All News

EPC91121 BLDC motor drive evaluation board introduced, using EPC’s Gen-7 40V GaN technology

In booth #1935 at the IEEE Applied Power Electronics Conference (APEC 2026) in San Antonio, TX, USA (22–26 March), Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications —...

The Multi-Silicon Era Is Here

Disagg is out of the bag. What it means for Nvidia, CPUs, XPUs, startups, and more.

SemiQ launches QSiC Dual3 family of 1200V half-bridge MOSFET modules

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has launched the QSiC Dual3, a family of 1200V half-bridge MOSFET modules for motor drives in data-center cooling systems, grid converters in energy...

Renesas adds GaN-based half-wave LLC platform to AC/DC and power adapter range

Renesas Electronics Corp of Tokyo, Japan has expanded its suite of AC/DC and power adapter solutions with a new gallium nitride (GaN)-based half-wave LLC (HWLLC) platform that supports 500W-or-higher operation across IoT, industrial and infrastructure systems...

Week 12, 2026

The Semiconductor Newsletter

Beyond Moore’s Law: High-NA EUV Lithography Redefines Advanced Chip Manufacturing

  The imec installation of the ASML EXE:5200 High Numerical Aperture (High NA) extreme ultraviolet (EUV) lithography system at imec represents a pivotal advancement in semiconductor manufacturing and research. This system, installed in imec’s 300 mm cleanroom in Leuven, Belgium, introduces unprecedented lithographic… Read More The post Beyond Moore’s Law:...

Daily: Elon Musk wants a chip fab

6 min read.

Data Analytics Helps Make The Mighty Lionesses Roar

Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More The post...

Transforming Data Science With NVIDIA RTX PRO 6000 Blackwell Workstation Edition

This is a sponsored article brought to you by PNY Technologies.In today’s data-driven world, data scientists face mounting challenges in preparing, scaling, and processing massive datasets. Traditional CPU-based systems are no longer sufficient to meet the demands of modern AI and analytics workflows. NVIDIA RTX PROTM 6000 Blackwell Workstation Edition...

Commodity, Until It Isn’t

Microns Result and The Rapid Transformation of the Semiconductor Memory Market

How GlobalFoundries Takes AI from Pilot to Global Scale

As AI moves from pilot projects to factory-wide deployment, GlobalFoundries’ VP of digital manufacturing explains in an exclusive interview how to decide what truly scales across global fabs. The post How GlobalFoundries Takes AI from Pilot to Global Scale appeared first on EE Times.

A scale that tells inconsistent-weight tales

When a bathroom scale gives you multiple different weight-measurement results, is it cheating if you pick the lowest outcome? The post A scale that tells inconsistent-weight tales appeared first on EDN.

Ayar Labs and Wiwynn partner on CPO for rack-scale AI systems

Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — and Wiwynn Corp of Taipei, Taiwan, a cloud IT infrastructure provider for data centers, have announced a strategic partnership to deliver optically connected, rack-scale AI systems...

Why Thermal Metrology Must Evolve for Next-Generation Semiconductors

An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver.What Attendees will LearnWhy heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted...

Embedded: Security-infrastructure updates for Open VSX Registry

The Eclipse Foundation announced updates to the Open VSX Registry, its vendor-neutral extension registry for tools built on the VS Code extension API. The registry is used in AI-enabled and ... The post Embedded: Security-infrastructure updates for Open VSX Registry appeared first on Electronics Weekly.

OpenLight showcases III-V heterogenous integrated silicon photonics innovations and production capabilities

At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated...

OpenLight and TFC advance silicon photonics back-end integration supporting up to 400G data rates on TGV substrate

Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced continued progress in its ecosystem partnership with...

U.K. Photonics: Innovation, Investment, and the IP Landscape

U.K. photonics startups surge with investment and patents. The post U.K. Photonics: Innovation, Investment, and the IP Landscape appeared first on EE Times.

GPS-free systems to spur highly advanced sensors, fusion

It will be fascinating to see which GPS alternatives, if any, take a dominant role in non-GPS settings, or will it be a balanced fusion? The post GPS-free systems to spur highly advanced sensors, fusion appeared first on EDN.