Chips designed for Artificial Intelligence workloads – ranging from AI accelerators in data centers to edge AI chips. This includes GPUs and TPUs in training servers, inference accelerators (ASICs like Google TPU, Intel Habana, etc.), and AI SoCs in mobile and IoT. AI chips are optimized for parallel matrix operations and often use lower-precision arithmetic to achieve high performance on neural network tasks.
229 articles
Telecom operators are updating 5G infrastructure with AI and preparing for 6G. The post At MWC, Intel Outlines CPU-Driven Case for Telecom Networks appeared first on EE Times.
Why Lumentum & Coherent Rallied, and What 1.6T - 3.2T + CPO Means for Semiconductors
SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS) has collaborated with Qualcomm Technologies, Inc. to demonstrate machine learning (ML)-based Channel State Information (CSI) compression to enhance link adaptation efficiency in advanced Multiple-Input Multiple-Output (MIMO) systems at Mobile World Congress (MWC) Barcelona 2026. In a controlled lab validation, the ML-based CSI feedback...
Monheim am Rhein, Germany — March 5, 2026 — The STM32C5 series is the newest edition to STMicroelectronics’s widely adopted STM32 family of microcontrollers. Arm® Cortex®-M33-based and general purpose in nature, the STM32C5 series is simple, efficient, cost effective, and designed to address the needs of next-generation embedded and Artificial Intelligence of Things applications....
Hsinchu, Taiwan, March 5th, 2026 – oToBrite, a provider of Vision AI solutions for unmanned vehicles, off-highway machines, and robotics, today announced two plug-and-play GMSL2 camera enablement kits for NVIDIA Jetson Orin Nano and NVIDIA Jetson AGX Orin developer kits. Each kit combines a rugged oToBrite GMSL2 camera adapter built around an ADI/MAXIM MAX96724 deserializer with the corresponding NVIDIA Jetson developer kit in...
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the...
Inside a cavernous hall at the Swiss-French border, the air hums with high voltage and possibility. From his perch on the wraparound observation deck, physicist Walter Wuensch surveys a multimillion-dollar array of accelerating cavities, klystrons, modulators, and pulse compressors—hardware being readied to drive a new generation of linear particle accelerators.Wuensch...
The telecom sector is divided on radio access network architecture. The post Nvidia Advances AI-Native Strategy at MWC appeared first on EE Times.
There's Rohm licensing TSMC’s GaN process technology, Nvidia building 6G wireless networks, and RS Group buying a specialist distributor of industrial automation and control. The post Most Read – RS buys BPX, Nvidia photonics, AI-RAN in 6G appeared first on Electronics Weekly.
In the first two months of 2026, AI startups have attracted $220 billion, with $189 billion raised in February alone, says a report from BestBrokers.com. This is almost three times ... The post AI startups pull in $220 billion in Jan/Feb 2026 appeared first on Electronics Weekly.
Original Article By SemiVision Research [Reading time: 15 mins]
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced what it claims is the industry’s first commercially available 10kV SiC power MOSFET. The firm says this unlocks architectural freedom, delivering unprecedented system durability, and advancing access to reliable and...
Nordic expands its ultra-low-power cellular IoT portfolio with Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI. The post Nordic debuts multiple cellular IoT products appeared first on EDN.
There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More...
Researchers from KAUST and Compumacy for Artificial Intelligence Solutions have released “Joint Hardware-Workload Co-Optimization for In-Memory Computing Accelerators”. Abstract “Software-hardware co-design is essential for optimizing in-memory computing (IMC) hardware accelerators for neural networks. However, most existing optimization frameworks target a single workload, leading to highly specialized hardware designs that do not...
Researchers from University of Illinois Urbana-Champaign, UCLA, Stanford University, Nvidia, Google, et al. have released “AI+HW 2035: Shaping the Next Decade”. Abstract “Artificial intelligence (AI) and hardware (HW) are advancing at unprecedented rates, yet their trajectories have become inseparably intertwined. The global research community lacks a cohesive, long-term vision to...
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNAEnjoy today’s videos! The functional replication...
AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared first on Semiconductor...
A simmering dispute between the United States Department of Defense (DOD) and Anthropic has now escalated into a full-blown confrontation, raising an uncomfortable but important question: who gets to set the guardrails for military use of artificial intelligence — the executive branch, private companies or Congress and the broader democratic...
Raquel Urtasun has spent 16 years in the self-driving space, long enough to navigate every metaphorical glorious hill and plunging valley. She took the trip from the early “pipe dream” dismissals, to the “we’re this close” certainty, and back again.The industry is now riding a new wave of optimism and...
