Latest semiconductor industry news and analysis
Page 22 of 34The memory shortage could last another four to five years, says the chairman of SK Group, Chey Tae-won. The supply of base wafers is lagging demand by more than 20%, ... The post Memory shortage to last 4-5 years says SK boss appeared first on Electronics Weekly.
Imec has launched a consortium with 26 European university groups that will work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and ... The post Imec launches university consortium appeared first on Electronics Weekly.
Following the 14% revenue decline between 2022 and 2024, telecom equipment investment conditions improved in 2025, says Dell’Oro. Telecon equipment revenues across the six programs tracked by Dell’Oro Group—Broadband Access, ... The post Two-year telecom drought ends with 2025 growth appeared first on Electronics Weekly.
Original Article By SemiVision Research [Reading time: 30 mins]
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Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.
Secure, reliable real-time data processing and transport solutions for next-generation physical AI applications, developed in collaboration with NVIDIA NVIDIA humanoid robotics solutions integrated into NXP’s safe, secure edge portfolio cut development costs and speed time to market First in a series of NXP’s foundational robotics solutions designed to accelerate physical...
Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform Geneva, March 16, 2026 – STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid...
The Semiconductor Newsletter
Embedded World 2026 reveals rising AI integration challenges. The post Embedded World 2026 Confronts Mounting Integration Complexity appeared first on EE Times.
A new technical paper, “System-Technology Co-Optimization of Bitline Routing and Bonding Pathways in Monolithic 3D DRAM Architectures,” was published by researchers at Georgia Tech. Abstract “3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery,...
In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...
In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...
A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was published by researchers at RWTH Aachen University and RIF e.V. Abstract “Artificial intelligence (AI) has emerged as a pivotal technology for autonomous systems across various domains, but quality assurance remains challenging due to...
The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More The post AI-Driven Automation in Semiconductor Design: The Fuse...
A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate (BER). Meeting stringent...
The America’s Talent Strategy: Building the Workforce for the Golden Age report, published last year by the U.S. Departments of Commerce, Education, and Labor, identified a significant engineering and skills gap. The 27-page report concluded that the shortage of talent in essential areas—including advanced manufacturing, artificial intelligence, cloud computing, and...
AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.