Archive

Older articles from the semiconductor industry

March 2026

Mar 05 Ultra Ethernet Security (UET‑TSS) Tailored For AI And HPC Semiconductor Engineering

Mar 05 25G Ethernet: Scaling Data Movement For ADAS, Industry 4.0, And 5G Systems Semiconductor Engineering

Mar 05 Across The Vast Reaches Of The 3D Stack: Mastering ESD Verification In Advanced Semiconductor Design Semiconductor Engineering

Mar 05 Power, Not Area: Why Edge GPU Design Is Entering A New Era Semiconductor Engineering

Mar 05 Auto Security Accelerates With Standardization And Certified Silicon Semiconductor Engineering

Mar 05 Limiting AI/ML Tools To Ensure Physical AI Safety, Security Semiconductor Engineering

Mar 05 The New Design Advantage: Why Unifying Processing And Connectivity Simplifies The Design Experience Semiconductor Engineering

Mar 05 New Automotive Architectures Are Shaking Up Processor And Memory Choices Semiconductor Engineering

Mar 05 Edge And Micro Data Centers: Powering The Real-Time Digital World Semiconductor Engineering

Mar 05 Learnings From The Polish Energy Sector Attacks Semiconductor Engineering

Mar 05 Exclusive: Allen Wu on Disrupting $100M Cost of Building Custom AI Chips EE Times

Mar 05 Corporate debt nears $60 trillion says OECD report Electronics Weekly

Mar 05 NLM Photonics sampling 1.6T and 3.2T silicon-organic hybrid (SOH) photonic ICs Electronics Weekly

Mar 05 1nm gate-length ferroelectric transistor operates at 0.6V Electronics Weekly

Mar 05 EV sales growth to slow from 26% YoY last year to 14% YoY this year Electronics Weekly

Mar 05 Q1 NAND price up 85-90% Electronics Weekly

Mar 05 Taiwan Is Not Just TSMC: The UMC Story You Need to Know SemiVision

Mar 05 Sorry Strait Electronics Weekly

Mar 05 Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC All About Circuits

Mar 05 Taiwan Builds the Future EE Times

Mar 05 Ayar Labs Gets $500 Million To Ramp Photonics Into 2028 AI Systems The Next Platform

Mar 05 CoolSem establishes Advisory Board to advance wafer-level thermal management Semiconductor Today

Mar 05 MWC 2026: Apple, Google, Samsung and Other Contending Contestants EDN

Mar 05 TASKING Unveils Industry’s First End-to-End Compile, Debug and Test Toolchain for Renesas RH850 Microcontrollers, including New RH850/U2C Series EE Journal

Mar 05 Grinn Collaborates with Renesas to Launch Grinn ReneSOM-V2H EE Journal

Mar 05 Solid Sands highlights Continuous Qualification for safety-critical toolchains at embedded world 2026 EE Journal

Mar 05 Mouser’s Autonomous Vehicle Online Resource Center Addresses Real-World Deployment Challenges EE Journal

Mar 05 Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications EE Journal

Mar 05 Functional Safety Analysis of Electronic Systems SemiWiki

Mar 05 Build Your Own Clock With Analog Dials, Part 2 All About Circuits

Mar 04 This Student-Built EV Focuses on Repairability IEEE Spectrum Semiconductors

Mar 04 RVA23 Ends Speculation’s Monopoly in RISC-V CPUs SemiWiki

Mar 04 Taara Brings Fiber-Optic Speeds to Open-Air Laser Links IEEE Spectrum Semiconductors

Mar 04 Infineon’s ModusToolbox™ Power Suite accelerates the development of power conversion solutions with PSOC™ Control C3 MCUs EE Journal

Mar 04 Nvidia's Groq Plot Thickens The Chip Letter

Mar 04 Infineon’s first MOTIX™ motor control System-in-Package with integrated MCU and power stage enables designs smaller than a postage stamp EE Journal

Mar 04 Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers EE Journal

Mar 04 STMicroelectronics’ sensor and secure wireless technologies support Snapdragon Wear Elite EE Journal

Mar 04 Daily: Samsung, SK Hynix stocks plummet Chip Briefing

Mar 04 Perforce and Siemens Collaborate on 3DIC Design at the Chiplet Summit SemiWiki

Mar 04 Behind Micron’s New 256GB LPDRAM: A Culture of Co-Design With Customers EE Times

Mar 04 Blue Moon to acquire Apex germanium and gallium mine from Teck Semiconductor Today

Mar 04 Stretching a bit EDN

Mar 04 EV design: The truth about 400-V to 800-V battery transition EDN

Mar 04 Micro-LED co-packaged optics cut power consumption to just 5% that of copper cables Semiconductor Today

Mar 04 GTC 2026 Preview | Implications of Nvidia's SRAM-Decode Hardware on the Inference Market Vik's Newsletter

Mar 04 Circuits Integrated launches Ka-band integrated switch power amplifiers Semiconductor Today

Mar 04 Full-Service Foundry: accelerate your analog mixed-signal prototyping with the 2026 MPW calendar AnySilicon

Mar 04 UCSB’s Steven DenBaars receives Optica’s 2026 Nick Holonyak Jr Award Semiconductor Today

Mar 04 CEO Talk: Uttam Singhal of SignOff Semiconductors AnySilicon

Mar 04 At MWC, Qualcomm Outlines AI-Native 6G Vision EE Times

Mar 04 AI Networking Arms Race Heats Up: 800G Today, 1.6T Tomorrow SemiVision

Mar 04 NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge All About Circuits

Mar 04 Broadcom Makes Lasers? Chipstrat

Mar 04 Space Forge announces completion of UK Space Agency-funded National Microgravity Research Centre Semiconductor Today

Mar 04 This Offshore Wind Turbine Will House a Data Center Underwater IEEE Spectrum Semiconductors

Mar 04 United Semiconductors reserves payload space with Starlab to advance commercial-scale in-space semiconductor manufacturing Semiconductor Today

Mar 04 Countdown to IEEE’s Annual Election IEEE Spectrum Semiconductors

Mar 04 Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems SemiWiki

Mar 04 MIPS, GlobalFoundries Bet on Physical AI EE Times

Mar 04 Menlo Micro Announces Configurable Switch for Semiconductor Testing All About Circuits

Mar 03 CHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety SemiWiki

Mar 03 Are AI Datacenters Increasing Electric Bills for American Households? SemiAnalysis

Mar 03 Custom design PWM filters easily EDN

Mar 03 NVIDIA announces strategic partnership with Lumentum to develop data-center optics Semiconductor Today

Mar 03 With Cisco Outshift, Agentic AI Is Teed Up For the Internet Of Cognition The Next Platform

Mar 03 Optimizing a Battery Electric Vehicle Thermal Management System IEEE Spectrum Semiconductors

Mar 03 Inside IISc Bangalore’s CeNSE Lab: From Wafer to Finished Device EE Times

Mar 03 Plant pulse sensors: From soil probes to tree tattoos EDN

Mar 03 Rio Tinto to progress gallium R&D project by constructing pilot plant in Québec Semiconductor Today

Mar 03 Soitec and NTU Singapore reporting results of research program into 6G connectivity Semiconductor Today

Mar 03 Daily: US considers H200 sales cap Chip Briefing

Mar 03 Taiwan vs. U.S. Workplace Culture: Why the Same Playbook Breaks Down in Phoenix—and How to Fix It SemiVision

Mar 03 New Automotive ICs Cover Signal Integrity, Power Density, & Integration All About Circuits

Mar 03 Nvidia Sees The Light On Silicon Photonics And Maybe Optical Switching The Next Platform

Mar 03 Veeco books multi-system Lumina and Spector orders for InP datacom laser manufacturing Semiconductor Today

Mar 03 Axelera Raises $250M in Largest EU Semi Round Ever EE Times

Mar 03 Watershed Moment for AI–Human Collaboration in Math IEEE Spectrum Semiconductors

Mar 03 Google Moonshot Company Taara Debuts ‘Radical’ Silicon Photonics Platform All About Circuits

Mar 02 ams OSRAM completes sale of Entertainment & Industry Lamps business to Ushio for €114m Semiconductor Today

Mar 02 First Solar’s US GDP contribution to grow from $5.8bn in 2025 to $7.8bn in 2027 Semiconductor Today

Mar 02 EPC highlights Gen 7 GaN for AI infrastructure and GaN ICs for robotics at APEC Semiconductor Today

Mar 02 Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates SemiWiki

Mar 02 Lumentum and the Laser Bottleneck Chipstrat

Mar 02 A defunct Amazon Echo: Where did its acumen go? EDN

Mar 02 Another Quantum Topic: Quantum Communication SemiWiki

Mar 02 How Electrical Engineers Fight a War IEEE Spectrum Semiconductors

Mar 02 Vicinity Technologies Unveils 6G-Ready SDR Platforms for Drones and Autonomous Systems at MWC 2026 EE Times

Mar 02 A Half-Century Odyssey in Semiconductors: Kinam Kim's Samsung Journey of Innovation and Insight SemiVision

Mar 02 A Pattern Of Failure Electronics Weekly

Mar 02 How Quantum Data Can Teach AI to Do Better Chemistry IEEE Spectrum Semiconductors

Mar 02 Nvidia Sells Arm Shares, Signals Realignment of AI Portfolio EE Times

Mar 02 What Military Drones Can Teach Self-Driving Cars IEEE Spectrum Semiconductors

Mar 02 Rohm licenses TSMC GaN process technology Electronics Weekly

Mar 02 Jedec updates Universal Flash Storage for faster edge AI Electronics Weekly

Mar 02 Navitas exhibiting solutions for AI data-center, grid and energy infrastructure, performance computing, and industrial electrification Semiconductor Today

Mar 02 OpenAI completes $110bn funding round Electronics Weekly

Mar 02 Nokia Bets the Network on Nvidia in AI and 6G Pivot EE Times

Mar 02 MWC: Ericsson and Intel join for 6G AI-RAN Electronics Weekly

Mar 02 MWC: Telecom companies and Nvidia pursue AI-RAN in 6G Electronics Weekly

Mar 02 High margins and low volumes Electronics Weekly

Mar 02 Siemens Digital launches agentic toolkit Electronics Weekly

Mar 02 Amphenol RF adds single-crimp N-Type connectors Electronics Weekly

Mar 02 Nordic reference design integrates Aliro and Matter Electronics Weekly

Mar 02 Daily: DeepSeek's latest built on Chinese chips Chip Briefing

Mar 02 Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability SemiWiki

Mar 02 CEO Interview with Echo Yang of CSCERAMIC SemiWiki

Mar 02 Week 9, 2026 The Semiconductor Newsletter

Mar 02 IEEE President’s Note: Engineering a Modern Renaissance IEEE Spectrum Semiconductors

Mar 02 Using Gilbert Multipliers as Phase Detectors in PLLs All About Circuits

Mar 01 Latest issue of Semiconductor Today now available Semiconductor Today

Mar 01 Strengthening Semiconductor Obsolescence Management Through Traceability EE Times

Mar 01 Multi-Location Inventory Management for Electronics Manufacturers EE Times

Mar 01 Letting Machines Decide What Matters IEEE Spectrum Semiconductors

Mar 01 Optimal Heterogeneous Memory Configs for AI Tasks Under Specified Performance Metrics (Stanford, UCSC) Semiconductor Engineering

Mar 01 A GPU Microarchitecture Optimized for Fully Homomorphic Encryption Semiconductor Engineering

Mar 01 AI Servers Finally Dominate Dell’s Systems Business The Next Platform

Mar 01 Xiangyi Cheng Is Bringing AR to Classrooms and Hospitals IEEE Spectrum Semiconductors

February 2026

Feb 28 This Power Grid Pioneer’s EV Prediction Came 100 Years Too Soon IEEE Spectrum Semiconductors

Feb 28 How RFID Labels Could Help Tackle $540B Food Waste Losses in 2026 EE Times

Feb 28 GTC 2026 Outlook: How NVIDIA Is Redefining AI Infrastructure with LPX, CPO, and Rubin SemiVision

Feb 28 Video Friday: Robot Dogs Haul Produce From the Field IEEE Spectrum Semiconductors

Feb 28 Taiwan’s Tech Industry EE Times

Feb 27 VAST Data: What Controls The Data Is More Important Than What Stores It The Next Platform

Feb 27 NATO Innovation Fund leads £30m funding for SatVu thermal intelligence Electronics Weekly

Feb 27 Finding Something to Bitch About Semiconductor Business Intelligence

Feb 27 Siemens Accelerates Integrated Circuit Design and Verification with Agentic AI in Questa One 3D InCites

Feb 27 From AI’s Origins to Smart Devices: Selecting the Right Devices for Smart Deployment EE Times

Feb 27 Inside the 7400-Series Era of Digital Logic All About Circuits

Feb 27 Infineon adds to CoolGaN Drive HB 600V G5 product family Semiconductor Today