In this week’s Fish Fry we’re casting our line into one of the most transformative shifts happening in the automotive industry today: the rise of software-defined systems! Nitish Rao from MathWorks and I take a closer look at which vehicle functions are best handled by AI-driven systems, and which still...
Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are...
Hybrid Voice AI combines on-device reflex processing with cloud reasoning to create reliable, always-available smart home voice control. The post Designing the voice AI stack: Integrating spatial hearing AI with edge-based intent gating appeared first on EDN.
Geopolitics and the battle between GPUs and CPUs is defining the future of 6G and telco economics. The post MWC 2026 Concludes as Telcos Pivot to AI appeared first on EE Times.
Data infrastructure semiconductor solutions provider Marvell Technology Inc of Santa Clara, CA, USA and Mojo Vision Inc of Cupertino, CA, USA — which is pioneering a wafers-in, wafers-out micro-LED platform designed to enable AI applications — have announced a long-term collaboration to develop a new class of optical interconnect solutions...
Original Artcle By SemiVision Research [Reading time: 10mins]
Original Article By SemiVision Research [Reading time: 25 mins]
Taiwan remains the semiconductor industry's stronghold in 2026, with a tech roadmap aimed at next-generation AI systems. The post The Silicon Hegemon appeared first on EE Times.
Inference-centric design. ROIC is clear. Implications for the industry.
Engineering is so much more than solving problems or writing efficient code. It is about creating solutions that affect billions of lives and contributing to a profession built on innovation, responsibility, and collaboration. Although technical skills remain critical, what truly will accelerate the growth of the next generation of engineers...
TI’s MSPM0G5187 and AM13E23019 MCUs integrate the TinyEngine NPU, enabling efficient edge AI in systems ranging from simple to complex. The post TinyEngine NPU powers AI in TI MCUs appeared first on EDN.
The i.MX 93W applications processor from NXP combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. The post Edge AI SoC integrates tri-radio appeared first on EDN.
Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.
Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interconnects with integrated nanolasers for next-generation computing) have announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300mm integrated photonics process...
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner
Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More The post...
OXFORD, England-March 10, 2026-Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch. Designed to unlock peak performance in AI datacenters, Salience Labs’ all-optical switch technology improves network latency, throughput and reliability metrics while...
TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD...
Every generation of mobile networks, from 1G to 5G, has rewritten the rules of how the world lives and works. The coming 6G revolution, by decade’s end, will represent a new direction still, toward a universal data fabric where millions of agents collaborate in real-time across the digital and physical...
As AI systems scale from single-rack scale-up network systems to multi-rack configurations up to thousands of AI processors, copper interconnects have reached their limits in speed, density and reach. Future scale-up networks require an optical architecture that delivers higher bandwidth density at lower power with maximum processor utilization...
At MWC, Ericsson is all about AI-native networks, aiming to nail down 6G by 2029. The post At MWC, Ericsson Details AI-Native 6G Timeline appeared first on EE Times.
Original Article By SemiVision Research [Reading time: 10 mins]
Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.
In 2025 IEEE launched its first virtual career fair to help strengthen the engineering workforce and connect top talent with industry professionals. The event, which was held in the United States, attracted thousands of students and professionals. They learned about more than 500 job opportunities in high-demand fields including artificial...
This article is crossposted from IEEE Spectrum’s careers newsletter. Sign up now to get insider tips, expert advice, and practical strategies, written in partnership with tech career development company Parsity and delivered to your inbox for free!How to Keep Your Engineering Skills Sharp in an AI WorldEngineers today are caught...
March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)– Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer...
First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement Pre-certified designs simplify wireless certification, eliminating RF complexity...
CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Kudelski Group (SIX:KUD.S) and a global leader in embedded security for semiconductors and connected devices, today announced that Axelera AI has integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new high-performance, Edge AI processing platform. The collaboration strengthens the security foundation of Europa, ensuring that...
Strategic focus on custom silicon allows operators to manage 5G costs preparing for 6G and AI-driven data surge. The post Arm Positions Neoverse for AI and Telco Networks at MWC appeared first on EE Times.
In April of 2025, OpenAI released a new version of GPT-4o, one of the AI algorithms users could select to power ChatGPT, the company’s chatbot. The next week, OpenAI reverted to the previous version. “The update we removed was overly flattering or agreeable—often described as sycophantic,” the company announced. Some...
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) says that its strategic LiDAR (light detection and ranging) customer has incorporated its technology across their platforms and will ramp production from fourth-quarter 2026 for automotive and industrial applications....
