo Industries Inc of Santa Clara, CA, USA (a 2014 spin-out from Stanford University) to support its rapidly scaling...

AC/DC Converters Are Coming Out of Their Host’s Box

External AC/DC power converters are replacing internal units for safety, flexibility, and size. The post AC/DC Converters Are Coming Out of Their Host’s Box appeared first on EE Times.

NVIDIA and ST present new delivery boards for 800VDC architectures

NVIDIA of Santa Clara, CA, USA and STMicroelectronics of Geneva, Switzerland is presenting two new delivery boards for 800VDC architectures...

Infineon introduces CoolGaN-based high-voltage intermediate bus converter reference designs

Infineon Technologies AG of Munich, Germany has introduced two new high-voltage intermediate bus converter (HV IBC) reference designs to help customers accelerate the transition to AI server power architectures powered by ±400V and 800V DC. Enabled by Infineon’s 650V CoolGaN switches, the designs target hyperscalers, power architects, and server OEMs...

Metalor Technologies Completes Acquisition of Gannon & Scott

Metalor Technologies announced today that, following approval by the relevant regulatory authorities, it has completed the previously announced acquisition of Gannon & Scott. As a result, Gannon & Scott is now a wholly owned subsidiary of Metalor Technologies and part of the TANAKA group. The completion of this transaction brings...

ENIAC, the First General-Purpose Digital Computer, Turns 80

Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...

Constructing a Solar-Powered Snake Robot

Learn how to create a batteryless crawling robot using basic electronic components and a 3D-printed chassis.

The Electronics Industry Prepares for ‘Verified Sustainability’ in 2026

Electronics companies should be prepared to prove real sustainability by 2026 with verified data. The post The Electronics Industry Prepares for ‘Verified Sustainability’ in 2026 appeared first on EE Times.

Beyond GTC: A Deep Dive into Compute, LPX, and the Untold Story of SpecDec

Analyzing the CPU, GPU, and LPU chip ratios unveiled at the Nvidia GTC keynote, the impact of the Groq LPX chip on disaggregated decoding, and its potential for speculative decoding in AI inference

The Open Agentic AI World According To Nvidia