Feb 27 🍪 TWiC: AMD+Meta, New AI Chips, Citrini Vik's Newsletter

Feb 27 UCSB’s James Buckwalter inducted as senior member of the US National Academy of Inventors Semiconductor Today

Feb 27 EPL – Always The Bridesmaid Never The Bride Electronics Weekly

Feb 27 From High‑Mix Production to Humanoids: Robotiq’s Push for Accessible Automation EE Journal

Feb 27 Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput EE Journal

Feb 27 ASRock Industrial’s Secure Edge AIoT Solutions Take Center Stage at Embedded World 2026 EE Journal

Feb 27 Memory Matters: Signals from the 2025 NVM Survey SemiWiki

Feb 27 USB-C and Power Delivery: Too much of a good thing? EDN

Feb 27 Bond Strength, Biocompatibility, and Beyond IEEE Spectrum Semiconductors

Feb 27 Rohm fits HPLF5060 package for automotive, low-voltage MOSFETs Electronics Weekly

Feb 27 Most Read – UFS 5.0 NAND, Taiwan exports, ASML 1000W light source Electronics Weekly

Feb 27 ROHM licenses TSMC’s GaN processs technology for Hamamatsu fab Semiconductor Today

Feb 27 MWC 2026: Telecom High-Stakes Bet on the ‘IQ Era’ EE Times

Feb 27 Intel Foundry’s Kevin O’Buckley joins Qualcomm Electronics Weekly

Feb 27 Chip Industry Week In Review Semiconductor Engineering

Feb 27 London to be OpenAI’s largest research hub outside US Electronics Weekly

Feb 27 Tensor Robocar hooks up with Arm Electronics Weekly

Feb 27 Lane Motorsport signs Axon Cable Electronics Weekly

Feb 27 Semiconductor Intelligence forecasts 30% semi growth this year Electronics Weekly

Feb 27 Smartphone market to fall 13% Electronics Weekly

Feb 27 Weekly: Taiwanese fabs, American fabs Chip Briefing

Feb 27 Daily: Meta-Google's multi-billion dollar deal Chip Briefing

Feb 27 Europeans Dominate Winter Olympics Electronics Weekly

Feb 27 Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller All About Circuits

Feb 27 So Far, Nobody Turns Tokens Into Money Like Nvidia The Next Platform

Feb 27 AI Drives Strong Semiconductor Market in 2025-2026 SemiWiki

Feb 27 This Startup Makes Access to Rehabilitation Facilities Easier IEEE Spectrum Semiconductors

Feb 27 An FPGA-based Accelerator Addressing Bottlenecks in GNN Preprocessing (KAIST et al.) Semiconductor Engineering

Feb 27 How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI SemiWiki

Feb 27 SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026 All About Circuits

Feb 26 Scope boosts high-speed interface validation EDN

Feb 26 GaN half-bridge simplifies 650-V power stages EDN

Feb 26 Low-loss MLCCs deliver wideband RF performance EDN

Feb 26 3-in-1 IoT module cuts complexity EDN

Feb 26 5G RedCap module enables high-speed IoT connectivity EDN

Feb 26 New Path to Battery-Grade Lithium Uses Electrochemistry IEEE Spectrum Semiconductors

Feb 26 CMOS-Compatible Approach to Extending the Spectral Response of Oxide Semiconductors Semiconductor Engineering

Feb 26 CSconnected announces £1m final call for Supply Chain Development Programme Semiconductor Today

Feb 26 Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V Cores SemiWiki

Feb 26 Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion EE Journal

Feb 26 From Headsets to Hearing Aids IEEE Spectrum Semiconductors

Feb 26 Fable: Hottie Totty Electronics Weekly

Feb 26 Sequans Demonstrates Market Leadership with Breakthrough 5G eRedCap and RF Technologies at MWC 2026 EE Journal

Feb 26 Salience Labs and Tower Semiconductor Partner to Manufacture At-Scale Optical Circuit Switches for Next-Generation Data Centers EE Journal

Feb 26 An AI-Native Architecture That Eliminates GPU Inefficiencies SemiWiki

Feb 26 How Stupid Would It Be to Put Data Centers in Space? IEEE Spectrum Semiconductors

Feb 26 GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology EE Times

Feb 26 Hearing is Believing: The Unsuspected Key to Smart Glasses Innovation EE Times

Feb 26 Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications EE Journal

Feb 26 SambaNova Abandons Intel Acquisition, Raises Funding Instead EE Times

Feb 26 2026 NVIDIA: 6 Chips for the Next Generation of AI Data Centers SemiVision

Feb 26 Jumping the Jeep: An alternative cost-effective solar cell example app EDN

Feb 26 Power Tips #150: Overcoming high-voltage monitoring challenges in gigawatt-scale data centers EDN

Feb 26 Well, Fork Me with a Dining Philosophers Problem (or The Best Way to Debug Embedded Systems) EE Journal

Feb 26 Portsmouth Uni, SARsatX developing Earth Observation mission Electronics Weekly

Feb 26 Variable‑reluctance sensors: From fundamentals to speed sensing EDN

Feb 26 Achieving Micron-Level Tolerances: CAD Optimization for Sub-10µm 3D Printing IEEE Spectrum Semiconductors

Feb 26 EW BrightSparks 2025 profile: Harry Hale, Leonardo Electronics Weekly

Feb 26 What caught your eye? (Neuromorphic processing, London robotaxis, TeenTech) Electronics Weekly

Feb 26 CHIIPS #27 – Power semiconductors from Alex Lidow of EPC Electronics Weekly

Feb 26 How IP Subsystems For Chiplets Will Unlock Your Next Wave Of Innovation Semiconductor Engineering

Feb 26 AI Energy Gap And Chiplets: Why Data Movement Matters Semiconductor Engineering

Feb 26 Using Data And AI More Effectively In EDA Semiconductor Engineering

Feb 26 AI Starting To Simplify Design Of Programmable Logic Semiconductor Engineering

Feb 26 An Integrated Workflow For Circuit Design, Simulation, And Functional Safety Analysis Semiconductor Engineering

Feb 26 Verifying Scale-Up And Scale-Out In Data Centers Semiconductor Engineering

Feb 26 Data Center Digital Twins: How Simulation Improves Design And Performance Semiconductor Engineering

Feb 26 Startup Wants to Speed Up Chip Design With AI in RTL to GDSII Path EE Times

Feb 26 2026 NVIDIA Silicon Photonics 3D Stacking and DWDM Half-Rate Optical Link Technology SemiVision

Feb 26 Nvidia Q4 sales up 73% YoY profit up 94% YoY Electronics Weekly

Feb 26 Arm and Linaro launch CoreCollective Electronics Weekly

Feb 26 Gas control speeds EUV wafer throughput Electronics Weekly

Feb 26 Microwave transmission equipment market consolidates as revenues stay flat Electronics Weekly

Feb 26 Qorvo BAWplexer delivers deep skirts Electronics Weekly

Feb 26 Daily: Nvidia earnings meet muted response Chip Briefing

Feb 26 Nvidia-based PCs Electronics Weekly

Feb 26 Build Your Own Clock With Analog Dials, Part 1 All About Circuits

Feb 26 Big changes taking shape at IBM Bromont 3D InCites

Feb 26 SambaNova Pits Its Engineering Against Nvidia For Agentic AI The Next Platform

Feb 26 First Solar licenses Oxford PV’s patents for US markets Semiconductor Today

Feb 26 Ascent Solar’s PV blankets to power NOVI AI Pathfinder spacecraft Semiconductor Today

Feb 26 Vera Rubin – Extreme Co-Design: An Evolution from Grace Blackwell Oberon SemiAnalysis

Feb 26 Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security SemiWiki

Feb 25 How to Thrive as a Remote Worker IEEE Spectrum Semiconductors

Feb 25 ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing All About Circuits

Feb 25 Samtec Interconnects Selected for VITA 90 VNX+ EE Journal

Feb 25 Lightrun Launches Industry’s First AI SRE With Live Dynamic Runtime Context EE Journal

Feb 25 Junkosha expands high-frequency test leadership with new 0.5 psec skew matching solutions at DesignCon EE Journal

Feb 25 DigiKey Spotlights New Products at Embedded World 2026 EE Journal

Feb 25 SiMa.ai and STIGA S.p.A. Announce Strategic Partnership in Physical AI EE Journal

Feb 25 TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive EE Journal

Feb 25 Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering SemiWiki

Feb 25 AI Is Acing Math Exams Faster Than Scientists Write Them IEEE Spectrum Semiconductors

Feb 25 Jimi Hendrix Was a Systems Engineer IEEE Spectrum Semiconductors

Feb 25 Photons as a Service Chipstrat

Feb 25 TELUS Digital showcases AI transformation in telecom: Unlocking value with innovative use cases at Mobile World Congress 2026 EE Journal

Feb 25 High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer EE Journal

Feb 25 Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification EE Journal

Feb 25 AMD and Meta Announce Expanded Strategic Partnership to Deploy 6 Gigawatts of AMD GPUs EE Journal

Feb 25 An Agentic Formal Verifier. Innovation in Verification SemiWiki

Feb 25 Integrating eFPGA for Hybrid Signal Processing Architectures EE Times

Feb 25 Exploring the Next-Gen of Network Communication EE Times

Feb 25 Supply Chain Leaders See Agentic AI Curbing Entry-Level Hiring EE Times

Feb 25 An LM317-based 0-20mA to 4-20mA 2-wire converter EDN

Feb 25 TeenTech charity partners for Women Leaders in Electronics Awards Electronics Weekly

Feb 25 CRCW0201-AT e3 resistors feature miniature footprint Electronics Weekly

Feb 25 EPC adds 3-phase BLDC motor drive inverter evaluation board for humanoid robot joint applications Semiconductor Today

Feb 25 The Memory Supercycle: How Allocation Is Creating New Infrastructure Bottlenecks EE Times

Feb 25 New Era of On-device AI Driven by High-speed UFS 5.0 Storage EE Times

Feb 25 40 PCB Design Tips Every Designer Should Know: eBook Semiconductor Engineering

Feb 25 Back-End Automation Tackles Growing Complexity Semiconductor Engineering

Feb 25 What Designers Need to Know About UALink for Scalable AI Systems Semiconductor Engineering

Feb 25 Blog Review: Feb. 25 Semiconductor Engineering

Feb 25 Purpose-Built Tools for Connected Design Semiconductor Engineering

Feb 25 Wayve raises $1.5bn to roll out robotaxis in London Electronics Weekly

Feb 25 Meta agrees to spend $60bn on AMD GPUs in next five years Electronics Weekly

Feb 25 Security/Surveillance Challenge for engineers and makers Electronics Weekly

Feb 25 Kioxia sampling UFS 5.0 NAND Electronics Weekly

Feb 25 Ireland offers Master’s degree in IC design Electronics Weekly

Feb 25 Daily: Meta-AMD's multi-billion dollar deal Chip Briefing

Feb 25 Workplace Death and Disease Electronics Weekly

Feb 25 The Silent Engine of the AI Revolution: How "SiliconMotion" Smart Storage is Powering the Future SemiVision

Feb 25 Ten Most Highly Valued Private AI Companies Electronics Weekly

Feb 25 India AI Impact Summit: From IT Services to Sovereign AI and Silicon EE Times

Feb 25 Survey of DL-Based LiDAR Super-Resolution For Autonomous Driving (University College London) Semiconductor Engineering

Feb 25 Renesas Looks to the Future of Automotive With New Memory and SoC Tech All About Circuits

Feb 25 UV LED prices rising by 5% in Q1 due to increased material and labor costs Semiconductor Today

Feb 25 They Create Momentum AnySilicon

Feb 25 This Physics Professor Credits Collaboration for Her Success IEEE Spectrum Semiconductors

Feb 25 Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026 EE Journal

Feb 25 Deepgram and IBM Introduce Advanced Voice Capabilities for Enterprise AI EE Journal

Feb 25 STMicroelectronics’ new MasterGaN power ICs combine flexibility with advanced GaN technology EE Journal

Feb 25 TASKING Integrates Modern AI Technology to Enable Robust Software Verification and Validation (V&V) EE Journal

Feb 25 Reimagining Compute in the Age of Dispersed Intelligence SemiWiki

Feb 25 New Materials Target Interconnect Performance and On-Chip Photonics All About Circuits

Feb 24 PLS’ UDE 2026 now also enables debugging of highly efficient embedded AI accelerators EE Journal

Feb 24 Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026 EE Journal

Feb 24 Some More Game Theory, This Time On The AMD-Meta Platforms Deal The Next Platform

Feb 24 Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.) Semiconductor Engineering

Feb 24 Siemens to Deliver Industry-Leading PCB Test Engineering Solutions SemiWiki