In booth 339 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (16–19 March), POET Technologies Inc of Toronto, Ontario, Canada –– which designs and implementats highly integrated optical engines and light sources for artificial intelligence networks –– is giving live demonstrations of...
La Luce Cristallina of Austin, TX, USA says that the beta-version of its 200mm (8-inch) barium titanate (BaTiO3) wafer is now available to customers for evaluation in advanced electro-optic modulators for telecoms and datacoms applications. By enabling ultra-low-voltage operation, La Luce Cristallina’s BaTiO3 platform is said to advance co-packaged optics...
Open-source AI and small language models challenge costly closed systems. The post Open-Source AI Gains Ground as Rising Costs Push Shift to Smaller Models appeared first on EE Times.
New architectures pose new challenges but AI may help to provide solutions and break down barriers
Humanoid robots stun at AW 2026, showing off embodied AI breakthroughs. The post Humanoid Robots Exit Labs: Mapping the Technical Path to Embodied AI at AW 2026 appeared first on EE Times.
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade...
SummaryFully homomorphic encryption (FHE) allows computing on encrypted data without decryption, but it’s currently slow on standard CPUs and GPUs.Intel’s Heracles chip accelerates FHE tasks up to 5,000 times faster than top Intel server CPUs.Heracles uses a 3-nanometer FinFET technology and high-bandwidth memory, enabling efficient encrypted computing at scale.Startups and...
NVIDIA of Santa Clara, CA, USA and materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA have announced a multi-year strategic agreement to advance the frontier of advanced optics technologies, including manufacturing capacity and R&D, to enable next-generation AI infrastructure...
Announced today at Embedded World, Synaptics claims the SYN765x as the first AI-native connected MCU with Wi-Fi 7, Bluetooth 6.0, and 802.15.4. It features a Cortex-M52 and Ethos-U55 NPU.
Original Article By SemiVision Research [Reading time: 15 mins]
4 min read.
Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.
Large–Small Company Linkages in the AI Infrastructure Stack
Synopsys leverages AI agents and digital twins to slash automotive software validation times. The post Synopsys Bets on AI Agents to Power Automotive Digital Twins appeared first on EE Times.
The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More The post Synopsys Explores AI/ML Impact on...
The biosphere transmits data 9 orders of magnitude faster than the technosphere. A new class of nanophotonic tools is beginning to close that gap.In this webinar, Prof. Dionne will present VINPix: Si-photonic resonators with high-Q factors (thousands to millions), subwavelength mode volumes, and densities exceeding 10M/cm². Combined with acoustic bioprinting...
Original Article By SemiVision Research [Reading time: 8 mins]
AI is impacting semiconductor design in terms of workflows, new roles, and unique data management challenges. The post AI Design Reshapes Data Management appeared first on Semiconductor Engineering.
Ethernet switch sales in AI back-end networks more than tripled and accounted for more than two-thirds of datacentre switch sales in AI clusters during 2025, says Dell’Oro. “The growing size ... The post Ethernet takes two thirds of datacentre switch sales appeared first on Electronics Weekly.
The post CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin. appeared first on Electronics Weekly.
Mohammad Rastegari is a prominent AI researcher and entrepreneur currently serving as the CEO and Co-Founder of Elastix.AI. Based in the Greater Seattle Area, he also holds the position of Affiliate Assistant Professor at the University of Washington’s Electrical & Computer Engineering Department. His professional… Read More The post CEO...
Original Article By SemiVision Research [Reading time: 20 mins]
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNAEnjoy today’s videos! All legged robots...
Discover the biggest trends in physical AI and robotics from Embedded World 2026. The post Embedded World 2026 Wrap: Key Highlights appeared first on EE Times.
The speed at which accelerators can be fed with data has become just as critical as raw compute capability. The post HBM4E Raises The Bar For AI Memory Bandwidth appeared first on Semiconductor Engineering.
The long-term objective is to let engineers spend more time on what really matters and less time on manual coordination. The post Human-Centered Agentic AI Comes To RTL Verification appeared first on Semiconductor Engineering.
Co-packaged optics technology will have a big impact on system power and the cost of data movement. The post CPO Is Extending The Limits Of What’s Possible In AI Data Centers appeared first on Semiconductor Engineering.
Achieve low-latency, human-like dialogue without sending data outside the local environment. The post Rethinking Voice AI At The Edge: A Practical Offline Pipeline appeared first on Semiconductor Engineering.
Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem. The post AI Power on the Edge appeared first on Semiconductor Engineering.
Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens’ complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off, increasing engineering efficiency and design quality Builds on top of the Fuse EDA AI system, which provides an advanced retrieval-augmented generation (RAG) framework, multimodal EDA data support, secure...
