Technical

SemiWiki

Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to Compete

Mar 06, 2026

The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the...

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Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Mar 06, 2026

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.

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SemiWiki

Reducing Risk Early: Multi-Die Design Feasibility Exploration

Mar 06, 2026

The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More The post Reducing Risk Early:...

SemiWiki

From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators

Mar 05, 2026

Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March...

3D InCites

Micross Introduces H+ Screened DC-DC Converters for LEO Constellations and New Space Missions

Mar 05, 2026

Melville, NY (March 3, 2026) – Micross Components, Inc. (“Micross”), a global provider of Hi-Rel microelectronic products and services for aerospace, defense, space, medical, and industrial applications, has expanded its DC-DC converter portfolio with the new Class H+ AFLS28XX Series. This series provides a cost-effective, radiation-tolerant power conversion solution for low-earth-orbit (LEO)...

SemiWiki

Siemens Reveals Agentic Questa

Mar 05, 2026

There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More...

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Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Mar 05, 2026

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.

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ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

Mar 07, 2026

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.

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Texas Instruments TMS1000: When Control Logic Fit on One Chip

Mar 13, 2026

Introduced in 1974, the TMS1000 family combined CPU, ROM, RAM, and I/O on a single die and established the commercial template for the microcontroller.

SemiWiki

Agentic AI and the Future of Engineering

Mar 13, 2026

Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are...

3D InCites

Path to Commercialization: LPKF Develops Glass Components for Quantum Computers in Funded QVLS-iLabs Future Cluster

Mar 13, 2026

LPKF develops glass components for ion traps, vacuum chambers and quantum sensors in three projects / Laser micromachining of glass provides the precision required for quantum computer components / Future cluster QVLS-iLabs (QVLS = Quantum Valley Lower Saxony) receives €15 million in funding to accelerate commercialization of quantum technologies. ANNOVER/...

SemiWiki

WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge

Mar 12, 2026

The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much …...

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Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Mar 12, 2026

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.

SemiWiki

Ravi Subramanian on Trends that are Shaping AI at Synopsys

Mar 12, 2026

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More The post...

SemiWiki

Axiomise Introduces nocProve to Transform NoC Design Verification

Mar 12, 2026

Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely. The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More The post Axiomise Introduces nocProve to...

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Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Mar 12, 2026

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.

SemiWiki

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

Mar 11, 2026

The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important,...

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Build Your Own Clock With Analog Dials, Part 3

Mar 11, 2026

To complete this project, we add backlight control and temperature-sensing functionality to the clock we built in the previous installments.

3D InCites

Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley

Mar 11, 2026

March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)– Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer...

3D InCites

The Next Mode of Transformation: 3D IC Integration

Mar 11, 2026

The semiconductor industry finds itself at a critical juncture, where the traditional paradigms of Moore’s Law are encountering fundamental physical and economic limitations. As the industry grapples with the imperative to sustain innovation and meet the escalating performance demands of contemporary computing applications, the transition to 3D IC design emerges...

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NXP Drives Zonal Computing Transition With New Reference System

Mar 10, 2026

Announced today, the new zonal reference system includes pre-validated hardware and software for automotive intelligent data handling and multi-volt power distribution.

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Synaptics Redefines Edge IoT with First AI-Native Wi-Fi 7 Connected MCU

Mar 10, 2026

Announced today at Embedded World, Synaptics claims the SYN765x as the first AI-native connected MCU with Wi-Fi 7, Bluetooth 6.0, and 802.15.4. It features a Cortex-M52 and Ethos-U55 NPU.

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Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Mar 09, 2026

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.

All About Circuits

Diode-Based Phase Detectors: Key Principles and Example Circuits

Mar 08, 2026

We examine phase detectors that leverage either the nonlinear characteristics or switching capabilities of diodes to perform multiplication.

SemiWiki

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

Mar 16, 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More The post Synopsys Explores AI/ML Impact on...

SemiWiki

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

Mar 16, 2026

In the realm of extreme ultraviolet (EUV) lithography, metal oxide resists (MORs) have emerged as promising candidates for advanced semiconductor patterning. However, their stability poses challenges, particularly interactions with clean-room environments like humidity and airborne molecular contaminants (AMCs) … Read More The post Unraveling Dose Reduction in Metal Oxide Resists...

SemiWiki

CEO Interview with Dr. Mohammad Rastegari of Elastix.AI

Mar 16, 2026

Mohammad Rastegari is a prominent AI researcher and entrepreneur currently serving as the CEO and Co-Founder of Elastix.AI. Based in the Greater Seattle Area, he also holds the position of Affiliate Assistant Professor at the University of Washington’s Electrical & Computer Engineering Department. His professional… Read More The post CEO...