Feb 24 Raspberry Pi Flash Drive writes as fast as USB 3.0 will go Electronics Weekly

Feb 24 Your Watch Will One Day Track Blood Pressure IEEE Spectrum Semiconductors

Feb 24 Agentic EDA Panel Review Suggests Promise and Near-Term Guidance SemiWiki

Feb 24 Compound semiconductor materials market growing at 14% CAGR to almost $5.2bn by 2031 Semiconductor Today

Feb 24 The AI Datacenter CPU Yellow Pages Vik's Newsletter

Feb 24 The Cloudy Semiconductor Market Driver Semiconductor Business Intelligence

Feb 24 Simple shorts sniffer EDN

Feb 24 India Summit Champions Global South AI Inclusion EE Times

Feb 24 Powering Kilowatt-Plus Processors EE Journal

Feb 24 Kontron’s turns to TI for compact OSM-S AM62L Electronics Weekly

Feb 24 A real-world approach for AI-driven semiconductor manufacturing EDN

Feb 24 Microelectronics US comes to Austin, April 22–23, 2026. Join 3,000+ engineers exploring advanced packaging, photonics integration, and US semiconductor manufacturing momentum. Register free. Electronics Weekly

Feb 24 Ayar Labs names Sankara Venkateswaran as VP of engineering Semiconductor Today

Feb 24 BluGlass secures A$190,000 order from TOPTICA for custom GaN visible lasers Semiconductor Today

Feb 24 Chip Industry Technical Paper Roundup: Feb. 24 Semiconductor Engineering

Feb 24 Research Bits: Feb. 24 Semiconductor Engineering

Feb 24 Chiplets 2026: Where Are We Today? Semiconductor Engineering

Feb 24 Ultrafast Laser Filamentation Dictates Energy Deposition in Narrow-Gap Semiconductors Semiconductor Engineering

Feb 24 Semidynamics Becomes 3-nm Ready, Moves Europe Toward Hardware Sovereignty EE Times

Feb 24 ASML 1000W light source to deliver 330wph EUV processing by 2030 Electronics Weekly

Feb 24 Compound semi substrate market growing at 14% CAGR Electronics Weekly

Feb 24 Teledyne digitiser delivers 14Gbyte/s data transfer Electronics Weekly

Feb 24 Socionext and Innatera develop always-on human detection device Electronics Weekly

Feb 24 Amphenol RF adds Mini-FAKRA connectors Electronics Weekly

Feb 24 AMD Says “Helios” Racks And MI400 Series GPUs On Track For 2H 2026 The Next Platform

Feb 24 3D Atomic-Scale Metrology of Strain Relaxation And Roughness in GAAFETs Via Electron Ptychography (Cornell, ASM, TSMC) Semiconductor Engineering

Feb 24 Beyond Moore's Law: Rick Tsai's Bold Vision for AI's Next Semiconductor Revolution SemiVision

Feb 24 The First High Vacuum Variable Capacitors Made In Britain Electronics Weekly

Feb 24 AI Impact Summit: From Minerals to Models, India Stakes Its AI Claim EE Times

Feb 24 ReRAM-based Neo-Hebbian Synapses For Training Neuromorphic HW (IIT Madras, UCSB) Semiconductor Engineering

Feb 24 Geehy Launches Arm Automotive MCU for Body and Comfort ECUs All About Circuits

Feb 24 Arista's Ethernet Bet, and the Six Debates That Decide If It's Worth 40x Chipstrat

Feb 24 Daily: SK Hynix to boost capacity Chip Briefing

Feb 24 Probing a USB analog audio adapter EDN

Feb 24 Hardware is the Center of the Universe (Again) SemiWiki

Feb 24 Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs All About Circuits

Feb 23 CPU-Only Compute Still Matters To A Lot Of HPC Centers The Next Platform

Feb 23 Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection EE Journal

Feb 23 Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026 EE Journal

Feb 23 SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust EE Journal

Feb 23 Taara Unveils Photonics Platform for Wireless Communication, and Taara Beam, Latest Product in Taara’s Portfolio and First on the New Photonic Core EE Journal

Feb 23 New KYOCERA AVX Capacitors for Optical Communications EE Journal

Feb 23 Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine SemiWiki

Feb 23 New AI Hardware and Advanced Packaging Innovations from Adeia at IMAPS DPC 2026 3D InCites

Feb 23 Embedded: VCSBC EvoCam promises embedded vision integration Electronics Weekly

Feb 23 Anglia signs Sensata Electronics Weekly

Feb 23 AMD Says “Helios” Racks And MI400 Series GPUs On Track For 2H 2026 The Next Platform

Feb 23 The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years SemiWiki

Feb 23 AI Supercycle Reshapes Memory Landscape, Squeezing NOR Flash Supply EE Times

Feb 23 Redemption Suspension Stirs AI Bubble Shivers Electronics Weekly

Feb 23 AI’s Math Tricks Don’t Work for Scientific Computing IEEE Spectrum Semiconductors

Feb 23 AI for Cybersecurity: Promise, Practice, and Pitfalls IEEE Spectrum Semiconductors

Feb 23 Adlink cExpress-R8 module brings 40 TOPS AI inference to the edge Electronics Weekly

Feb 23 NASA Return to Venus Depends on New Class of Ceramic Sensor EE Times

Feb 23 The Age Verification Trap IEEE Spectrum Semiconductors

Feb 23 Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers Semiconductor Engineering

Feb 23 New Performance Requirements For Audio Semiconductor Engineering

Feb 23 US tariffs declared illegal but new ones imposed Electronics Weekly

Feb 23 For first time in 40+ years Taiwan’s exports to US are more than China’s Electronics Weekly

Feb 23 Agent Pi Electronics Weekly

Feb 23 Mikroe EnOcean 5 Click Electronics Weekly

Feb 23 Apple No.1 in Europe Electronics Weekly

Feb 23 TSMC in 2026: Full Power On, Racing to Max Out Capacity SemiVision

Feb 23 SAW filters made simple: A quick front-end primer EDN

Feb 23 Ed Refurbs The PM Electronics Weekly

Feb 23 Weekly: Micron leans into memory supercycle Chip Briefing

Feb 23 Week 8, 2026 The Semiconductor Newsletter

Feb 23 TSMC Process Simplification for Advanced Nodes SemiWiki

Feb 23 Daily: Meta-Nvidia's multi-billion dollar deal Chip Briefing

Feb 23 Accelerator Architecture: Fusion-Aware Mapper (MIT) Semiconductor Engineering

Feb 23 Survey of GenAI Across the Full Computing Stack, From SW To Silicon (Harvard) Semiconductor Engineering

Feb 23 CEO Interview with Juniyali Nauriyal of Photonect SemiWiki

Feb 23 Electrical Model of the Bitflip in SRAM Under Laser Illumination Simulating Laser Fault Injection Semiconductor Engineering

Feb 23 Three Ways to Accelerate Cell Layout in DTCO All About Circuits

Feb 22 Poem: The Attraction of Blackberries IEEE Spectrum Semiconductors

Feb 22 Bridging Brains and Bots: Unleashing Bidirectional Neural Power SemiVision

Feb 21 AI Data Centers Turn to High-Temperature Superconductors IEEE Spectrum Semiconductors

Feb 21 Apple-Empowering the Next Wave of Silicon Engineers: From Custom Chips to Classroom Magic SemiVision

Feb 21 IEEE Plays a Pivotal Role In Climate Mitigation Talks IEEE Spectrum Semiconductors

Feb 21 Supreme Court Strikes Down Trump’s Tariff Regime EE Times

Feb 21 Video Friday: Humanoid Robots Celebrate Spring IEEE Spectrum Semiconductors

Feb 21 Vishay Adds 1200 V SiC MOSFET Power Modules in SOT-227 Packages All About Circuits

Feb 20 Nanoscale MoS₂-based Memristors Integrated into CMOS Microchips Semiconductor Engineering

Feb 20 Danisense aims DN1000ID-CP02 at precision current-sensing applications Electronics Weekly

Feb 20 What is the 3nm Pessimism Wall and Why is it An Economic Crisis? SemiWiki

Feb 20 Imperial Robotics Summer School opens for applications Electronics Weekly

Feb 20 Discipline Will Keep Memory Market Tight EE Times

Feb 20 CEO Interview with Aftkhar Aslam of yieldWerx SemiWiki

Feb 20 European Chip Industry Crisis Electronics Weekly

Feb 20 TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles EE Journal

Feb 20 Tensilica HiFi iQ DSP: Voice AI Meets Immersive Automotive Audio EE Journal

Feb 20 🍪 TWiC: Meta+Nvidia, AI Toilet Play, AI EDA SaaSocalypse? Vik's Newsletter

Feb 20 Burning power lines EDN

Feb 20 Allegro Hall effect current sensor offers ±0.55% sensitivity for control loops Electronics Weekly

Feb 20 Android 17 gets underway with media and camera optimisations Electronics Weekly

Feb 20 Most Read – Renesas collab, Battery cell, Nvidia sells Arm Electronics Weekly

Feb 20 Logarithmic amplifiers: A quick tour of theory and practice EDN

Feb 20 Chip Industry Week in Review Semiconductor Engineering

Feb 20 The On-Device LLM Revolution Semiconductor Engineering

Feb 20 Automotive Week In Review Semiconductor Engineering

Feb 20 New York ditches robotaxi proposal Electronics Weekly

Feb 20 Taalas raises $219m to tailor chips for AI models Electronics Weekly

Feb 20 Ablic launches automotive shunt reference ICs Electronics Weekly

Feb 20 WBA report calls for WiFi standardisation Electronics Weekly

Feb 20 Optical Transport equipment market grew 10% last year and forecast to grow 10% this year Electronics Weekly

Feb 20 India Deep Tech Alliance Pledges $2.5B in Investment EE Times

Feb 20 From 19th-Century Glass to 21st-Century AI: The Story of Corning's Enduring Materials Mastery SemiVision

Feb 20 Best Connected Airports Electronics Weekly

Feb 20 Silanna Semiconductor’s FirePower ICs Boost and Charge, All on One Chip All About Circuits

Feb 20 Intelligent Networks: Power, Reliability, and Maintenance in Telecom — Webinar Preview SemiWiki

Feb 20 Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit 3D InCites

Feb 20 Taalas Etches AI Models Onto Transistors To Rocket Boost Inference The Next Platform

Feb 20 Custom IC Design using Additive Learning SemiWiki

Feb 20 Microchip’s New MCU: A 32-bit Upgrade That Still Fits Old 8-bit Systems All About Circuits

Feb 19 The U.S. and China Are Pursuing Different AI Futures IEEE Spectrum Semiconductors

Feb 19 Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance EE Journal

Feb 19 SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026 EE Journal

Feb 19 Luminus leverages APC partnership to enhance energy-efficient LED lighting solutions Semiconductor Today

Feb 19 Global Coverage With NTN — TE Connectivity, Nordic Semiconductor, and Mouser EE Journal

Feb 19 Automotive high-side driver withstands cold crank EDN

Feb 19 Embedded capacitors improve AI/HPC power delivery EDN

Feb 19 Samsung leads with HBM4 DRAM performance EDN

Feb 19 Software accelerates 3D interconnect design EDN

Feb 19 Navitas tightens SiC losses with refined TAP EDN

Feb 19 Indium Corporation to Feature High-Performance Management Solutions at TestConX 2026 3D InCites

Feb 19 Gadget Book: Unplugged Tots, from Raspberry Pi Electronics Weekly

Feb 19 Taalas Specializes to Extremes for Extraordinary Token Speed EE Times

Feb 19 Physical AI at Foundry Scale EE Journal

Feb 19 Achieving Zero Runtime Errors EE Times

Feb 19 G9EK-1-EX compact relay delivers 250A/500VDC switching in gasless design Electronics Weekly

Feb 19 STMicroelectronics’ phase-shift control ICs squeeze more efficiency from resonant converters EE Journal

Feb 19 Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities EE Journal

Feb 19 LUBIS EDA: Addressing the Verification Bottleneck in Modern Chip Design SemiWiki

Feb 19 PULS to showcase Decentralised Field Power supplies and Industrial Wireless Charging at IntraLogisteX 2026 EE Journal

Feb 19 Using integration and differentiation in an oscilloscope EDN

Feb 19 Preemptive utilities shutdown oversight: Too much, too little, or just right? EDN

Feb 19 What caught your eye? Photonics, Zuckerberg testifies, Space Forge) Electronics Weekly

Feb 19 Nvidia: Star Attraction at CES 2026 EE Times

Feb 19 Compact automotive power inductors operate to +165°C Electronics Weekly

Feb 19 Photon Bridge demos >30mW laser output per color at wafer scale on silicon photonics Semiconductor Today

Feb 19 Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs Semiconductor Engineering

Feb 19 Understanding Within-Wafer Variations: A Virtual Fabrication Approach Semiconductor Engineering