At a workshop in Boston on February 27, something subtle but important happened. Developers sat down in front of a RISC-V laptop, installed Fedora, and ran a local large language model. No simulation. No dev board tethered to a monitor. A laptop. For more than a decade, RISC-V advocates have...
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic partnership with optical communication device, module and subsystem maker O-Net Technologies (Group) Co Ltd of Shenzhen, China and Enablence Technologies Inc of Ottawa, Ontario, Canada...
Edge AI, robotics, and digital twins are converging to enable physical AI-driven manufacturing systems. The post From DX to AX: AW 2026 Signals the Rise of Autonomous Manufacturing appeared first on EE Times.
As electronics demand higher energy density, one component has proved challenging to shrink: the capacitor. Making a smaller capacitor usually requires thinning the dielectric layer or electrode surface area, which has often resulted in a reduction of power. A new polymer material could help change that.In a study published 18...
I think most of us have come to appreciate how incredibly useful AI can be, and it’s getting more efficacious every day. The funny thing is that it’s becoming harder to remember a time before AI (much like younger people being unable to visualize a world without high-definition flat-screen TVs,...
Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has announced its latest DC–DC power delivery board (PDB) powered by GaNFast technology, enabling direct conversion from 800V to 6V in one power stage. This eliminates the traditional...
NVIDIA today announced the NVIDIA Vera Rubin platform is opening the next frontier of agentic AI, with seven new chips now in full production. They are: the NVIDIA Vera CPU, ... The post Nvidia announces seven Vera Rubin chips in volume production appeared first on Electronics Weekly.
Step-by-step application of AI in EDA. The post How AI Will Automate Chip Design appeared first on Semiconductor Engineering.
Embedding AI agents to improve productivity without sacrificing reliability. The post Human-Centered Agentic AI Workflows For RTL Verification appeared first on Semiconductor Engineering.
Photonics: Ski jump structure; on-chip nanolasers; neural networks. The post Research Bits: Mar. 17 appeared first on Semiconductor Engineering.
Industrial robotics leap into physical AI, empowering factories with real-time smarts. The post Industrial Robotics Drive Shift Toward Physical AI appeared first on EE Times.
Original Article By SemiVision Research [Reading time: 30 mins]
7.5 min read.
Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.
Secure, reliable real-time data processing and transport solutions for next-generation physical AI applications, developed in collaboration with NVIDIA NVIDIA humanoid robotics solutions integrated into NXP’s safe, secure edge portfolio cut development costs and speed time to market First in a series of NXP’s foundational robotics solutions designed to accelerate physical...
Embedded World 2026 reveals rising AI integration challenges. The post Embedded World 2026 Confronts Mounting Integration Complexity appeared first on EE Times.
In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...
A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was published by researchers at RWTH Aachen University and RIF e.V. Abstract “Artificial intelligence (AI) has emerged as a pivotal technology for autonomous systems across various domains, but quality assurance remains challenging due to...
The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More The post AI-Driven Automation in Semiconductor Design: The Fuse...
The America’s Talent Strategy: Building the Workforce for the Golden Age report, published last year by the U.S. Departments of Commerce, Education, and Labor, identified a significant engineering and skills gap. The 27-page report concluded that the shortage of talent in essential areas—including advanced manufacturing, artificial intelligence, cloud computing, and...
AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
The March 2026 Edition of EE Times Europe Magazine analyzes how AI is transforming factory automation and operations and reviews Europe's de-risking semiconductor strategy. The post EE Times Europe Magazine – March 2026 appeared first on EE Times.
A new technical paper, “Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems,” was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract “Rapid progress in generative AI has given rise to Compound AI systems – pipelines comprised of...
Wheelchair users with severe disabilities can often navigate tight spaces better than most robotic systems can. A wave of new smart-wheelchair research, including findings presented in Anaheim, Calif., earlier this month, is now testing whether AI-powered systems can, or should, fully close this gap.Christian Mandel—senior researcher at the German Research...
The rapid ascent of artificial intelligence and semiconductor manufacturing has created a paradox: Industries are booming yet they face a critical shortage of skilled workers. Demand for data center technicians, fabrication facility workers, and similar positions is growing. There aren’t enough candidates with the right skill sets to fill the...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced the first volume production orders by...
Synaptics is introducing its SYN765x single-chip device for using AI at the edge with smart IoT devices. It combines support for real-time intelligence with integrated Wi-Fi 7, aiming at battery-powered ... The post Synaptics SYN765x integrates Wi-Fi 7 and AI for smart devices appeared first on Electronics Weekly.
