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United States Patent and Trademark Office (USPTO) is requesting input from interested parties on the World Intellectual Property Organisation (WIPO) Riyadh Design Law Treaty (RDLT), adopted by WIPO member states ... The post USPTO seeks input on WIPO Riyadh Design Law Treaty (RDLT) appeared first on Electronics Weekly.

Electronics Weekly

Ethernet takes two thirds of datacentre switch sales

Mar 16, 2026

Ethernet switch sales in AI back-end networks more than tripled and accounted for more than two-thirds of datacentre switch sales in AI clusters during 2025, says Dell’Oro. “The growing size ... The post Ethernet takes two thirds of datacentre switch sales appeared first on Electronics Weekly.

Chip Briefing

Weekly: Industry bottlenecks

Mar 16, 2026

16 min read.

SemiVision

OFC Preview: The Race to 400G per Lane: EML, Silicon Photonics, and TFLN Compete

Mar 16, 2026

Original Article By SemiVision Research [Reading time: 20 mins]

Chip Briefing

Daily: ByteDance uses Blackwell chips

Mar 16, 2026

5.5 min read.

Electronics Weekly

Ed’s Brainy Scam

Mar 16, 2026

I am putting it about that the NBT in computing is not quantum but biocomputing -.computers made using human brain cells or rather artificial brain cells grown in laboratories, Ed ... The post Ed’s Brainy Scam appeared first on Electronics Weekly.

Electronics Weekly

CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin.

Mar 16, 2026

The post CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin. appeared first on Electronics Weekly.

SemiWiki

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

Mar 16, 2026

In the realm of extreme ultraviolet (EUV) lithography, metal oxide resists (MORs) have emerged as promising candidates for advanced semiconductor patterning. However, their stability poses challenges, particularly interactions with clean-room environments like humidity and airborne molecular contaminants (AMCs) … Read More The post Unraveling Dose Reduction in Metal Oxide Resists...

SemiWiki

CEO Interview with Dr. Mohammad Rastegari of Elastix.AI

Mar 16, 2026

Mohammad Rastegari is a prominent AI researcher and entrepreneur currently serving as the CEO and Co-Founder of Elastix.AI. Based in the Greater Seattle Area, he also holds the position of Affiliate Assistant Professor at the University of Washington’s Electrical & Computer Engineering Department. His professional… Read More The post CEO...

All About Circuits

Understanding the Exclusive-OR Phase Detector

Mar 15, 2026

This article explores the operation of the simplest digital phase detector: the exclusive-OR (XOR) gate.

SemiWiki

Tesla and Samsung Relationship Update

Mar 15, 2026

The majority of my 40+ year career has been spent managing the relationship between leading-edge semiconductor design and manufacture, working with just about every commercial foundry and top customer in one way or another. It’s my thing—it fascinates me. I’m also a fan of disruption, and the latest disruptions the...

3D InCites

VIEW Micro Metrology: Point of View at Device Packaging 2026

Mar 14, 2026

A Commitment to the Next Generation The event opened with a comprehensive series of Professional Development Courses, followed by the inaugural Student-Industry “Classroom to Career” session. This interactive session featured insightful career‑focused presentations from iMAPS President Dan Krueger and Director Scott Hayes, Arizona State University student Pallavi Jithendrriyan, and industry...

SemiVision

Four Strategic Plays in AI Optical Interconnect Supercycle: From InP Substrates to Optical Switching

Mar 14, 2026

Original Article By SemiVision Research [Reading time: 20 mins]

EE Times

IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes

Mar 14, 2026

IBM and Lam Research have a five-year agreement focused on developing new materials and fabrication processes. The post IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes appeared first on EE Times.

Electronics Weekly

Gadget Book: The Ghidra Book for reverse engineering

Mar 13, 2026

I knew nothing about Ghidra, but learning it's about reverse-engineering (disassemblers and decompilers) made me think I could include this one in the virtual Gadget Master library. It's The Ghidra Book, The Definitive Guide. The post Gadget Book: The Ghidra Book for reverse engineering appeared first on Electronics Weekly.

Semiconductor Today

IFW Dresden selects Agnitron Agilis 100 MOCVD platform for precursor chemistry and ultra-wide-bandgap materials development

Mar 13, 2026

Agnitron Technology Inc of Chanhassen, MN, USA says that its Agilis 100 MOCVD system has been selected by the Institute for Materials Chemistry (IMC) at the Leibniz Institute for Solid State and Materials Research (IFW) Dresden, Germany, for its MOCVD and ALD Competence Centre...

IEEE Spectrum Semiconductors

Video Friday: These Robots Were Born to Run

Mar 13, 2026

Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNAEnjoy today’s videos! All legged robots...

Semiconductor Today

TNO and High Tech Campus Eindhoven begin construction of first 6-inch indium phosphide photonic chip foundry

Mar 13, 2026

The research institute TNO (the Netherlands Organization for Applied Scientific Research in Delft) and High Tech Campus Eindhoven are starting construction of what is reckoned will be the world’s first foundry for producing indium phosphide photonic chips on 6-inch wafers. The official opening was attended by European Commission executive vice-president...

EE Times

Embedded World 2026 Wrap: Key Highlights

Mar 13, 2026

Discover the biggest trends in physical AI and robotics from Embedded World 2026. The post Embedded World 2026 Wrap: Key Highlights appeared first on EE Times.

All About Circuits

Texas Instruments TMS1000: When Control Logic Fit on One Chip

Mar 13, 2026

Introduced in 1974, the TMS1000 family combined CPU, ROM, RAM, and I/O on a single die and established the commercial template for the microcontroller.

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Hot Topics

USPTO seeks input on WIPO Riyadh Design Law Treaty (RDLT)

Ethernet takes two thirds of datacentre switch sales

Weekly: Industry bottlenecks

OFC Preview: The Race to 400G per Lane: EML, Silicon Photonics, and TFLN Compete

Daily: ByteDance uses Blackwell chips

Ed’s Brainy Scam

CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin.

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

CEO Interview with Dr. Mohammad Rastegari of Elastix.AI

Understanding the Exclusive-OR Phase Detector

Tesla and Samsung Relationship Update

VIEW Micro Metrology: Point of View at Device Packaging 2026

Four Strategic Plays in AI Optical Interconnect Supercycle: From InP Substrates to Optical Switching

IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes

Gadget Book: The Ghidra Book for reverse engineering

IFW Dresden selects Agnitron Agilis 100 MOCVD platform for precursor chemistry and ultra-wide-bandgap materials development

Video Friday: These Robots Were Born to Run

TNO and High Tech Campus Eindhoven begin construction of first 6-inch indium phosphide photonic chip foundry

Embedded World 2026 Wrap: Key Highlights

Texas Instruments TMS1000: When Control Logic Fit on One Chip