Feb 19 Force Fields Will Accelerate Atomistic Simulations By 10,000× In 2026, Unlocking New Era Of Discovery Semiconductor Engineering

Feb 19 Laser Arrays May Simplify Co-Packaged Optics Semiconductor Engineering

Feb 19 Leading At Light Speed: What Makes Photonics Leadership Different Semiconductor Engineering

Feb 19 SEMI 2026 U.S. Policy Strategy Semiconductor Engineering

Feb 19 Why Indium Oxide Chips Are Getting So Much Attention Semiconductor Engineering

Feb 19 When Cleaning Chips Isn’t Clean Enough Semiconductor Engineering

Feb 19 Enabling the Industry’s First GPU-Accelerated Manufacturing Platform Semiconductor Engineering

Feb 19 AI is stress-testing processor architectures and RISC-V fits the moment EDN

Feb 19 Crunch-time for social media’s addictive practices Electronics Weekly

Feb 19 Photon Bridge validates photonics architecture Electronics Weekly

Feb 19 Molex’s Co-Packaged Copper connector system Electronics Weekly

Feb 19 ISSCC: Electro-optical router in a chiplet package Electronics Weekly

Feb 19 Toshiba IEGT for HV converters Electronics Weekly

Feb 19 Fable: The Famous Computer Electronics Weekly

Feb 19 SiFive’s AI’s Next Chapter: RISC-V and Custom Silicon SemiWiki

Feb 19 Some Game Theory On That Nvidia-Meta Platforms Partnership The Next Platform

Feb 19 CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale EE Journal

Feb 19 IEEE Course Improves Engineers’ Writing Skills IEEE Spectrum Semiconductors

Feb 19 The Han® Connector — HARTING and Mouser Electronics EE Journal

Feb 19 Smarter IC Layout Parasitic Analysis SemiWiki

Feb 19 Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions All About Circuits

Feb 18 How China Struggles to Reach WFE Self-Sufficiency EE Times

Feb 18 CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers EE Journal

Feb 18 Tomorrow’s Smart Pills Will Deliver Drugs and Take Biopsies IEEE Spectrum Semiconductors

Feb 18 European Digital Market: Collision of Deregulation and Defense EE Times

Feb 18 NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More EE Journal

Feb 18 Improving Retrieval Accuracy in AI SemiWiki

Feb 18 Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025 EE Journal

Feb 18 SemiQ debuting SiC power solutions for AI data centers and high-power infrastructure at APEC Semiconductor Today

Feb 18 Silly simple supply sequencing EDN

Feb 18 D2D Cont'd - Where do we go from here? Digits to Dollars

Feb 18 Alpha and Omega releases AOTL037V60DE2 600V super junction mosfet Electronics Weekly

Feb 18 Fraunhofer ISE achieves record efficiencies for tandem photovoltaic modules Semiconductor Today

Feb 18 Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form Electronics Weekly

Feb 18 Korean Startup Takes On Cost and Latency With LLM-Specific Chip EE Times

Feb 18 Wi-Fi 7 Moves To The IoT Semiconductor Engineering

Feb 18 AI in 2026: Enabling smarter, more responsive systems at the edge EDN

Feb 18 Nvidia sells the last of its stake in Arm Electronics Weekly

Feb 18 Globalfoundries and Renesas hook up for fab Electronics Weekly

Feb 18 Imec’s record-breaking ADC Electronics Weekly

Feb 18 Chip Island Life: How Taiwan's Semiconductors Touch Every Corner of Daily Existence SemiVision

Feb 18 ams OSRAM’s OSP to become international standard Electronics Weekly

Feb 18 Mouser signs ic-Haus Electronics Weekly

Feb 18 Top Ten Countries For Innovation Electronics Weekly

Feb 18 India to Add 20,000 GPUs as AI Mission 2.0 Expands Compute and Chip Push EE Times

Feb 18 TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World All About Circuits

Feb 18 Ceva IP: Powering the Era of Physical AI SemiWiki

Feb 18 Lidar Mobility Device Assists Navigation and Avoids Collisions IEEE Spectrum Semiconductors

Feb 18 Imec unveils 7‑bit, 175GS/s massively time-interleaved slope- ADC – pairing record-small footprint and low conversion energy with top sampling speed EE Journal

Feb 18 Estimating Surface Heating of an Atmospheric Reentry Vehicle With Simulation IEEE Spectrum Semiconductors

Feb 18 Nvidia China Gamble Meets Washington’s Regime EE Times

Feb 18 AI Eats The World, And Most Of Its Flash Storage The Next Platform

Feb 18 STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules EE Journal

Feb 18 Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands EE Journal

Feb 18 TDK launches high‑reliability automotive NTC thermistors rated for +175 °C EE Journal

Feb 18 Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC SemiWiki

Feb 18 STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration All About Circuits

Feb 17 Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds EE Journal

Feb 17 Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs EE Journal

Feb 17 IMAPS Announces Purchase of the 3D InCites Platform 3D InCites

Feb 17 Wolfspeed adds VP of sales for EMEA Semiconductor Today

Feb 17 We’re Measuring Data Center Sustainability Wrong IEEE Spectrum Semiconductors

Feb 17 Asians More Optimistic Than Most Electronics Weekly

Feb 17 A Century of Miracles: From the FET’s Inception to the Horizons Ahead SemiWiki

Feb 17 Passive RC circuit produces gain EDN

Feb 17 Former Altera CEO Joins French AI Chip Startup EE Times

Feb 17 Tower and Scintil announce availability of first heterogeneously integrated DWDM lasers for AI infrastructure Semiconductor Today

Feb 17 Build a practical 400 mA linear Li-ion charger with visible CC-CV behavior EDN

Feb 17 I Doff My Cap to the New Hailo RPi AI HAT+ 2 EE Journal

Feb 17 The Nvidia Business Hiding in Plain Sight Chipstrat

Feb 17 Get the Gadget Master newsletter! Electronics Weekly

Feb 17 Why Wireless Infrastructure Must Be Reinvented for the 6G Era EE Times

Feb 17 ams OSRAM and Meizhi settle patent disputes over LEDs used in Spider Farmer luminaires Semiconductor Today

Feb 17 SDI buys PRP Optoelectronics for £9.3m Semiconductor Today

Feb 17 Six critical trends reshaping 3D IC design in 2026 EDN

Feb 17 Research Bits: Feb. 17 Semiconductor Engineering

Feb 17 Can A Computer Science Student Be Taught To Design Hardware? Semiconductor Engineering

Feb 17 The Race Begins For Much Bigger Abstractions Semiconductor Engineering

Feb 17 One-on-One With proteanTecs CEO Shai Cohen Semiconductor Engineering

Feb 17 Drones and EMP Weapons: The Convergence and Strategic Implications for Future Battlefields SemiVision

Feb 17 HBF challenges HBM Electronics Weekly

Feb 17 GM battery cell charges from 10-70% in 5.6 mins Electronics Weekly

Feb 17 Fraunhofer adds 10G TSN IP core Electronics Weekly

Feb 17 Infineon and BMW define Neue Klasse platform Electronics Weekly

Feb 17 High-side driver powers through disturbances Electronics Weekly

Feb 17 The CPU Bottleneck in Agentic AI and Why Server CPUs Matter More Than Ever Vik's Newsletter

Feb 17 New Class Of Semiconductors Made Of Germanium-Tin Alloy (University of Edinburgh et al.) Semiconductor Engineering

Feb 17 Less Power and Higher Performance With A Nanolaser With Extreme Dielectric Confinement (DTU) Semiconductor Engineering

Feb 17 Electromechanical polishing of semiconductor wafers Electronics Weekly

Feb 17 Research Shorts: Medtech Targets Sleep, Speech, Strength, and More All About Circuits

Feb 17 Chip Assembler ASE Sees Advanced Packaging Sales Doubling EE Times

Feb 17 Two Open RISC-V Projects Chart Divergent Paths to High Performance SemiWiki

Feb 17 MR-VMU-RT1176 Vehicle Management Flight Controller — NXP and Mouser Electronics EE Journal

Feb 17 Rapidus to produce 600mm × 600mm large-format RDL panels 3D InCites

Feb 17 Perusing a LED-based gel nail polish UV lamp EDN

Feb 17 SemiQ partners with distributor NAC Semi across North America Semiconductor Today

Feb 17 Samtec Ushers in a New Era of High-Speed Connectivity at DesignCon 2026 SemiWiki

Feb 17 Alpha & Omega Semi Unwraps 60 V Super Junction MOSFET Devices All About Circuits

Feb 16 Another Conversation with Val Bercovici Memory Markets Fabricated Knowledge

Feb 16 InferenceX v2: NVIDIA Blackwell Vs AMD vs Hopper - Formerly InferenceMAX SemiAnalysis

Feb 16 MacDermid Alpha to Highlight Advanced Interconnect Solutions for Complex Semiconductor Architectures at IMAPS DPC 2026 3D InCites

Feb 16 Infineon and BMW Group join forces to shape the future of software-defined vehicles with the Neue Klasse EE Journal

Feb 16 Altus Expands Advanced X-ray Inspection at Prototype Electronics EE Journal

Feb 16 Intelligent automotive high-side driver from STMicroelectronics powers and protects during severe voltage transients EE Journal

Feb 16 Taoglas Debuts ‘World-First’ AI-Powered Antenna Selection Platform at embedded world 2026 EE Journal

Feb 16 Lacuna Space opens up LoneWhisper D2D satellite IoT network Electronics Weekly

Feb 16 AMD Sets the Standard for Gaming CPUs With Ryzen 7 9850X3D EE Times

Feb 16 MatrixSpace Fusion 360 eyes unified view for counter-drone awareness Electronics Weekly

Feb 16 Where’s There’s Trust Electronics Weekly

Feb 16 Bronco Debug Stress Tested Measures Up SemiWiki

Feb 16 This Former Physicist Helps Keep the Internet Secure IEEE Spectrum Semiconductors

Feb 16 Engineering SDVs at China Speed Without Losing Control EE Times

Feb 16 Quantum test bed opens in Quebec City Electronics Weekly

Feb 16 Deep Space Energy funding to power Moon surface exploration Electronics Weekly

Feb 16 Sony tech identifies earlier compositions in AI-generated music Electronics Weekly

Feb 16 Eddy current in focus: A rapid revisit EDN

Feb 16 Nitride Global, USLLC and Axiom Space awarded NASA SBIR grant Semiconductor Today

Feb 16 Wolfspeed’s soft demand for EV application offset by 50% quarterly revenue growth for AI data-center application Semiconductor Today

Feb 16 NAND Reimagined in High-Bandwidth Flash to Complement HBM EE Times

Feb 16 Chip Industry Technical Paper Roundup: Feb. 16 Semiconductor Engineering

Feb 16 Skyrora to buy ‘select assets’ of Orbex Electronics Weekly

Feb 16 Meta could add facial recognition to smart glasses this year Electronics Weekly

Feb 16 ChatGPT to add adult content Electronics Weekly

Feb 16 Book-type foldables will drive foldable push this year Electronics Weekly

Feb 16 $1.7trn 2030 datacentre capex Electronics Weekly

Feb 16 TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon SemiWiki

Feb 16 Ed Cools On AI Electronics Weekly

Feb 16 CEO Interview with Elad Raz of NextSilicon SemiWiki

Feb 16 Introduction to the Gilbert Multiplier All About Circuits

Feb 15 Week 7, 2026 The Semiconductor Newsletter

Feb 15 NASA Let AI Drive the Perseverance Rover IEEE Spectrum Semiconductors

Feb 15 Carrier Mapping in Sub-2nm Node NSFETs with SSRM (imec, KU Leuven) Semiconductor Engineering

Feb 15 LLM-Based Learning Platform For Chip Design Education (RPTU) Semiconductor Engineering

Feb 15 Automated MLIR-based HLS framework That Generates FPGA HW Designs From A Variety of CNN Layers (TU Dresden) Semiconductor Engineering

Feb 15 CNT Nano Sandpaper For Atomic-Level Polishing (KAIST) Semiconductor Engineering

Feb 14 Sub-$200 Lidar Could Reshuffle Auto Sensor Economics IEEE Spectrum Semiconductors

Feb 14 Phison Electronics: Memory Shortage Is the Real AI Killer, Not GPUs SemiVision

Feb 14 A Test Generation Procedure Targeting Subcircuits With High Susceptibilities To Aging (Purdue University) Semiconductor Engineering

Feb 14 Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio All About Circuits

Feb 14 The Current AI Networking Wave Will Be A Tsunami Of Money By 2027 The Next Platform

Feb 14 The $200 Billion Bet Chipstrat

Feb 14 TryEngineering Marks 20 Years of Getting Kids Interested in STEM IEEE Spectrum Semiconductors

