All News

Latest semiconductor industry news and analysis

Page 31 of 34
Semiconductor Engineering

Optimizing In-Memory AI Accelerators Across Multiple Workloads (KAUST, Compumacy)

Mar 07, 2026

Researchers from KAUST and Compumacy for Artificial Intelligence Solutions have released “Joint Hardware-Workload Co-Optimization for In-Memory Computing Accelerators”. Abstract “Software-hardware co-design is essential for optimizing in-memory computing (IMC) hardware accelerators for neural networks. However, most existing optimization frameworks target a single workload, leading to highly specialized hardware designs that do not...

EE Journal

STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere

Mar 06, 2026

STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density Increased performance with cost efficiency Comprehensive ecosystem to enhance end-device capabilities and accelerate time to market Mar 5, 2026 (Geneva, Switzerland) — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has...

EE Journal

Keysight Demonstrates 5G-Advanced AI-Powered Channel State Information Compression and Paves the Way for 6G

Mar 06, 2026

SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS) has collaborated with Qualcomm Technologies, Inc. to demonstrate machine learning (ML)-based Channel State Information (CSI) compression to enhance link adaptation efficiency in advanced Multiple-Input Multiple-Output (MIMO) systems at Mobile World Congress (MWC) Barcelona 2026. In a controlled lab validation, the ML-based CSI feedback...

EE Journal

Rohde & Schwarz and Realtek demonstrate first test solution for Bluetooth® LE High Data Throughput (HDT)

Mar 06, 2026

Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth® LE High Data Throughput (HDT) feature. The companies will jointly showcase the setup based on the CMP180 radio communication tester from Rohde & Schwarz, characterizing Realtek’s next generation Bluetooth® solution RTL8922D and...

EE Journal

Infineon launches TEGRION™ SLI22 automotive security controller with post-quantum cryptography certified to Common Criteria EAL6+

Mar 06, 2026

Munich, Germany – 03 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 28nm TEGRION™ SLI22, the latest innovation in automotive security controllers, designed to protect the future of connected systems. With its Common Criteria (CC) certification at the German Federal Office for Information Security (BSI)...

EE Journal

TANAKA Develops World’s First High-Performance Palladium Hydrogen Permeable Membrane Exhibiting High Hydrogen Purification Performance at Temperatures around 100 degrees C

Mar 06, 2026

TOKYO, Mar 5, 2026 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced the successful development of “HPM-L111”, the world’s first metal*1 palladium (Pd) hydrogen permeable membrane capable of...