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Understanding the Exclusive-OR Phase Detector

Mar 15, 2026

This article explores the operation of the simplest digital phase detector: the exclusive-OR (XOR) gate.

SemiWiki

Tesla and Samsung Relationship Update

Mar 15, 2026

The majority of my 40+ year career has been spent managing the relationship between leading-edge semiconductor design and manufacture, working with just about every commercial foundry and top customer in one way or another. It’s my thing—it fascinates me. I’m also a fan of disruption, and the latest disruptions the...

3D InCites

VIEW Micro Metrology: Point of View at Device Packaging 2026

Mar 14, 2026

A Commitment to the Next Generation   The event opened with a comprehensive series of Professional Development Courses, followed by the inaugural Student-Industry “Classroom to Career” session. This interactive session featured insightful career‑focused presentations from iMAPS President Dan Krueger and Director Scott Hayes, Arizona State University student Pallavi Jithendrriyan, and industry...

SemiWiki

WEBINAR: Reclaiming Clock Margin at 3nm and Below

Mar 17, 2026

At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary. That assumption no longer holds As supply… Read More The post...

SemiWiki

The First Real RISC-V AI Laptop

Mar 17, 2026

At a workshop in Boston on February 27, something subtle but important happened. Developers sat down in front of a RISC-V laptop, installed Fedora, and ran a local large language model. No simulation. No dev board tethered to a monitor. A laptop. For more than a decade, RISC-V advocates have...

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Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Mar 17, 2026

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.

SemiWiki

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

Mar 17, 2026

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More The post AI-Driven Automation in Semiconductor Design: The Fuse...

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AI-RAN: The Technology Pushing Mobile Networks Toward AI-Native 6G

Mar 17, 2026

AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.

SemiWiki

TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation

Mar 16, 2026

One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley. The 32nd annual TSMC Technology Symposium represents one of the...

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MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Mar 16, 2026

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.

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At Embedded World, Renesas 365 Advances to General Availability Phase

Mar 20, 2026

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.

SemiWiki

Captain America: Can Elon Musk Save America’s Chip Manufacturing Industry?

Mar 20, 2026

Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and...

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MIT Pioneers Two-Chip Authentication to Secure Cryptographic Schemes

Mar 20, 2026

MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without storing cryptographic keys on external servers.

SemiWiki

WEBINAR: HBM4E Advances Bandwidth Performance for AI Training

Mar 19, 2026

The rapid proliferation of LLMs and other AI applications, and of high-end GPU platforms that run them, is putting intense pressure on the performance requirements for memory technologies. Designers need to be keenly aware of how to make the most of their memory and controller choices, which can be moving...

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The Legacy of Switzerland’s First Female Engineering Professor

Mar 19, 2026

To celebrate Women's History Month, we spotlight Erna Hamburger, an engineer who graduated top of her class at EPFL in 1933 and spent decades breaking institutional barriers in electrical engineering and measurement science.

SemiWiki

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Mar 19, 2026

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took...

SemiWiki

Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design

Mar 19, 2026

Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More The post Siemens...

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R&S and Realtek Validate First Test Setup for BLE High Data Throughput

Mar 19, 2026

Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature that can enable verification of data rates up to 7.5 Mbps.

3D InCites

Metalor Technologies Completes Acquisition of Gannon & Scott

Mar 19, 2026

Metalor Technologies announced today that, following approval by the relevant regulatory authorities, it has completed the previously announced acquisition of Gannon & Scott. As a result, Gannon & Scott is now a wholly owned subsidiary of Metalor Technologies and part of the TANAKA group. The completion of this transaction brings...

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Constructing a Solar-Powered Snake Robot

Mar 18, 2026

Learn how to create a batteryless crawling robot using basic electronic components and a 3D-printed chassis.

AnySilicon

The Future of Semiconductors: A Deep Dive with Tomi-Pekka Takalo

Mar 18, 2026

This interview features:  Tomi-Pekka Takalo, CEO and co-founder at CoreHW.     Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?   CoreHW was founded in 2013 by RF engineers with a vision to deliver high-quality custom radio-frequency...

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Siemens Adds Agentic AI to Questa One to Speed IC Design

Mar 18, 2026

A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.

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NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

Mar 17, 2026

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.

SemiWiki

Beyond Moore’s Law: High-NA EUV Lithography Redefines Advanced Chip Manufacturing

Mar 23, 2026

  The imec installation of the ASML EXE:5200 High Numerical Aperture (High NA) extreme ultraviolet (EUV) lithography system at imec represents a pivotal advancement in semiconductor manufacturing and research. This system, installed in imec’s 300 mm cleanroom in Leuven, Belgium, introduces unprecedented lithographic… Read More The post Beyond Moore’s Law:...

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Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

Mar 23, 2026

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More The post...