Feb 13 NUBURU activates Q1 production ramp for 40 high-power blue laser systems Semiconductor Today

Feb 13 Video Friday: Robot Collective Stays Alive Even When Parts Die IEEE Spectrum Semiconductors

Feb 13 AI Drives AV Momentum at CES 2026 EE Times

Feb 13 Most Read – Edinburgh Uni research, Datacentre builds, Agentic AI tool Electronics Weekly

Feb 13 Time to be The "Unlucky" customer again? Semiconductor Business Intelligence

Feb 13 National Semiconductor’s LM317 and the Rise of Adjustable Linear Power All About Circuits

Feb 13 European Chip Industry Has Never Been Healthier Electronics Weekly

Feb 13 Revolution at the Speed of Light: How PhotonDelta Building a Global Photonics Ecosystem EE Journal

Feb 13 TSMC vs Intel Foundry vs Samsung Foundry 2026 SemiWiki

Feb 13 What caught your eye? (IEEE honorees, Datacentre satellites, EECL and ESA) Electronics Weekly

Feb 13 Safe operating area EDN

Feb 13 Silanna LiDAR laser firing ICs combine charging and firing Electronics Weekly

Feb 13 🍪 TWiC: HBM4, SiPho's Rise, Memory eats All, 2nm Mo-Contacts,++ Vik's Newsletter

Feb 13 A tutorial on instrumentation amplifier boundary plots—Part 2 EDN

Feb 13 Spectrum analyser delivers high-frequency up to 44 GHz Electronics Weekly

Feb 13 Weekly: Memory is cyclical Chip Briefing

Feb 13 Navitas unveils fifth-generation SiC Trench-Assisted Planar MOSFET technology Semiconductor Today

Feb 13 Chip Industry Week In Review Semiconductor Engineering

Feb 13 How Siemens Symphony Pro Enabled AnalogPort To Verify Complex Chip Interfaces Semiconductor Engineering

Feb 13 Automotive Week In Review Semiconductor Engineering

Feb 13 Formal Verification First: How AI Supports But Cannot Replace It Semiconductor Engineering

Feb 13 Qatar’s Deep Tech Ambitions Come Into Focus EE Times

Feb 13 Daily: OpenAI model on Cerebras chips Chip Briefing

Feb 13 "Stronger Together" to "Transform Tomorrow": The Slogan Evolution Powering the Next Semiconductor Supercycle SemiVision

Feb 13 Elon to launch datacentre satellites from the Moon Electronics Weekly

Feb 13 Sharp increase in VC-backed AI company exits Electronics Weekly

Feb 13 Toshiba expands eFuse lineup Electronics Weekly

Feb 13 Active smartphone installed base grew 2% in 2025 Electronics Weekly

Feb 13 DCPI market to top $80bn in 2030 Electronics Weekly

Feb 13 IMC: Free-Space Optical Neural Network With High Clockrate (Berkeley, USC, TU Berlin) Semiconductor Engineering

Feb 13 ST Launches LVDS Driver for High-Speed Data and Low-Voltage Logic All About Circuits

Feb 13 Qatar’s AI Ambitions Span the Tech Stack EE Times

Feb 13 AI-powered MCU elevates vehicle intelligence EDN

Feb 13 Gate drivers emulate optocoupler inputs EDN

Feb 13 IC enables precise current sensing in fast control loops EDN

Feb 13 Microchip empowers real-time edge AI EDN

Feb 13 AI agent automates front-end chip workflows EDN

Feb 13 KYZEN to Showcase MICRONOX Power Electronics Cleaning Chemistries at IMAPS Device Packaging Conference 2026 3D InCites

Feb 13 The Memory Crunch Pinches Cisco’s Profits The Next Platform

Feb 13 IMAPS 3D Incites Backyard Olympics at DPC 2026 3D InCites

Feb 13 Silicon Catalyst at the Chiplet Summit: Advancing the Chiplet Economy SemiWiki

Feb 13 Microchip Adds 12 Devices in 600 V Gate Driver Family All About Circuits

Feb 12 Thermal-magnetic protection in an 8-mm package EE Journal

Feb 12 Mouser Brings Intelligence from the Cloud with Edge Computing Online Resource Hub for Engineers EE Journal

Feb 12 Imec inaugurates NanoIC pilot line, accelerating innovation in sub- 2nm systems-on-chip EE Journal

Feb 12 Blecon Launches Blecon Agent, Transforming Zebra Technologies’ Frontline Devices into an Autonomous Bluetooth Tracking Network EE Journal

Feb 12 Towards Unlocking the Full Potential of Sodium- and Potassium-Ion Batteries EE Journal

Feb 12 Pickering Interfaces reflects on switching & simulation highlights amid turbulent T&M market conditions EE Journal

Feb 12 ISE 2026: Sol Rashidi Warns of ‘POC Purgatory’ EE Times

Feb 12 Giving AI Agents Access to a Compiled Design and Verification Database SemiWiki

Feb 12 Navitas Unveils 5th Generation SiC Trench-Assisted Planar (TAP) Technology EE Journal

Feb 12 LEDs Enter the Nanoscale IEEE Spectrum Semiconductors

Feb 12 Ceva’s Strategic Play in the AI Surge: From Smart Edge to Scalable AI Platforms SemiWiki

Feb 12 What the FDA’s 2026 Update Means for Wearables IEEE Spectrum Semiconductors

Feb 12 Beyond the Dashboard: How Cars Are Learning to Sense Like Humans EE Times

Feb 12 Wearables for health analysis: A gratefulness-inducing personal experience EDN

Feb 12 How to design a digital-controlled PFC, Part 2 EDN

Feb 12 Dipping Our Toes Deeper into the AI+AR Computing Waters EE Journal

Feb 12 E-Fuses Grow Up and Go Industrial EE Times

Feb 12 Edge AI in a DRAM shortage: Doing more with less EDN

Feb 12 UK–Bulgaria collaboration developing Green Silicon Carbide wafer factory Semiconductor Today

Feb 12 The Origins and Limitations of AMD's Historic Revival The Chip Letter

Feb 12 AI Inference Needs A Mix-And-Match Memory Strategy Semiconductor Engineering

Feb 12 Daily: Nexperia saga resumes Chip Briefing

Feb 12 Only A Few AI Platforms Can Survive The Next Platform

Feb 12 AI Is Not a Cycle—It Is a Structural Shift in Memory Economics SemiVision

Feb 12 R&S Expands Mid-Range Portfolio With New 44 GHz Spectrum Analyzer All About Circuits

Feb 12 Seven Criteria to Help Choose the Right Logistics Partner in 2026 EE Times

Feb 12 Applied Materials Announces Samsung Electronics Will Join the New, Multibillion-Dollar EPIC Center in Silicon Valley 3D InCites

Feb 12 Wolfspeed accelerates AI-powered manufacturing and operations with Snowflake Semiconductor Today

Feb 12 Rediscovering the Lost Legacy of Chemist Jan Czochralski IEEE Spectrum Semiconductors

Feb 12 Tips for Using AI Tools in Technical Interviews IEEE Spectrum Semiconductors

Feb 12 How Memory Technology Is Powering the Next Era of Compute SemiWiki

Feb 12 RISC-V Pivots from Academia to Industrial Heavyweight EE Times

Feb 12 Thermal Research Roundup: New Ways to Store, Move, and Control Heat All About Circuits

Feb 11 Attending GTC? Join Us For An Exclusive Roundtable Dinner On AI Data Platforms The Next Platform

Feb 11 EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026 EE Journal

Feb 11 Vishay Intertechnology Standard Thick Film Chip Resistors Combine Sulfur Resistance With Long Term Stability EE Journal

Feb 11 Infineon’s Silicon Carbide Power Semiconductors Selected for TOYOTA’s New “bZ4X” EE Journal

Feb 11 Ainekko Merges with Veevx, Expands Open Silicon Platform with Breakthrough Memory and Embedded AI Capabilities EE Journal

Feb 11 IMAPS Announces Panelists for “Addressing Barriers to Co-Packaged Optics” session at DPC 2026 3D InCites

Feb 11 Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems SemiWiki

Feb 11 Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home EE Journal

Feb 11 How Can AI Companions Be Helpful, not Harmful? IEEE Spectrum Semiconductors

Feb 11 Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance EE Journal

Feb 11 Watch Live Agentic Software Debug SemiWiki

Feb 11 How Do You Define an AI Companion? IEEE Spectrum Semiconductors

Feb 11 Self-oscillating sawtooth generator spans 5 decades of frequencies EDN

Feb 11 Full circle current loops: 4mA-20mA to 0mA-20mA EDN

Feb 11 Lam Research, CEA-Leti Open Fast Lane for Specialty Technologies EE Times

Feb 11 HexaTech launches 3”-diameter aluminium nitride substrate Semiconductor Today

Feb 11 Are non-magnetic connectors in your future? EDN

Feb 11 NUBURU completes first tranche of preferred equity restructuring Semiconductor Today

Feb 11 Ams Osram Sells Sensor Business to Infineon to Focus on Digital Photonics EE Times

Feb 11 Renesas licenses EPC’s low-voltage eGaN technology to complement its 650V+ portfolio Semiconductor Today

Feb 11 Daily: Senate's AI chip controls Chip Briefing

Feb 11 The Sovereign Quantum Race Starts Before Quantum Advantage EE Times

Feb 11 Meta’s ROIC Strategy: GEM Now, LLMs Later Chipstrat

Feb 11 Violumas launches new 255nm, 265nm and 275nm LEDs in mid-power, high-power, and high-density packages Semiconductor Today

Feb 11 STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode All About Circuits

Feb 11 Cisco Doubles Up The Switch Bandwidth To Take On AI Scale Out And Eventually Scale Out The Next Platform

Feb 11 Cisco Doubles Up The Switch Bandwidth To Take On AI Scale Out And Eventually Scale Up The Next Platform

Feb 11 AI Datacenters Drink More Water Than You Think Vik's Newsletter

Feb 11 Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026 SemiWiki

Feb 11 NHanced Takes Avalanche MRAM to Space EE Times

Feb 10 Same Sky Adds Slide Potentiometers to Potentiometers Product Line EE Journal

Feb 10 Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making EE Journal

Feb 10 555 VCO revisited EDN

Feb 10 The Greatest AI Show On Earth The Next Platform

Feb 10 How and When the Memory Chip Shortage Will End IEEE Spectrum Semiconductors

Feb 10 Cadence Unveils ChipStack AI Agent for Agentic Chip Design and Verification EE Times

Feb 10 Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification All About Circuits

Feb 10 Infineon’s 2026 edition of GaN Insights eBook highlights adoption in power electronics Semiconductor Today

Feb 10 15-Minute Deep Dive into the Data Center Cooling Revolution: From Chillers to Liquid Cooling SemiVision

Feb 10 Simplifying inductive wireless charging EDN

Feb 10 Navitas unveils 10kW DC–DC platform delivering 98.5% efficiency for 800VDC next-gen AI data centers Semiconductor Today

Feb 10 Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing EE Times

Feb 10 Daily: Apollo's $3bn loan to xAI Chip Briefing

Feb 10 The New AI “Picks and Shovels” Spin-Off Cohort: Power, Materials, Storage The Semiconductor Newsletter

Feb 10 Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers All About Circuits

Feb 10 Datacenter Spending Forecast Revised Upwards – Yet Again The Next Platform

Feb 10 TP-Link’s Kasa HS103: A smart plug with solid network connectivity EDN

Feb 10 Lumentum’s quarterly revenue grows 65% year-on-year to $665.5m Semiconductor Today

Feb 10 IEEE Honors Global Dream Team of Innovators IEEE Spectrum Semiconductors

Feb 10 CPUs are Back: The Datacenter CPU Landscape in 2026 SemiAnalysis

Feb 09 Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking All About Circuits

Feb 09 Infineon’s silicon carbide power MOSFETs selected for Toyota’s new bZ4X model Semiconductor Today

Feb 09 New Devices Might Scale the Memory Wall IEEE Spectrum Semiconductors

Feb 09 Veeco stockholders approve merger with Axcelis Semiconductor Today

Feb 09 Texas Semiconductor Innovation Fund grants Coherent $14m to accelerate scaled production of InP wafers Semiconductor Today

Feb 09 In Space, Power Is Destiny: Solar Panels and the Future of Satellites SemiVision

Feb 09 Daily: Samsung's HBM4 to Nvidia's Rubin Chip Briefing

Feb 09 10 Minutes to Understand Why Low Earth Orbit Is Becoming Infrastructure SemiVision

Feb 09 Week 6, 2026 The Semiconductor Newsletter

Feb 09 The Twin Engine Strategy That Propels AWS Is Working Well The Next Platform

Feb 09 Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot All About Circuits

Feb 08 Thumbwheel switches: Turning numbers into control EDN

Feb 07 Low-Vision Programmers Can Now Design 3D Models Independently IEEE Spectrum Semiconductors