Jensen Huang was crowned 'The Inference King' with Groq-powered Rubin CPUs, unveiling dramatic architectural leaps at GTC this year. The post GTC 2026 Keynote: Long Live the Inference King appeared first on EE Times.
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique...
WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration...
My podcast guest this week is Ferric CEO Noah Sturcken. Noah and I discuss how Ferric’s innovations—specifically their ferromagnetic materials and on-chip power converters—are addressing the critical power, efficiency, and integration hurdles facing today’s AI processors. We also explore how IVRs enable higher instantaneous power delivery, simplify board design, and...
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by...
Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots Infineon enables the key functional blocks...
10 min read.
Hot takes from the AI oven.
the most read stories on our website cover TI's 800V DC power architecture for AI data centers, a quantum‑centric supercomputing reference architecture and Honda cancelling EV models. The post Most Read – Honda cancels EVs, IBM quantum blueprint, Elon Musk fab appeared first on Electronics Weekly.
HBM4 deal; war's impact on supply chain; U.S. AI framework; GPU smuggling; restart of H200 processors for China; SK hynix's memory prediction; TFLN photonics deal; test and metrology platforms; NoC verification automation; Tesla probe; AI distillation attacks. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
Datacentre capex increased 57% in 2025 as AI deployments, complemented by general infrastructure investments, accelerated, says Dell’Oro, which expects hyperscalers and AI model developers to sustain strong capex momentum in ... The post 2025 datacentre capex up 57% appeared first on Electronics Weekly.
The rapid proliferation of LLMs and other AI applications, and of high-end GPU platforms that run them, is putting intense pressure on the performance requirements for memory technologies. Designers need to be keenly aware of how to make the most of their memory and controller choices, which can be moving...
Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers. The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.
Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI data centers. The post Buck ICs improve AI data center power appeared first on EDN.
Each year, the construction industry builds $2.1 trillion worth of structures in the U.S., and more than three-quarters of those projects face delays, according to the Associated General Contractors of America. One solution could be robots. Virginia Tech researchers, in collaboration with Procon Consulting, are developing a coordinated team of...
Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More The post Siemens...
One morning in May 2019, a cardiac surgeon stepped into the operating room at Boston Children’s Hospital more prepared than ever before to perform a high-risk procedure to rebuild a child’s heart. The surgeon was experienced, but he had an additional advantage: He had already performed the procedure on this...
German startup Q.ANT reaches full production capacity as demand surges for energy-efficient photonic AI processors. The post Q.ANT Hits Full Production Capacity for Photonic AI Processors appeared first on EE Times.
Co-packaged optics face scaling challenges such as bandwidth density mismatches, assembly complexity, and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering.
Using AI to transform semiconductor operations, which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering.
Original Article By SemiVision Research [Reading time: 25 mins]
Eyelit Technologies of Holmdel, N.J, USA (which provides AI-powered optimized planning, scheduling and execution systems) says that its software solution suite has been selected by laser-based silicon carbide (SiC) wafering firm Halo Industries Inc of Santa Clara, CA, USA (a 2014 spin-out from Stanford University) to support its rapidly scaling...
Infineon Technologies AG of Munich, Germany has introduced two new high-voltage intermediate bus converter (HV IBC) reference designs to help customers accelerate the transition to AI server power architectures powered by ±400V and 800V DC. Enabled by Infineon’s 650V CoolGaN switches, the designs target hyperscalers, power architects, and server OEMs...
Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...
Analyzing the CPU, GPU, and LPU chip ratios unveiled at the Nvidia GTC keynote, the impact of the Groq LPX chip on disaggregated decoding, and its potential for speculative decoding in AI inference
POET Technologies Inc of Toronto, Ontario, Canada –– which designs and implementats highly integrated optical engines and light sources for artificial intelligence networks –– has announced a strategic collaboration with optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan. The partnership aims to co-develop next-generation optical communication modules built...
In booth #1439 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) is showcasing technology and demonstrating...
In booth #1439 at the Optical Fiber Communications Conference and Exhibition (OFC 2026) at the Los Angeles Convention Center (17–19 March), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) has announced an optical interconnect...
A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.
NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.
Scale up, CPUs, Groq, tiered inference economics, SaaS is not dead
In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...
This is a sponsored article brought to you by PNY Technologies.In today’s data-driven world, data scientists face mounting challenges in preparing, scaling, and processing massive datasets. Traditional CPU-based systems are no longer sufficient to meet the demands of modern AI and analytics workflows. NVIDIA RTX PROTM 6000 Blackwell Workstation Edition...