SemiWiki

CEO Interview with Moti Margalit of SonicEdge

Mar 23, 2026

Moti Margalit is the CEO and co-founder of SonicEdge, a deep-tech pioneer reinventing sound through ultrasonic modulation – unlocking smaller, vibration-free speakers with studio-quality audio. With a background in lasers and electro-optics, Moti transitioned from technologist to inventor. His career spans 150+ patents… Read More The post CEO Interview with...

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Introduction to the RS Flip-Flop Phase Detector

Mar 22, 2026

Learn about this simple sequential phase detector and how it compares to the XOR gate. We'll also examine some key limitations and circuit implementations.

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5 Light-Based Technologies Reshaping Computing and Sensing

Mar 31, 2026

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.

3D InCites

Mechanical Stress in Semiconductor Development

Mar 31, 2026

3D NAND subarray structures tilt during slit processing, demonstrating stress evolution, including deformation. The post Mechanical Stress in Semiconductor Development appeared first on IMAPS 3D InCites Content Platform.

SemiWiki

RISC-V Now! — Where Specification Meets Scale!

Mar 31, 2026

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible...

SemiWiki

Nuclear Power and Design Automation

Mar 31, 2026

A couple of folks have asked me to write on nuclear power. Nuclear offers additional sources for power generation, a pressing concern thanks to demand from giant data centers. Also, investment by Microsoft, Sam Altman and others signals their urgency to accelerate past slow moving utilities plans. I have some...

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Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Mar 31, 2026

Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.

SemiWiki

CEO Interview with Charlie Peppiatt of Gooch & Housego

Mar 30, 2026

Charlie Peppiatt has served as Chief Executive Officer of Gooch & Housego since September 2022. He joined the company from TT Electronics, where he was Executive Vice President following TT’s acquisition of Stadium Group plc. Prior to that, Charlie served as Chief Executive Officer of Stadium Group from 2013 until...

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Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Mar 30, 2026

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.

3D InCites

BESI at the center of the Packaging Power Shift

Mar 30, 2026

Why the takeover interest in BESI reflects a broader transformation in semiconductor equipment Step by step, this industry is coalescing around a central battleground. As front-end and back-end technologies converge, control over key interconnect steps is emerging as a critical differentiator. In today’s article, Gabriela Pereira, Senior Technology & Market Analyst,...

3D InCites

The Silicon Desert

Mar 30, 2026

The Silicon Desert Map showcases Arizona technology companies that comprise Semiconductor, Hardware, Software, Emerging Technologies, IT, IoT, AI, Manufacturing, Research and Development, as well as all the supply chains. In addition, the map provides representation for HealthCare, Med Tech, Life Sciences, and pharmaceutical industries. Participants range from entrepreneurial Start-Ups to Fortune 100 multinationals, Academic...

SemiWiki

CEO Interview with Jussi-Pekka Penttinen of Vexlum Ltd

Mar 30, 2026

Jussi-Pekka Penttinen is the chief executive officer, chief technical officer, and cofounder of Vexlum Ltd, an advanced laser technology company. With more than 15 years of experience, he is a leading researcher in the field of Vertical External Cavity Surface Emitting Laser (VECSEL) and successfully commercialized the technology.… Read More...

SemiWiki

Sensors Converge: Where Intelligence Meets the Edge

Mar 30, 2026

The Sensors Converge Conference is one of the premier technical gatherings dedicated to the design, integration, and deployment of sensing technologies across industries. The event brings together engineers, system architects, researchers, and product developers to explore advancements in sensor hardware, edge computing,… Read More The post Sensors Converge: Where Intelligence...

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Introduction to Phase/Frequency Detectors

Mar 29, 2026

Learn how using a phase/frequency detector (PFD) in place of a phase detector improves the acquisition range of a PLL.

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Nordic Rains IoT Products at Embedded World and MWC 2026

Mar 28, 2026

At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.

3D InCites

Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging

Mar 27, 2026

Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...

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Intersil ICL7106/07: The 40-Pin DIP That Built a Million Multimeters

Mar 27, 2026

Nearly five decades after Intersil released the ICL7106 and ICL7107 in 1978, the chips at the heart of the world's cheapest digital meters are still in production.

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Kristina Johnson: Engineering Change From Movie Theaters to Government

Mar 27, 2026

To close out Women's History Month, we spotlight Kristina M. Johnson, the mind behind RealD's 3D technology—just one of her 118 patents.

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U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

Mar 26, 2026

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.

3D InCites

Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays

Mar 26, 2026

An 18-month Eurostars-3 R&D project will address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of dual-color microLED devices into compact microdisplays. The project, 2ndGenMicroLED, is carried out in collaboration with Swedish deep-tech company Polar Light Technologies AB. Together, the partners aim to develop a dual-color microLED microdisplay...