Feb 07 Famine: The 3rd Rider of the Apocalypse Semiconductor Business Intelligence

Feb 07 IEEE Online Mini-MBA Aims to Fill Leadership Skills Gaps in AI IEEE Spectrum Semiconductors

Feb 07 Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs All About Circuits

Feb 06 The MI450 Waiting Game Chipstrat

Feb 06 KAIST-led team develops high-efficiency, ultra-high-resolution red micro-LED display Semiconductor Today

Feb 06 Video Friday: Autonomous Robots Learn By Doing in This Factory IEEE Spectrum Semiconductors

Feb 06 Memory Mania: How a Once-in-Four-Decades Shortage Is Fueling a Memory Boom SemiAnalysis

Feb 06 MACOM promotes distinguished technology fellow Jessen to senior VP, advanced GaN technology Semiconductor Today

Feb 06 🍪 TWiC: Google/AWS CapEx, NVIDIA GPUs, SaaS, TXN+SLAB Vik's Newsletter

Feb 06 Weekly: Abu Dhabi royal invested in Trump crypto for AI chip access Chip Briefing

Feb 06 Daily: Memory bottleneck intensifies Chip Briefing

Feb 06 Viewing Japan’s Semiconductor Strategy Through Takaichi’s Lens of Economic Security SemiVision

Feb 06 Lumentum: Laser Demand, OCS, CPO and Optical Scale-Up Vik's Newsletter

Feb 06 Globalization 2.0: Why the World Is Choosing Security Over Speed SemiVision

Feb 06 Japan’s Semiconductor Industry for Professionals and Job Seekers The Semiconductor Newsletter

Feb 06 Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure All About Circuits

Feb 06 NUBURU accelerates defense & security platform execution while advancing balance sheet transformation and multi-vertical technology integration Semiconductor Today

Feb 06 With GenAI Turbochargers, Google Is Shifting Its Cloud Into A Higher Gear The Next Platform

Feb 06 Claude Code is the Inflection Point SemiAnalysis

Feb 06 Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics All About Circuits

Feb 05 “Quantum Twins” Simulate What Supercomputers Can’t IEEE Spectrum Semiconductors

Feb 05 Ascent Solar developing CIGS PV modules generating multiple times more power for space beaming Semiconductor Today

Feb 05 Skyworks’ continuing revenue growth in Broad Markets counteracts seasonal decline in Mobile Semiconductor Today

Feb 05 28nm vs 40nm vs 65nm — The Real Cost, Risk, and Power Trade-Off for ASICs AnySilicon

Feb 05 TSMC 22nm vs UMC 22nm vs GF 22FDX — Which Should You Choose? AnySilicon

Feb 05 Daily: OpenAI and Nvidia's rocky relationship Chip Briefing

Feb 05 Can ZAM Replace HBM? Intel and SoftBank Push Radical Memory Architecture SemiVision

Feb 05 IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program All About Circuits

Feb 05 Supra launches to secure US supply of gallium, scandium and other critical minerals Semiconductor Today

Feb 05 Nimy ships high-grade gallium ore from Western Australia to M2i in USA Semiconductor Today

Feb 05 AMD Finally Makes More Money On GPUs Than CPUs In A Quarter The Next Platform

Feb 05 Dassault And Nvidia Bring Industrial World Models To Physical AI The Next Platform

Feb 05 Paying Tribute to Finite Element Field Computation Pioneer IEEE Spectrum Semiconductors

Feb 04 Milan-Cortina Winter Olympics Debut Next-Generation Sports Smarts IEEE Spectrum Semiconductors

Feb 04 OIF interoperability demo at OFC highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI Semiconductor Today

Feb 04 EPC launches its first seventh-generation eGaN power transistor Semiconductor Today

Feb 04 Exclusive Interview: Mika Jäsberg Discusses CoreHW’s RTLS Offering AnySilicon

Feb 04 AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs All About Circuits

Feb 04 Beating the Memory Wall: Inside Microsoft’s Maia 200 Strategy SemiVision

Feb 04 Raspberry Pi Introduces Its First HAT Product for Generative AI All About Circuits

Feb 04 TACC Explores Mixed Precision And FP64 Emulation For HPC With Horizon The Next Platform

Feb 04 ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs All About Circuits

Feb 03 Cree LED unveils OptiLamp LEDs with active intelligence in every pixel Semiconductor Today

Feb 03 Breaking Boundaries in Wireless Communication IEEE Spectrum Semiconductors

Feb 03 Robotics Will Break AI infrastructure: Here’s What Comes Next The Next Platform

Feb 03 AI Hunts for the Next Big Thing in Physics IEEE Spectrum Semiconductors

Feb 03 Riber’s full-year 2025 revenue falls by 2% to €40.3m, but second-half up 7% year-on-year Semiconductor Today

Feb 03 5N Plus to increase space solar cell production capacity by 25% in 2026 Semiconductor Today

Feb 03 Daily: No newsletter today Chip Briefing

Feb 03 Oracle’s Financing Primes The OpenAI Pump The Next Platform

Feb 03 The Race to 2026: Five Megatrends Accelerating the Semiconductor Industry SemiVision

Feb 03 Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation All About Circuits

Feb 03 IEEE Considers Safety Guidelines for Neurotech Consumer Products IEEE Spectrum Semiconductors

Feb 03 Qorvo’s quarterly revenue grows a more-than-expected 8.4% year-on-year Semiconductor Today

Feb 03 Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges All About Circuits

Feb 02 Don’t Regulate AI Models. Regulate AI Use IEEE Spectrum Semiconductors

Feb 02 When Chips Meet Geopolitics: TSMC and the Silicon Shield Debate SemiVision

Feb 02 Week 5, 2026 The Semiconductor Newsletter

Feb 01 LuSEE-Night: See You on the Far Side of the Moon IEEE Spectrum Semiconductors

Feb 01 Is a Second Civilization Emerging on Earth?! AI Agents Claw...?! SemiVision

January 2026

Jan 31 How YouTube and Adhesive Tape Are Disrupting Assistive Technology IEEE Spectrum Semiconductors

Jan 31 Explore the Stratosphere With a DIY Pico balloon IEEE Spectrum Semiconductors

Jan 31 Inside the “Trillion-Dollar Dinner”: Who Sat at NVIDIA’s Taiwan Power Table? SemiVision

Jan 31 Newsletter Update: Semi Doped Podcast, Jan Articles and Feb Plans Vik's Newsletter

Jan 31 Gartner Takes Another Stab At Forecasting AI Spending The Next Platform

Jan 31 Ode to Very Small Devices IEEE Spectrum Semiconductors

Jan 31 Go Global to Make Your Career Go Further IEEE Spectrum Semiconductors

Jan 31 Video Friday: Multitasking Robots Smoothly Do the Things Together IEEE Spectrum Semiconductors

Jan 30 The Masters of Narrative Realignment Semiconductor Business Intelligence

Jan 30 This Month in Review (Jan '26) Chipstrat

Jan 30 Weekly: Anthropic's Amodei for chip controls Chip Briefing

Jan 30 🍪 TWiC: Maia 200, H200 in China, Micron's $24B Fab, Meta is ↑, MediaTek ASICs ++ Vik's Newsletter

Jan 30 Daily: Nvidia says China has not yet approved H200 Chip Briefing

Jan 30 Microsoft Is More Dependent On OpenAI Than The Converse The Next Platform

Jan 29 Germany's Semiconductor Industry & Job Landscape The Semiconductor Newsletter

Jan 29 Intel Q425: Back to Reality Chipstrat

Jan 29 Lightmatter Taiwan Tech Day in 20 Minutes: A Photonic Leap into the Future of AI SemiVision

Jan 29 Big Blue Poised To Peddle Lots Of On Premises GenAI The Next Platform

Jan 29 Daily: China approves H200 chips Chip Briefing

Jan 28 An Interview with Microsoft's Saurabh Dighe About Maia 200 Chipstrat

Jan 28 Microsoft Takes On Other Clouds With “Braga” Maia 200 AI Compute Engines The Next Platform

Jan 28 Daily: AI policy architect Sriram Krishnan Chip Briefing

Jan 27 Nvidia’s $2 Billion Investment In CoreWeave Is A Drop In A $250 Billion Bucket The Next Platform

Jan 27 Daily: Microsoft's own AI chip, Maia 200 Chip Briefing

Jan 26 Optics Primer, Part 2: LRO & LPO. Chipstrat

Jan 26 Find a Local Semiconductor/ASIC/IP Sales Representative (Asia, Europe, US) AnySilicon

Jan 26 The Future of Semiconductors: A Deep Dive with Howard Pakosh AnySilicon

Jan 26 IMPACT 2025 Conference Review: Enabling Energy-Efficient AI with Advanced Logic, 3D Packaging, and Photonics SemiVision

Jan 26 Daily: Samsung's HBM4 head to Nvidia Chip Briefing

Jan 26 Week 4, 2026 The Semiconductor Newsletter

Jan 25 High Stakes Advanced Node Poker: TSMC Goes All-in, Intel Folds Vik's Newsletter

Jan 25 Intel's Larabee Legacy The Chip Letter

Jan 23 The Increasing Complexity of the Semiconductor Supply Network Semiconductor Business Intelligence

Jan 23 Innovation Meets Customization: Unlocking breakthroughs in next-gen sensing AnySilicon

Jan 23 Weekly: DeepSeek, a year out Chip Briefing

Jan 23 Daily: Alibaba's chip unit seeks IPO Chip Briefing

Jan 22 Why LIDAR Is Consolidating Now Chipstrat

Jan 22 Daily: US House committee advances AI Overwatch Act to give Congress export control authority Chip Briefing

Jan 21 Daily: Amodei says selling chips to China is like selling nukes to North Korea Chip Briefing

Jan 21 Right Systems for Agentic Workloads Chipstrat

Jan 20 2026 Is Already Decided: MIT’s Top 10 Breakthrough Technologies in 30 Minutes SemiVision

Jan 20 LiDAR, Explained: How It Works and Why It Matters Chipstrat

Jan 19 Week 3, 2026 The Semiconductor Newsletter

Jan 19 How to Understand the Semiconductor Industry in 1 Day SemiVision

Jan 18 Context Memory Storage Systems, Disruption of Agentic AI Tokenomics, and Memory Pooling Flash vs DRAM Vik's Newsletter

Jan 16 The Death of Software 2.0 (A Better Analogy!) Fabricated Knowledge

Jan 16 The Declining Capacity of TSMC Semiconductor Business Intelligence

Jan 16 From TSMC’s Earnings to the U.S.–Taiwan Tariff Deal: AI, Capital Flows, and the Geopolitical Reordering of Semiconductors SemiVision

Jan 16 From Tokens to Burgers: A Water Footprint Face-Off SemiAnalysis

Jan 15 Credo’s Reliability Thesis Chipstrat

Jan 14 Glass Substrates as Surprising New Foundation for Powerful AI Chips The Semiconductor Newsletter

Jan 14 Qualcomm's Ventana RISC-V Acquisition The Chip Letter

Jan 14 Intel's Product Marketing at CES: B- Chipstrat

Jan 14 Interconnects Beyond Copper, 1,000 CFETs, SK Hynix Next-Gen NAND, 2D Materials, and More SemiAnalysis

Jan 13 Errata: A Close Look at SRAM for Inference in the Age of HBM Supremacy Vik's Newsletter

Jan 13 Co-Creating the Future of Integrated Photonics: Insights from Netherlands–Taiwan Collaboration SemiVision

Jan 13 Week 2, 2026 The Semiconductor Newsletter

Jan 11 A Close Look at SRAM for Inference in the Age of HBM Supremacy Vik's Newsletter

Jan 10 Semiconductor Jobs & Skills Outlook 2026 The Semiconductor Newsletter

Jan 09 28nm Wafer & MPW Cost Explained: Constraints, Risk, and When It Makes Sense AnySilicon

Jan 09 40nm Wafer & MPW Cost Explained: Constraints, Risk, and When It Makes Sense AnySilicon

Jan 09 55nm Wafer & MPW Cost Explained: Constraints, Risk, and When It Makes Sense AnySilicon

Jan 09 90nm Wafer & MPW Cost Explained: Use Cases, Risks, and Cost Drivers AnySilicon

Jan 09 When Frontier AI Goes From Cloud to Desk in Five Years Chipstrat

Jan 08 Apple-TSMC: The Partnership That Built Modern Semiconductors SemiAnalysis

Jan 08 2026 AI & Semiconductor Outlook Fabricated Knowledge

Jan 07 A Colossus on Tiny Silicon Feet Semiconductor Business Intelligence

Jan 07 RL Environments and RL for Science: Data Foundries and Multi-Agent Architectures SemiAnalysis