As AI moves from pilot projects to factory-wide deployment, GlobalFoundries’ VP of digital manufacturing explains in an exclusive interview how to decide what truly scales across global fabs. The post How GlobalFoundries Takes AI from Pilot to Global Scale appeared first on EE Times.
Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — and Wiwynn Corp of Taipei, Taiwan, a cloud IT infrastructure provider for data centers, have announced a strategic partnership to deliver optically connected, rack-scale AI systems...
An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver.What Attendees will LearnWhy heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted...
The Eclipse Foundation announced updates to the Open VSX Registry, its vendor-neutral extension registry for tools built on the VS Code extension API. The registry is used in AI-enabled and ... The post Embedded: Security-infrastructure updates for Open VSX Registry appeared first on Electronics Weekly.
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated...
Most people who regularly use AI tools would say they’re making their lives easier. The technology promises to streamline and take over tasks both professionally and personally—whether that’s summarizing documents, drafting deliverables, generating code, or even offering emotional support. But researchers are concerned AI is making some tasks too easy,...
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNASummer School on Multi-Robot Systems: 29...
A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract “The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and...
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) demonstrated how its solutions...
To understand what's really happening, we need to look at the full system, specifically total cost of ownership of an AI inference deployment. The post The truth about AI inference costs: Why cost-per-token isn’t what it seems appeared first on EDN.
Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) has received a new volume order from one of its major hyperscale customers for 800G single-mode data-center transceivers to...
When I was 10 years old, my parents decided I was old enough and responsible enough to catch the bus to school (silly parents). This was in England in the 1960s. We didn’t have dedicated school buses (unlike the bodacious yellow beauties in America); instead, we used standard buses with...
Edge, in-sensor AI processors; TMDC-based transistors; DRAM read disturbance threshold; replay-based validation for chiplets; LLM-specific algorithmic attacks; noise in tellurium transistors; FMEDA safety metrics; HW reverse engineering; slowdowns in multi-GPU LLM inference. The post Chip Industry Technical Paper Roundup: Mar. 31 appeared first on Semiconductor Engineering.
Emergence AI launches Bengaluru research hub to build reliable, autonomous AI for mission-critical sectors. The post U.S. Startup Emergence AI Opens Research Hub in Bengaluru appeared first on EE Times.
Mistral AI, the French AI developer, says it has taken on debt of $830 million to run a datacentre. The datacentre, at Bruyeres-le-Chatel near Paris, is used to train of ... The post Mistral raises $830m appeared first on Electronics Weekly.
Musk unveils TeraFab, aiming to disrupt chipmaking with AI-driven, human-free fabs. The post TeraFab: What If It Is Done Differently? appeared first on EE Times.
To stay competitive, many small businesses need advanced wireless communication networks, not only to communicate but also to leverage technologies such as artificial intelligence, the Internet of Things, and robotics. Often, however, the businesses lack the technical expertise needed to install, configure, and maintain the systems.Bhaskara Rallabandi, who spent more...
Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centers. The TDM24745T is a new OptiMOS™ quad‑phase power module designed to meet the...
Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module), providing a drop-in, pin-compatible upgrade for the QSMP-15 that now features an industrial-grade STM32MP2 MPU. The QSMP-20 also takes advantage of lower cost DDR3 RAM with shorter...
QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. The post SiC modules raise power density for AI servers appeared first on EDN.
The Silicon Desert Map showcases Arizona technology companies that comprise Semiconductor, Hardware, Software, Emerging Technologies, IT, IoT, AI, Manufacturing, Research and Development, as well as all the supply chains. In addition, the map provides representation for HealthCare, Med Tech, Life Sciences, and pharmaceutical industries. Participants range from entrepreneurial Start-Ups to Fortune 100 multinationals, Academic...
6.5 min read.
Nvidia Vera, Arm AGI CPU, Meta, x86, more
A new technical paper, “Characterizing CPU-Induced Slowdowns in Multi-GPU LLM Inference,” was published by the Georgia Institute of Technology. Abstract “Large-scale machine learning workloads increasingly rely on multi-GPU systems, yet their performance is often limited by an overlooked component: the CPU. Through a detailed study of modern large language model...
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
In today’s technological landscape, the only constant is the rate of obsolescence. As engineers move deeper into the eras of 6G, ubiquitous artificial intelligence, and hyper-miniaturized electronics, a traditional degree is only a starting point.To remain competitive in today’s job market, technical specialists must evolve into future-ready professionals by cultivating...
The South Korean fabless startup reports accelerating global adoption of its DX-M1 AI chip across eight countries and seven application domains — and is now using Embedded World 2026 as the launchpad for its European commercial push. The post DEEPX Sets New Pace in Physical AI Commercialization—27 Global Deals in...