3D InCites

From Classroom to Career: Building the Next Generation of Microelectronic Talent

Mar 26, 2026

The semiconductor ecosystem is facing a significant workforce gap, with industry demand continuing to grow faster than the available talent pool. Long-term projections suggest the semiconductor workforce pipeline will struggle to keep pace with this growth. The National Science Foundation’s estimates indicate that between 60,000 and 100,000 semiconductor roles in the United...

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Ambient Scientific Lends AI Processor to Women’s Safety Wearable

Mar 26, 2026

The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.

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Proving Reliability in Critical Embedded Systems

Mar 25, 2026

Learn how formal verification uses math to prove the absence of runtime errors in complex embedded software for critical defense/space systems, offering stronger reliability than testing.

3D InCites

Arm expands compute platform to silicon products in historic company first

Mar 25, 2026

News highlights Cambridge, England – Mar. 24, 2026 – Arm Holdings plc (NASDAQ: ARM) today announced the next evolution of the Arm compute platform, extending into production silicon products for the first time in the company’s history. This begins with the launch of the Arm AGI CPU, an Arm-designed CPU for AI data centers,...

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Gigadevice Debuts Motor Control MCU and Low-Power NOR Flash Memory

Mar 24, 2026

Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.

3D InCites

Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference

Mar 24, 2026

This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted as a platform for the industry’s brightest engineers, researchers, suppliers, and students from across the microelectronics packaging ecosystem to come together to share innovations shaping next-generation computing systems.  With record...

3D InCites

Indium Corporation Indium12.9HF Receives New Product Introduction Award

Mar 24, 2026

CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective, low-silver alloys, including SAC105 and SAC0307. Indium12.9HF is specifically formulated to accommodate fine feature printing, as seen with 01005 components. It offers unprecedented stencil...

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4 Standout Microcontrollers From Embedded World 2026

Mar 24, 2026

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.

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STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

Mar 23, 2026

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.

SemiWiki

Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology

Apr 01, 2026

Alchip Technologies has recently reported significant progress in the development of advanced 2nm  ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More The post Alchip’s Leadership in ASIC...

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Designing Ultra-Low-Power Smart Thermostats with Latching Solid-State Relays

Apr 01, 2026

A load-powered relay architecture allows smart HVAC controllers to operate without batteries or a common wire while enabling compact, silent switching.

SemiWiki

CapEx Up for Foundry, Memory

Apr 01, 2026

Semiconductor Intelligence estimates total semiconductor industry capital spending (CapEx) was $166 billion in 2025, up 7% from 2024. We estimate 2026 CapEx will be $200 billion, up 20% from 2025. TSMC was the largest spender in 2024 with $40.9 billion in CapEx, 25% of the total. TSMC projects 2026 CapEx...

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pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

Apr 01, 2026

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.

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SemiWiki

Samtec’s Strong Presence at embedded world 2026

Apr 03, 2026

The embedded world Exhibition & Conference recently concluded. The event is held annually in Nuremberg, Germany and has become one of the most influential gatherings for the global embedded systems community. Since its inception in 2003, the event has grown from a modest technical meeting into a large-scale international… Read...

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Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

Apr 03, 2026

In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.

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Silicon Catalyst and Microelectronics US 2026

Apr 02, 2026

The designation of Silicon Catalyst as the exclusive strategic partner for Microelectronics US 2026 represents a significant alignment between a leading semiconductor startup ecosystem and a rapidly growing U.S. microelectronics industry event. This partnership reflects broader trends in semiconductor innovation, … Read More The post Silicon Catalyst and Microelectronics US...

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For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

Apr 02, 2026

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.

SemiWiki

Webinar – How to Reclaim Margin in Advanced Nodes

Apr 02, 2026

This informative webinar discusses a significant issue that is cropping up for sub-5nm designs. As the graphic above shows, modeling uncertainty at advanced nodes results in excessive guard banding. These guard bands result in reduced performance and profit. A loss of 25 – 35% in PPA is discussed, along with...

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Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Apr 02, 2026

The startup's programmable chip uses a metasurface architecture to control light without moving parts.

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Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

Apr 04, 2026

The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.

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Power Integrations Extends Flyback Topology to 440W With GaN

Apr 03, 2026

At APEC 2026, Power Integrations introduced its TopSwitchGaN 440 W, which unites PowiGaN switches with traditional TOPSwitch architecture, simplifying high-power designs.

SemiWiki

Samtec’s Strong Presence at embedded world 2026

Apr 03, 2026

The embedded world Exhibition & Conference recently concluded. The event is held annually in Nuremberg, Germany and has become one of the most influential gatherings for the global embedded systems community. Since its inception in 2003, the event has grown from a modest technical meeting into a large-scale international… Read...