Jan 05 Week 1, 2026 The Semiconductor Newsletter

Jan 05 2025 International Electron Devices Meeting (IEDM): Detailed Conference Report Vik's Newsletter

Jan 04 Lithography Economics Chipstrat

Jan 02 Co-Packaged Optics (CPO) Book – Scaling with Light for the Next Wave of Interconnect SemiAnalysis

Jan 01 Jensen Groks Groq The Chip Letter

December 2025

Dec 31 The year of the Flock of Black Swans Semiconductor Business Intelligence

Dec 31 How AI Labs Are Solving the Power Crisis: The Onsite Gas Deep Dive SemiAnalysis

Dec 30 3D InCites Grows Up: Passing the Torch 3D InCites

Dec 30 IFTLE 652: The End………. 3D InCites

Dec 30 Right Tool for the Job Chipstrat

Dec 29 Beyond Transport Modes: Balancing Cost and Speed in Semiconductor Logistics 3D InCites

Dec 25 NVIDIA-Groq: The Occam's Razor Explanation Vik's Newsletter

Dec 24 Optics Primer, Part 1: Traditional Pluggable Optics Chipstrat

Dec 23 December Monthly News: That’s a Wrap on 2025 3D InCites

Dec 23 2025: The Year in Review Vik's Newsletter

Dec 23 Week 51, 2025 The Semiconductor Newsletter

Dec 22 D2D China: What is the US Trying to Achieve? Digits to Dollars

Dec 22 IFTLE 651: Intel and Amkor Join Forces for EMIB 3D InCites

Dec 22 Complete: The Deconstruction of a Semiconductor Cycle Semiconductor Business Intelligence

Dec 21 Interview: Indium Phosphide Lasers and Photonic Integration with Prof. Martijn Heck, TU Eindhoven Vik's Newsletter

Dec 20 GPU Networking, Part 4: Year End Wrap Chipstrat

Dec 19 From a World of Hurt to Vertical Violence Semiconductor Business Intelligence

Dec 19 Memories, IEDM, and Looking Forward 3D InCites

Dec 17 Lessons from History: The Great Railroad Buildout Fabricated Knowledge

Dec 16 The Deconstruction of a Semiconductor Cycle Semiconductor Business Intelligence

Dec 15 Week 50, 2025 The Semiconductor Newsletter

Dec 15 CPO Fears, Credo, and Role of AEC in 1.6T Networking Vik's Newsletter

Dec 14 TPU Mania The Chip Letter

Dec 11 Executive Brief: How d-Matrix's In-Memory Compute Tackles AI Inference Economics Vik's Newsletter

Dec 10 How d-Matrix's In-Memory Compute Tackles AI Inference Economics Vik's Newsletter

Dec 09 Nvidia, AMD, Amkor, Arista @ UBS Tech Conference Chipstrat

Dec 08 Week 49, 2025 The Semiconductor Newsletter

Dec 05 AWS Trainium3 Deep Dive | A Potential Challenger Approaching SemiAnalysis

Dec 03 Rivian's Silicon & Physical AI Chipstrat

Dec 03 The end of the 2026 Semiconductor Cycle Semiconductor Business Intelligence

Dec 02 D2D Cont'd: Jensen Math Meets GAAP Accounting Digits to Dollars

Dec 01 Is Optics Really the Next Memory? Vik's Newsletter

Dec 01 TSMC Overseas Fabs – A Success? SemiAnalysis

November 2025

Nov 30 Week 48, 2025 The Semiconductor Newsletter

Nov 28 TPUv7: Google Takes a Swing at the King SemiAnalysis

Nov 26 Executive Brief: A Complete Guide to Optical Transceiver Nomenclature Vik's Newsletter

Nov 25 A Complete Guide to Optical Transceiver Nomenclature Vik's Newsletter

Nov 24 Market Volatility: Some Thoughts Fabricated Knowledge

Nov 24 The Circular Collapse Cult has Converted to Cudaism Semiconductor Business Intelligence

Nov 24 Week 47, 2025 The Semiconductor Newsletter

Nov 23 Intel's Foundry Problems and If America Can Still Build Institutions That Work Editorial

Nov 22 Nvidia Q3 Earnings Chipstrat

Nov 18 Crypto Mining ASIC Goes Deep Sub-Threshold On 3 nm EE Times

Nov 18 High-performance MCUs target industrial applications EDN

Nov 18 FIR temperature sensor delivers high accuracy EDN

Nov 18 GF Targets $1 Billion Silicon Photonics Revenue with AMF Acquisition EE Times

Nov 18 Intelligence Per Watt: Measuring Local Inference Viability, Studying 20+ Models, 8 HW Accelerators (Stanford Univ.) Semiconductor Engineering

Nov 18 Gadget Book: The Wireless Cookbook Electronics Weekly

Nov 18 Education robot suits nine-year-olds and under-graduates Electronics Weekly

Nov 18 III Advances E-Paper Technology Platform, Ushering in a New Era of ID Card Applications EE Times

Nov 18 CHIIPS #21 – IoT and RFID insights from Jim Guzzo of Impinj Electronics Weekly

Nov 18 Emerging Risks Electronics Weekly

Nov 18 Accuracy loss from PWM sub-Vsense regulator programming EDN

Nov 18 Amazon Pilots New Pedal-Assist Electric Delivery Vehicle IEEE Spectrum Semiconductors

Nov 18 Dutch Clampdown on Nexperia Puts Europe’s Chip Sovereignty Strategy to the Test EE Times

Nov 18 Productronica: 3.6kW precision lab power supply from R&S Electronics Weekly

Nov 18 Signal integrity and power integrity analysis in 3D IC design EDN

Nov 18 GlobalFoundries buys Singapore photonics foundry Electronics Weekly

Nov 18 Research Bits: Nov. 18 Semiconductor Engineering

Nov 18 Chip Industry Technical Paper Roundup: Nov. 18 Semiconductor Engineering

Nov 18 Zetwerk Pursues Component-Focused Manufacturing Strategy Amid India’s EMS Push EE Times

Nov 18 Arm to add NVLink to Neoverse Electronics Weekly

Nov 18 Quobly quantum emulator upgrade available Electronics Weekly

Nov 18 Imec tool revolutionises datacentre design Electronics Weekly

Nov 18 ESA selects SBQuantum for EO quantum sensors in space Electronics Weekly

Nov 18 Norton amplifiers: Precision and power, the analog way we remember EDN

Nov 17 Week 46, 2025 The Semiconductor Newsletter

Nov 17 Europe is Breaking Up with U.S. Cloud EE Times

Nov 17 Edge AI Safety: Agentic AI Architecture That Leverages 3D To Integrate A Dedicated Safety Layer (Princeton, HKUST, NC State Univ.) Semiconductor Engineering

Nov 17 Tariffs Will Not Solve America’s Copper Problem, Smarter Recycling Will EE Times

Nov 17 The First Ticket Pre-Purchasing System Was Created 65 Years Ago IEEE Spectrum Semiconductors

Nov 17 Mitigating Structural Defects During The Growth Of 2D vdW Chalcogenides By MBE (Penn State Univ.) Semiconductor Engineering

Nov 17 The Fosi Audio V3 Mono: A compelling power amp with a tendency to blow EDN

Nov 17 Microfluidics Could Be the Answer to Cooling AI Chips IEEE Spectrum Semiconductors

Nov 17 Edge AI powers the next wave of industrial intelligence EDN

Nov 17 GUC and Ayar Labs Partner to Advance Co- Packaged Optics for Hyperscalers EE Times

Nov 17 Kneron Launches KNEO Pi: A High-Performance Development Platform Powered by Next-Gen AI and IoT EE Times

Nov 17 Your Laptop Isn’t Ready for LLMs. That’s About to Change IEEE Spectrum Semiconductors

Nov 17 Edge AI Is Starting To Transform Industrial IoT Semiconductor Engineering

Nov 17 The ecosystem view around an embedded system development EDN

Nov 15 Students Compete—and Cooperate—in FIRST Global Robotics Challenge IEEE Spectrum Semiconductors

Nov 15 Understanding SkyWater Chipstrat

Nov 14 New Interconnect Materials Beyond Copper (Florida State Univ., Cornell) Semiconductor Engineering

Nov 14 This Soft Robot Is 100% Edible, Including the Battery IEEE Spectrum Semiconductors

Nov 14 Video Friday: DARPA Challenge Focuses on Heavy Lift Drones IEEE Spectrum Semiconductors

Nov 14 Are Synopsys Layoffs a Harbinger of the AI-Assisted Design Era? EE Times

Nov 14 Comparative Analysis of CFET and NSFET Architectures (TU Munich, IIT) Semiconductor Engineering

Nov 14 Apple’s Failed Foray Into Mac Clones IEEE Spectrum Semiconductors

Nov 14 Advanced Connector Technology Meets Demanding Requirements of Portable Medical Devices IEEE Spectrum Semiconductors

Nov 14 The role of motion sensors in the industrial market EDN

Nov 14 Lightning and trees EDN

Nov 14 Advanced Process Control In Semiconductor Manufacturing Semiconductor Engineering

Nov 14 Chip Industry Week in Review Semiconductor Engineering

Nov 13 Get to Know the IEEE Board of Directors IEEE Spectrum Semiconductors

Nov 13 Two Visions for the Future of AR Smart Glasses IEEE Spectrum Semiconductors

Nov 13 China’s Tech Giants Race to Replace Nvidia’s AI Chips IEEE Spectrum Semiconductors

Nov 12 How Do You Know Whether You Perceive Pain the Same as Others? IEEE Spectrum Semiconductors

Nov 12 Microsoft's AI Strategy Deconstructed - From Energy to Tokens SemiAnalysis

Nov 12 The Complicated Reality of 3D Printed Prosthetics IEEE Spectrum Semiconductors

Nov 11 The Silent Rotation Inside the Datacenter Semiconductor Business Intelligence

Nov 11 Be a Force for Good On Giving Tuesday IEEE Spectrum Semiconductors

Nov 10 Week 45, 2025 The Semiconductor Newsletter

Nov 10 DARPA and Texas Bet $1.4 Billion on a Unique Foundry IEEE Spectrum Semiconductors

Nov 09 Startup Using Nanotips and Naphthalene for New Satellite Thruster IEEE Spectrum Semiconductors

Nov 08 Master List - From Bitcoin to AI The Semiconductor Newsletter

Nov 07 D2D Cont'd: Game Theory Gone Wild Digits to Dollars

Nov 07 Qualcomm's Hexagon AI Accelerators The Chip Letter

Nov 07 IEEE WIE Podcast Focuses on Workplace Issues for Women in Tech IEEE Spectrum Semiconductors

Nov 07 Video Friday: This Drone Drives and Flies—Seamlessly IEEE Spectrum Semiconductors

Nov 06 Co-Captain Allows Ships to Share Important Navigational Data IEEE Spectrum Semiconductors

Nov 06 AMD & Apple Earnings Chipstrat

Nov 06 ClusterMAX™ 2.0: The Industry Standard GPU Cloud Rating System SemiAnalysis

Nov 05 AMD's Bottleneck Guidance? Semiconductor Business Intelligence

Nov 04 Master List - Datacenter Companies & Startups The Semiconductor Newsletter

Nov 04 The Four Horsemen: Google, Microsoft, Amazon, Meta Earnings Chipstrat

October 2025

Oct 29 How to Kill 2 Monopolies with 1 Tool SemiAnalysis

Oct 29 When Broadcom’s Customers Start Buying Chip Startups Chipstrat

Oct 28 D2D China: A Tale of Two Tiers of Cities Digits to Dollars

Oct 28 Did The Dutch Draw a Line — Or a Bottleneck? Semiconductor Business Intelligence

Oct 28 Earnings Recap So Far (And Ideas) Fabricated Knowledge

Oct 27 Will Eatherton: How Cisco Plans to Compete in the AI Datacenter Fabricated Knowledge

Oct 26 Nanoimprint Lithography: Stop Saying It Will Replace EUV SemiAnalysis

Oct 24 My Precious - TI’s Love Affair with Inventory. Semiconductor Business Intelligence

Oct 24 Intel Q3 2025 Earnings: Doing Fine Chipstrat

Oct 22 D2D Cont'd: Fear or Faith? Digits to Dollars

Oct 22 One Peak short of Twin Peaks Semiconductor Business Intelligence

Oct 22 SerDes Matters! Chipstrat

Oct 20 Quadruped State of The Market - Unitree, Boston Dynamics, ANYbotics, DEEP Robotics, and The Rising Application Ecosystem SemiAnalysis

Oct 19 Nexperia's Long History, Tangled Present and Uncertain Future The Chip Letter