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNARSS 2026: 13–17 July 2026, SYDNEYSummer...
AI is rapidly reshaping semiconductor defect detection, but not along a single trajectory. The post Why AI in Semiconductor Inspection Is Becoming a Two-Layer Game appeared first on EE Times.
Arm unleashes its first silicon AGI CPU to power agentic AI in data centers, challenging x86 rivals. The post Arm Launches First Silicon CPU, Targets Data Center Agentic AI Workloads appeared first on EE Times.
Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) plans to establish a new US manufacturing facility in Greensboro, North Carolina. The 240,000ft2 facility will produce indium phosphide (InP)-based optical devices that serve as critical...
The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.
This article is crossposted from IEEE Spectrum’s careers newsletter. Sign up now to get insider tips, expert advice, and practical strategies, written in partnership with tech career development company Parsity and delivered to your inbox for free!Engineers Aren’t Bad at Communication. They’re Just Speaking to the Wrong Audience.There’s a persistent...
This is a sponsored article brought to you by General Motors. Visit their new Engineering Blog for more insights.Autonomous driving is one of the most demanding problems in physical AI. An automated system must interpret a chaotic, ever-changing world in real time—navigating uncertainty, predicting human behavior, and operating safely across...
When you hear the term humanoid robot, you may think of C-3PO, the human-cyborg-relations android from Star Wars. C-3PO was designed to assist humans in communicating with robots and alien species. The droid, which first appeared on screen in 1977, joined the characters on their adventures, walking, talking, and interacting...
“Can I get an interview?” “Can I get a job when I graduate?” Those questions came from students during a candid discussion about artificial intelligence, capturing the anxiety many young people feel today. As companies adopt AI-driven interview screeners, restructure their workforces, and redirect billions of dollars toward AI infrastructure,...
U.S. doctoral programs in electrical engineering form the foundation of technological advancement, training the brightest minds in the world to research, develop, and design next-generation electronics, software, electrical infrastructure, and other high-tech products and systems. Elite institutions have long served as launchpads for the engineers behind tomorrow’s technology. Now that...
News highlights Cambridge, England – Mar. 24, 2026 – Arm Holdings plc (NASDAQ: ARM) today announced the next evolution of the Arm compute platform, extending into production silicon products for the first time in the company’s history. This begins with the launch of the Arm AGI CPU, an Arm-designed CPU for AI data centers,...
At the Bharat Electricity Summit (BES 2026) in Yashobhoomi, New Delhi (19–21 March), Infineon Technologies AG of Munich, Germany announced a strategic technology partnership with Zenergize, an emerging Indian company designing and manufacturing AI-integrated power electronics hardware for the solar, EV charging, and renewable energy sectors. Infineon has had a...
Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...
Last week’s Nvidia GTC conference highlighted new chip architectures to power AI. But as the chips become faster and more powerful, the remainder of data center infrastructure is playing catch-up. The power-delivery community is responding: Announcements from Delta, Eaton, and Vertiv showcased new designs for the AI era. Complex and...
The undying thirst for smarter (historically, that means larger) AI models and greater adoption of the ones we already have has led to an explosion in data-center construction projects, unparalleled both in number and scale. Chief among them is Meta’s planned 5-gigawatt data center in Louisiana, called Hyperion, announced in...
Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted as a platform for the industry’s brightest engineers, researchers, suppliers, and students from across the microelectronics packaging ecosystem to come together to share innovations shaping next-generation computing systems. With record...
WHEN KYIV-BORN ENGINEER Yaroslav Azhnyuk thinks about the future, his mind conjures up dystopian images. He talks about “swarms of autonomous drones carrying other autonomous drones to protect them against autonomous drones, which are trying to intercept them, controlled by AI agents overseen by a human general somewhere.” He also...
2.5 min read.
Groq LP30, LPX Rack, Attention FFN Disaggregation, Oberon & Kyber Updates, Nvidia's CPO Roadmap, Vera ETL256, CMX & STX
These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.
Infineon’s TDM24745T quad-phase power module with TLVR magnetics provides high current density for AI workloads. The post TLVR power module supplies 320 A for AI processors appeared first on EDN.
Alchip Technologies has recently reported significant progress in the development of advanced 2nm ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More The post Alchip’s Leadership in ASIC...
Privacy and security concerns are expected to drive more on-premises AI workloads, bringing sensitive IP onto desktops. The post Micron Readies Client Storage for AI appeared first on EE Times.
Why AI demand adds a structural floor that transforms the typical memory cycle into a strong demand signal that is here to stay.
Silvaco Group Inc of Santa Clara, CA, USA — which provides AI-enabled technology computer-aided design (TCAD), electronic design automation (EDA) software and semiconductor intellectual property (SIP) for process and device development — has announced an expanded strategic partnership with Taiwan-based silicon and silicon carbide power device developer and and manufacturer...
Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape. The post Alibaba Launches XuanTie C950 CPU for Agentic AI appeared first on EE Times.
Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received an initial order from a major new customer that is “a global leader in networking products and solutions” and a “major supplier to the data-center optical transceiver market”. The customer is developing advanced...
Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity. The post What is the EDA problem worth solving with AI? appeared first on EDN.
How physical AI systems combine sensors, edge processing, and connectivity to enable real-time, intelligent decision-making directly on devices like robots and smart edge systems. The post Enabling Physical AI and Robotics: Platform for the Intelligent Edge appeared first on Semiconductor Engineering.
A road-vehicle standard-based unified AI safety lifecycle and blueprint for integrating both robustness and resilience into AI systems deployed in safety-critical domains. The post Ensuring Trustworthiness of AI-Enhanced Embedded Systems appeared first on Semiconductor Engineering.
Key considerations for secure AI, along with limitations and recommendations to overcome the limitations for secure AI deployments. The post Hardware Deployment for Secure AI Using Confidential Computing appeared first on Semiconductor Engineering.
Full automation is still a goal, but humans will still be in the loop for the foreseeable future. The post AI’s Potential And Limitations In Chip Design appeared first on Semiconductor Engineering.
Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ... The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.
Arm’s new AGI CPU signals a bold move into the $100B AI silicon market, balancing high-performance orchestration for agentic AI. The post AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees appeared first on EE Times.
A new technical paper, “Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis,” was published by the University of Florida. Abstract “Analog-mixed-signal (AMS) circuits are highly non-linear and operate on continuous real-world signals, making them far more difficult to model with data-driven AI than digital blocks. To close the...
In this week’s Fish Fry, I’m excited to welcome back Rob Knoth from Cadence Design Systems! Rob and I dive into a major shift in electronic design automation: the direct integration of artificial intelligence into the design workflow. Rob and I discuss the details of Cadence’s newest innovation – the...
This year marks the 80th anniversary of ENIAC, the first general-purpose digital computer. The computer was built during World War 2 to speed up ballistics calculations, but its contributions to computing extend well beyond military applications. Two of ENIAC’s key architects—John W. Mauchly, its co-inventor, and Kathleen “Kay” McNulty, one...
Hardware shortages are stimulating the AI chip counterfeit market. Experts believe a hardware root of trust could alleviate authenticity and security challenges. The post Hardware Root of Trust Essential for AI Chip Integrity appeared first on EE Times.
Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...
In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.
Abhishek Appaji has committed his career to bringing lifesaving technology to underresourced communities. The IEEE senior member weaves together artificial intelligence, biomedical engineering, deep learning, and neuroscience to make doctors’ jobs easier and to improve patient outcomes.“The intersection of these fields is where the most impactful breakthroughs in diagnostic precision...
The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.
ISO/PAS 8800, focused on safety of AI applications in road vehicles, can also serve engineers in medical, industrial, rail, and defense. The post Why ISO/PAS 8800 is the new blueprint for AI safety in all critical industries appeared first on EDN.
Rambus launches 16 GT/s HBM4E controller for AI and HPC, pushing 4 TB/s bandwidth per stack. The post Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E appeared first on EE Times.
Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA says that its hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430kW liquid-cooled string energy storage systems (ESS) and 320kW utility-scale solar inverter. The design win builds upon the long-standing collaboration between onsemi and Sineng...
AI may not solve the telecom industry’s revenue dilemma overnight, but it offers a credible path from infrastructure investment to tangible growth. The post Bell Called Watson; Today, We Call AI appeared first on EE Times.
A focus on DRAM and NAND is squeezing NOR wafer capacity and backend test resources. The post AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability appeared first on Semiconductor Engineering.
Securing data in a way that preserves the predictable timing behavior required for AI-driven systems. The post World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security appeared first on Semiconductor Engineering.
Post-quantum cryptography emerges as top concern, followed by AI and automotive complexity. The post IC Security Threats Spike With Quantum, AI, And Automotive appeared first on Semiconductor Engineering.
A new technical paper, “Assertain: Automated Security Assertion Generation Using Large Language Models,” was published by University of Florida. Abstract “The increasing complexity of modern system-on-chip designs amplifies hardware security risks and makes manual security property specification a major bottleneck in formal property verification. This paper presents Assertain, an automated...
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNARSS 2026: 13–17 July 2026, SYDNEYSummer...