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Articles that do not fit neatly into other topic categories.

211 articles

EE Journal

Rohde & Schwarz and Realtek demonstrate first test solution for Bluetooth® LE High Data Throughput (HDT)

Mar 06, 2026

Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth® LE High Data Throughput (HDT) feature. The companies will jointly showcase the setup based on the CMP180 radio communication tester from Rohde & Schwarz, characterizing Realtek’s next generation Bluetooth® solution RTL8922D and...

EE Journal

TANAKA Develops World’s First High-Performance Palladium Hydrogen Permeable Membrane Exhibiting High Hydrogen Purification Performance at Temperatures around 100 degrees C

Mar 06, 2026

TOKYO, Mar 5, 2026 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced the successful development of “HPM-L111”, the world’s first metal*1 palladium (Pd) hydrogen permeable membrane capable of...

Semiconductor Today

NUBURU’s Lyocon completes proof-of-concept for portable directed-energy laser platform

Mar 11, 2026

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security platform company focused on non-kinetic effects, directed-energy technologies, and software-orchestrated defense systems) says that its subsidiary Lyocon S.r.l. (an Italian laser-technology company specializing in the design, manufacturing and integration of high-power blue laser systems for industrial applications) has completed...

Semiconductor Today

Spain’s VLC Photonics and Hitachi High-Tech America announce strategic collaboration in North America

Mar 10, 2026

Fabless photonic integrated circuit (PIC) design, prototyping, testing and packaging house VLC Photonics S.L. of Valencia, Spain (which has experience with various material platforms including silicon photonics, indium phosphide, silicon nitride, PLC and polymer) has announced a strategic collaboration in North America with Hitachi High-Tech America Inc (HTA), which sells...

Semiconductor Engineering

Optimizing Oxide Interfaces To Preserve Device Performance in TMDC-based Transistors (imec, ETH Zurich)

Mar 17, 2026

A new technical paper, “Oxide induced degradation in MoS2 field-effect transistors,” was published by researchers at imec and ETH Zurich. Abstract excerpt “Transition Metal Dichalcogenides (TMDC) are promising candidates for future scaled transistor channels but their performance is often degraded by imperfections such as the interface with amorphous gate oxides....

Semiconductor Engineering

Bias- and Temperature-Dependent Noise Measurements to Investigate Carrier Transport at the Tellurium Interface (POSTECH)

Mar 21, 2026

A new technical paper, “Revealing and Engineering Contact-Origin Noise in Ultrathin Tellurium Transistors,” was published by researchers at Pohang University of Science and Technology. Abstract “Tellurium (Te) has emerged as a promising p-type semiconductor for ultrathin electronics owing to its strong air stability, excellent hole transport, narrow bandgap, and BEOL-integration...

EE Journal

STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads

Mar 19, 2026

Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24V loads. Leveraging synchronous...

EE Journal

2026 IEEE Electronic Components and Technology Conference To Feature a Keynote Address by Dr. Tien Wu, CEO of ASE

Mar 19, 2026

The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for...

Electronics Weekly

Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems

Mar 31, 2026

As collaborative robots (cobots) are increasingly deployed alongside human operators, their system architectures continue to evolve toward higher integration, reduced size and greater modularity. These trends place growing demands on ... The post Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems appeared first on Electronics Weekly.

EE Journal

Fujitsu develops high-sensitivity, high-resolution infrared sensor to expand monitoring capabilities in defense and disaster prevention

Mar 30, 2026

KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields. This sensor is a Type-II superlattice (T2SL) infrared sensor with over 1 million pixels, capable of detecting both...

3D InCites

Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays

Mar 26, 2026

An 18-month Eurostars-3 R&D project will address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of dual-color microLED devices into compact microdisplays. The project, 2ndGenMicroLED, is carried out in collaboration with Swedish deep-tech company Polar Light Technologies AB. Together, the partners aim to develop a dual-color microLED microdisplay...

EE Journal

ASRock Industrial and CSI Validate O-PAS™ Systems Management Architecture with the iEP-7020E and AiSMA

Apr 01, 2026

Taipei, Taiwan (April 1, 2026) – ASRock Industrial today announced a collaboration with Collaborative Systems Integration (CSI), both members of the Open Process Automation Forum (OPAF) and the Coalition of Open Process Automation (COPA), to validate standards-based Open Process Automation Standard (O-PAS™) systems management architecture. Aligned with the O-PAS™ Standard, the...

Semiconductor Today

NUBURU wins counter-drone directed-energy order from government defense electronics organization in Asia–Pacific

Apr 01, 2026

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security platform company focused on non-kinetic effects, directed-energy technologies, and software-orchestrated defense systems) says that its subsidiary Lyocon S.r.l. (an Italian laser-technology company specializing in the design, manufacturing and integration of high-power blue laser systems for industrial applications) has secured...

EE Journal

Saelig Introduces Advanced AIM-TTi ADM1055

Apr 03, 2026

Fairport, NY. Saelig Company, Inc. has introduced the Aim-TTi ADM1055 DMM, a next‑generation 5½‑digit bench multimeter engineered to deliver the measurement accuracy, flexible functionality, and seamless integration needed for development labs, production test environments, and educational establishments. The ADM1055 provides 0.02% basic DC accuracy, the precision needed for tasks such as device characterization, troubleshooting and...

EE Journal

Microchip Technology Earns IEC 62443-4-1 ML2 Industrial Automation and Control System Certification

Apr 02, 2026

CHANDLER, Ariz., April 2, 2026 — As connected systems spread across residential, industrial and commercial environments, the need for independently verified cybersecurity assurance is becoming a core requirement. To help address this demand, Microchip Technology (Nasdaq: MCHP) has been certified by UL Solutions to the IEC 62443‑4‑1 Maturity Level 2 (ML2) Industrial Automation and...