Nvidia invests $2bn in Marvell for AI ASIC compatibility

Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ... The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.

2026 semiconductor capex to increase 20% YoY

Semiconductor industry capex was $166 billion in 2025, up 7% YoY, says Semiconductor Intelligence (SI). SI estimates 2026 capex will be $200 billion, up 20% from 2025. TSMC was the ... The post 2026 semiconductor capex to increase 20% YoY appeared first on Electronics Weekly.

NIST develops high temperature photonics packaging

IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the ... The post NIST develops high temperature photonics packaging appeared first on Electronics Weekly.

Notebook shipments to fall 14.8%

Notebook shipments are set to fall 14.8% YoY, says TrendForce. Further price hikes are expected in the coming quarters. A tight memory supply continues to push up system costs, while ... The post Notebook shipments to fall 14.8% appeared first on Electronics Weekly.

Arm Makes Chips!

Is Arm getting its hands on its customers' business?

pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.

Dissecting Nvidia Blackwell - Tensor Cores, PTX Instructions, SASS, Floorsweep, Yield

Microbenchmarking, tcgen05, 2SM MMA, UMMA, TMA, LDGSTS, UBLKCP, Speed of Light, Distributed Shared Memory, GPC Floorsweeps, SM Yield

AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees

Arm’s new AGI CPU signals a bold move into the $100B AI silicon market, balancing high-performance orchestration for agentic AI. The post AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees appeared first on EE Times.

The $2 Billion Nvidia Deal With Marvell Is About A Lot More Than NVLink Fusion

Metallium announces off-take agreement with Indium Corp for critical & precious metals including gallium and germanium

Metallium Ltd of Subiaco, Western Australia, says that its US subsidiary Flash Metals USA Inc of Houston, TX, USA has executed a long-term offtake agreement with materials refiner and manufacturer Indium Corp of Clinton, NY, USA, covering the supply of gallium (Ga), germanium (Ge) and other critical metals recovered using...

Causal Inference for AMS Design (U. of Florida)

A new technical paper, “Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis,” was published by the University of Florida. Abstract “Analog-mixed-signal (AMS) circuits are highly non-linear and operate on continuous real-world signals, making them far more difficult to model with data-driven AI than digital blocks. To close the...

Latest issue of Semiconductor Today now available

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.

Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)

A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract “The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and...

CP-Based Lot Scheduling Solutions For a Semiconductor Manufacturing (Infineon, U. of Klagenfurt)

A new technical paper, “Quantifying the Global Impact of Constraint Programming Based Local Scheduling in Semiconductor Manufacturing,” was published by Infineon and the University of Klagenfurt. Abstract “The efficiency of semiconductor frontend manufacturing highly depends on the optimization of resource allocation. In academic works, scheduling methods, i.e., based on Constraint...

Mechanical Stress in Semiconductor Development

3D NAND subarray structures tilt during slit processing, demonstrating stress evolution, including deformation. The post Mechanical Stress in Semiconductor Development appeared first on IMAPS 3D InCites Content Platform.

AOI showcases 25dBm ultra-high-power ELSFP for next-gen AI infrastructure

At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) demonstrated how its solutions...

ESA awards OHB Sweden the EPS‑Sterna constellation contract

The European Space Agency (ESA) has selected OHB Sweden to build 20 small satellites for the EUMETSAT Polar System – Sterna (EPS‑Sterna) constellation. EUMETSAT is the European Organisation for the ... The post ESA awards OHB Sweden the EPS‑Sterna constellation contract appeared first on Electronics Weekly.

No Contracts, No Problem: The Trust Behind NVIDIA and TSMC

Original Article By SemiVision Research [Reading time: 13 mins]

RISC-V Now! — Where Specification Meets Scale!

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible...