Latest semiconductor industry news and analysis
Page 16 of 34Jensen Huang was crowned 'The Inference King' with Groq-powered Rubin CPUs, unveiling dramatic architectural leaps at GTC this year. The post GTC 2026 Keynote: Long Live the Inference King appeared first on EE Times.
DigiKey has collaborated with STMicroelectronics and Ultra Librarian for a new version of the eDesignSuite tool. eDesignSuite This is a free no-license-required online design platform developed by ST. It aims ... The post DigiKey, ST, Ultra Librarian partner for eDesignSuite integration appeared first on Electronics Weekly.
Intel’s efforts in the phone business did not end well, but 21 years ago, the company’s mobile targets were ambitious: ‘Thecnext decade will see the way people interact with computers ... The post When Intel Was Bullish On Phones appeared first on Electronics Weekly.
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique...
WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration...
My podcast guest this week is Ferric CEO Noah Sturcken. Noah and I discuss how Ferric’s innovations—specifically their ferromagnetic materials and on-chip power converters—are addressing the critical power, efficiency, and integration hurdles facing today’s AI processors. We also explore how IVRs enable higher instantaneous power delivery, simplify board design, and...
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by...
Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots Infineon enables the key functional blocks...
Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and...
Telink unveiled TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V, multi-protocol support including Bluetooth, Zigbee, Thread, Matter, 2.4GHz Proprietary, and automotive-grade AEC-Q100 certification for IoT applications. The post Telink TL322X+ML3228A Launched at Embedded World 2026 appeared first on EE Times.
A TLV431-based circuit solved LSI chip power-up failures by ensuring a sufficiently steep 5V rail rise time. The post Vcc delay appeared first on EDN.
10 min read.
An edge server and PLC controller for industrial automation, field comms and IoT edge applications by Sefra Labs are based on Raspberry Pi 4 and 5. The Strato Pi Plus ... The post Embedded: Raspberry Pi duo extends industrial IoT reach appeared first on Electronics Weekly.
Hot takes from the AI oven.
SWISSto12, the Swiss manufacturer of satellite and payload systems, has officially opened its purpose-built assembly facility at company headquarters in Renens, Switzerland. The facility will support the industrial-scale production of ... The post SWISSto12 opens assembly facility for GEO satellites in Switzerland appeared first on Electronics Weekly.
Original Article By SemiVision Research [Reading time: 20mins]
The second part on GaN basics explains hybrid structures and RDS(on) penalty while proving further details on HEMTs and substrate choices. The post GaN fundamentals: Hybrid structures, HEMT, and substrate choices appeared first on EDN.
the most read stories on our website cover TI's 800V DC power architecture for AI data centers, a quantum‑centric supercomputing reference architecture and Honda cancelling EV models. The post Most Read – Honda cancels EVs, IBM quantum blueprint, Elon Musk fab appeared first on Electronics Weekly.
HENSOLDT of Taufkirchen near Munich, Germany (which develops sensor solutions, electronics and software for the air, land, sea, cyber and space domains) has signed a long-term supply agreement with United Monolithic Semiconductors GmbH (UMS, which designs and produces RF and millimeter-wave components and ICs at its facilities in Villebon sur...
The University of Warwick has secured new funding to boost the UK’s ability to test the reliability of advanced semiconductors used in electric vehicles, renewable energy, and other critical technologies...