Oct 17 TSMC Earnings and Intel Foundry Chipstrat

Oct 16 Not All Light Travels West Semiconductor Business Intelligence

Oct 15 Obsolescence The Chip Letter

Oct 15 An Interview With Mohamed Awad About Chiplets Chipstrat

Oct 13 Thriving or surviving? Semiconductor Business Intelligence

Oct 09 InferenceMAX™: Open Source Inference Benchmarking SemiAnalysis

Oct 07 REPORT: Securing European Chip R&D as Chinese Competition Intensifies Chip Capitols

Oct 07 The Tool Cool Trade Winds Semiconductor Business Intelligence

Oct 07 Right-Sized AI Infrastructure. Marvell XPUs Chipstrat

Oct 02 Where We Go From Here Fabricated Knowledge

Oct 01 D2D Cont'd: Is M&A Coming for Semis? Digits to Dollars

September 2025

Sep 26 China's AI Opportunity is (Still) Underappreciated SemiPractice

Sep 25 Micron FY25 Q4: Testing the Limits SemiPractice

Sep 22 Credo AECs Chipstrat

Sep 21 Arm's Chief Architect on the History of the Arm Architecture The Chip Letter

Sep 20 Beyond the $5B Inflection: Decoding the Intel–NVIDIA Partnership Across the Semiconductor Supply Chain SemiPractice

Sep 17 D2D: Huawei Deep Dive Digits to Dollars

Sep 16 xAI's Colossus 2 - First Gigawatt Datacenter In The World, Unique RL Methodology, Capital Raise SemiAnalysis

Sep 15 Oracle and Animal Spirits Fabricated Knowledge

Sep 14 The PC was never a true 'IBMer' The Chip Letter

Sep 10 D2D Cont'd: How Much is Left in the AI Trade? Digits to Dollars

Sep 10 Another Giant Leap: The Rubin CPX Specialized Accelerator & Rack SemiAnalysis

Sep 09 How Big was IBM? The Chip Letter

Sep 09 GPU Networking Basics Part 3: Scale-Out Chipstrat

Sep 08 Huawei Ascend Production Ramp: Die Banks, TSMC Continued Production, HBM is The Bottleneck SemiAnalysis

Sep 04 Lagging Edge will have a Permanent Glut Fabricated Knowledge

Sep 03 Amazon’s AI Resurgence: AWS & Anthropic's Multi-Gigawatt Trainium Expansion SemiAnalysis

Sep 02 D2D China: Walking the Tightrope Digits to Dollars

Sep 01 Chips & Wafers is Joining SemiAnalysis Chips & Wafers

August 2025

Aug 27 Intel in Oz The Chip Letter

Aug 25 Foundry Idea(s) Fabricated Knowledge

Aug 21 D2D Cont'd: Intel and the Foundry State of Play Digits to Dollars

Aug 20 Building the Chiplet Ecosystem Chipstrat

Aug 20 H100 vs GB200 NVL72 Training Benchmarks - Power, TCO, and Reliability Analysis, Software Improvement Over Time SemiAnalysis

Aug 15 Intel's One True Stakeholder is Here Fabricated Knowledge

Aug 15 Eliyan: The Ultimate Chiplet Interconnect Chipstrat

Aug 13 GPT-5 Set the Stage for Ad Monetization and the SuperApp SemiAnalysis

Aug 12 Scaling the Memory Wall: The Rise and Roadmap of HBM SemiAnalysis

Aug 11 D2D Cont'd: The Quest for Returns Digits to Dollars

Aug 11 Earnings: Hyperscalers, AMD, ALAB, ANET Fabricated Knowledge

Aug 06 Source Control The Chip Letter

Aug 06 AWS Is Missing the AI Infra Moment Chipstrat

Aug 05 D2D Cont'd - Earnings is Upon Us Digits to Dollars

Aug 01 All Things Test, META/MSFT Earnings, TSLA<>Samsung Deal & 1K Milestone Chips & Wafers

July 2025

Jul 31 Semiconductor Test: A Compelling Investment Theme Chips & Wafers

Jul 30 Why GenAI is Good for Google Chipstrat

Jul 30 Robotics Levels of Autonomy SemiAnalysis

Jul 28 D2D Cont'd - Intel and the Wide Open Barn Doors Digits to Dollars

Jul 26 Turing Award Histories The Chip Letter

Jul 25 Chips & Wafers Data Predictions, Packaging Perspectives, Google Q2 & AEHR Reemergence Chips & Wafers

Jul 25 Packaging Perspectives: ASMPT, BESI & KLIC Chips & Wafers

Jul 25 Earnings: TSMC, NXPI, AEHR, GOOG, TXN, VAT, VICR Fabricated Knowledge

Jul 23 TSMC Q2 Review Chips & Wafers

Jul 22 Nvidia's Climb to $4T and the Peaks Ahead Chipstrat

Jul 22 TSMC Q2 FY 2025 Earnings: Too Impressive To Be True SemiPractice

Jul 21 D2D China: PRC SOEs Are Not Known for Their Risk Appetites Digits to Dollars

Jul 21 Intel 18A Details & Cost, Future of DRAM 4F2 vs 3D, Backside Power Adoption (or Not), China's FlipFET, Digital Twins from Atoms to Fabs, and More SemiAnalysis

Jul 19 MIPS The Chip Letter

Jul 18 ASML Outlook Observations, TSMC Q2 Recap, Intel & Samsung Culture Woes, More on Mainstream Chips & Wafers

Jul 18 ASML Q2 FY 2025 Earnings — Strong Demand, but Outlook Clouded by Future Uncertainty SemiPractice

Jul 15 Software Follow Up Fabricated Knowledge

Jul 15 Implications of the H20 Ban Lift — Impact on NVIDIA, B30/H20 Upsides, AMD and Policy Outlook SemiPractice

Jul 14 D2D Cont'd - Everything is an AI Trade Digits to Dollars

Jul 11 Taiwan Revenues, TSMC Q2 Preview, AEHR SiC Read-Across, GPU Depreciation Discussion Chips & Wafers

Jul 11 Meta Superintelligence - Leadership Compute, Talent, and Data SemiAnalysis

Jul 10 Intel’s 18A: Misstep or First Step? Chipstrat

Jul 10 AI is Creating Peak Software, Media is the Best Analogy Fabricated Knowledge

Jul 08 ABF Substrates – Signs of a Mainstream Demand Recovery? Chips & Wafers

Jul 07 A Conversation with Val Bercovici about Disaggregated Prefill / Decode Fabricated Knowledge

Jul 04 China WFE Exposure, MKS Cover-Up, On-Chip Cooling & All Things Substrates Chips & Wafers

Jul 03 DeepSeek Debrief: >128 Days Later SemiAnalysis

Jul 02 Thinking Bots + Nvidia’s Robotics Play Chipstrat

June 2025

Jun 30 Mainstream... Recovery? Chips & Wafers

Jun 30 Renesas's Wolfspeed Bath and Micron Earnings Fabricated Knowledge

Jun 30 How Oracle Is Winning the AI Compute Market SemiAnalysis

Jun 27 Apple WMCM, Renesas & Wolfspeed, TSMC Wafer ASP's & Mainstream... Recovery? Chips & Wafers

Jun 25 AI Training Load Fluctuations at Gigawatt-scale - Risk of Power Grid Blackout? SemiAnalysis

Jun 24 AMD's Strategic Bets Chipstrat

Jun 23 D2D Cont'd - Is the analog cycle turning? Digits to Dollars

Jun 23 Chiplet Alliance Wars, Samsung HBM Resurgence, BESI CMD Analysis, C&W June Data Book Chips & Wafers

Jun 23 NVIDIA Tensor Core Evolution: From Volta To Blackwell SemiAnalysis

Jun 19 BESI Investor Day – A Closer Look Behind the Optimism Chips & Wafers

Jun 18 Huang's Law The Chip Letter

Jun 16 D2D China: M&A Floodgates are Opening Digits to Dollars

Jun 16 WWDC25: Apple’s Playing a Different Game Chipstrat

Jun 16 Semicap Stock Idea Fabricated Knowledge

Jun 13 New CoWoS-L Supplier, BESI CMD Spaces, Intel EMIB-T Flaw, Pegatron US Investment Chips & Wafers

Jun 10 D2D Cont'd - The Response to our Nvidia Call Digits to Dollars

Jun 09 Applied Digital, Defense Semiconductors, and 1998 Fabricated Knowledge

Jun 06 Technoprobe Rally, EDA Restrictions, GloFo Investments & 𝕏 Spaces Debut Chips & Wafers

Jun 05 The End of Simplification: Intel Abandons X86S The Chip Letter

Jun 03 Captured? Nvidia and China Chips & Wafers

Jun 02 D2D Cont'd Digits to Dollars

May 2025

May 30 Nvidia Earnings, High-NA Pushout, Material Shortages & Hybrid Bonding Commoditization Chips & Wafers

May 27 Apple In China The Chip Letter

May 27 NVLink Fusion: Embrace, Extend, Extinguish Fabricated Knowledge

May 23 NVLink Fusion Moat, Ajinomoto Guidance, Mobile HBM, C&W April Data Book Chips & Wafers

May 20 Personal Computer Origins: The Datapoint 2200 The Chip Letter

May 19 The Hybrid Bonding Wars Chips & Wafers

May 19 China's Race to The Bottom: Margin Zero Fabricated Knowledge

May 15 Markdown and Substack - A Bear Workflow The Chip Letter

May 12 Earnings: AMD, CDW, STRL, ONTO, WOLF, MCHP, SITM Fabricated Knowledge

May 05 Earnings: FIX, Advantest, AAPL, MSFT, AMZN, META, MPWR, TOLEY, TER, QRVO Fabricated Knowledge

April 2025

Apr 29 The Three Tariff Problem Fabricated Knowledge

Apr 25 Analysis: China Exempted Tariffs on U.S. Chip Imports amid Peaked U.S.-China Trade Tension SemiPractice

Apr 19 AI Servers and Tariffs: Concerns Overstated, Impact Likely Limited SemiPractice

Apr 19 Short Note on Section 232 Investigation and Semiconductor. SemiPractice

Apr 14 D2D China: Not Tariff-ied Digits to Dollars

March 2025

Mar 25 China’s SME Industrial Policy in 10 Charts Chip Capitols

Mar 18 China’s SME Industrial Policy in 10 Charts Chip Capitols

Mar 04 China’s SME Industrial Policy in 10 Charts Chip Capitols

February 2025

Feb 25 China’s SME Industrial Policy in 10 Charts Chip Capitols

Feb 10 "Emergency Analysis": TSMC's Critical Week Ahead SemiPractice

Feb 06 What TSMC’s Recent CoWoS Capacity Reveals? SemiPractice

October 2024

Oct 14 Chip Island: How TSMC and Taiwan Triumph Chip Capitols

Oct 08 REPORT: China’s Mature Node Overcapacity Chip Capitols

June 2024

Jun 03 REPORT: Europe’s Strategic Push in the Semiconductor Race Chip Capitols

May 2024

May 30 OP-ED: To win the chip war, the U.S. must prioritize revolutionary research Chip Capitols

April 2024

Apr 22 REPORT: How to Make the NSTC a Moonshot Success Chip Capitols

Apr 11 Japanese Chip Policy in an "Economic National Security" Era Chip Capitols

February 2024

Feb 26 Podcast with Siècle Digital Chip Capitols

December 2023

Dec 05 Chipmaking Amid War in Israel Chip Capitols

October 2023

Oct 12 Biden Admin’s CHIPS Guardrails Caught Between Labor Hawks and Industry Doves Chip Capitols

September 2023

Sep 28 China Boosts Semiconductor Subsidies as US Tightens Restrictions Chip Capitols

Sep 19 US Chipmakers March South as Vietnam Subsidizes Its Tech Future Chip Capitols

Sep 13 French Chip Research Institutes, A Model for EU Tech Sovereignty? Chip Capitols

Sep 07 South Korea’s Semiconductor Funds Highlight a Partisan Battle Chip Capitols

May 2023

May 23 Taiwan vs US Chip Subsidies – Bolstering the Sacred Mountain Chip Capitols

May 16 Hollowing Out Taiwan Chip Capitols

November 2022

Nov 03 Navi 31 Die Shot Angstronomics

September 2022

Sep 28 Monolithic Sapphire Rapids Angstronomics

Sep 25 PS5 Refresh: Oberon Plus Angstronomics

Sep 23 Apple A16 Die Analysis Angstronomics

Sep 02 USB4 v2 Angstronomics

August 2022

Aug 29 Ryzen 7000 Desktop Preview Angstronomics

Aug 12 AMD's RDNA 3 Graphics Angstronomics

June 2022

Jun 26 The TRUTH of TSMC 5nm Angstronomics

May 2022

May 30 Computex: Beyond the Coverage Angstronomics

May 23 Site Launch Exclusive: All the Juicy Details on AMD's Quirky Chipset Solutions for AM5! Angstronomics

May 21 Angstronomics: The Future of Semi Angstronomics

Browse

Hot Topics