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When hardware plays offensive, even a ball needs architecture. The post The system architect’s sketchbook: The football has main character energy appeared first on EDN.

EE Times

Alibaba Launches XuanTie C950 CPU for Agentic AI

Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape. The post Alibaba Launches XuanTie C950 CPU for Agentic AI appeared first on EE Times.

EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult

Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in our ... The post EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult appeared first on Electronics Weekly.

Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form

Let our content come straight to you! Easily digestible newsletter emails straight to your inbox. And all the newsletters are mobile optimised. The post Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form appeared first on Electronics Weekly.

2025 Raspberry Pi revenues up 25% YoY

Four million Raspberry Pis were shipped in H2 2025, and a total of 7.6 million for FY 2025, up 9% over FY 2024. Revenue was $323 million – up 25% ... The post 2025 Raspberry Pi revenues up 25% YoY appeared first on Electronics Weekly.

Semiconductor Today

Aehr gains initial order from new silicon photonics transceiver customer

Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received an initial order from a major new customer that is “a global leader in networking products and solutions” and a “major supplier to the data-center optical transceiver market”. The customer is developing advanced...

EDN

What is the EDA problem worth solving with AI?

Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity. The post What is the EDA problem worth solving with AI? appeared first on EDN.

Molex buys Smiths Interconnect

Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, ... The post Molex buys Smiths Interconnect appeared first on Electronics Weekly.

Semiconductor Today

UK Semiconductor Centre appoints two new directors

To help drive forward its goal of unlocking the full potential of the UK semiconductor industry, the UK Semiconductor Centre (UKSC) has appointed Martin O’Sullivan as director of investment and Steve Taylor as director of strategic marketing...

Secure at First Silicon: Reducing Cost and Risk

How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support certification, and ensure your silicon meets its security requirements from day one. The post Secure at First Silicon: Reducing Cost and Risk appeared first on Semiconductor Engineering.

Enabling Physical AI and Robotics: Platform for the Intelligent Edge

How physical AI systems combine sensors, edge processing, and connectivity to enable real-time, intelligent decision-making directly on devices like robots and smart edge systems. The post Enabling Physical AI and Robotics: Platform for the Intelligent Edge appeared first on Semiconductor Engineering.

Ensuring Trustworthiness of AI-Enhanced Embedded Systems

A road-vehicle standard-based unified AI safety lifecycle and blueprint for integrating both robustness and resilience into AI systems deployed in safety-critical domains. The post Ensuring Trustworthiness of AI-Enhanced Embedded Systems appeared first on Semiconductor Engineering.

Chip Briefing

Daily: South Korea has helium stock until June

6 min read.

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs

How a next‑gen SRAM compiler IP for TSMC N5A and N3A helps design teams with measurable gains in PPA, reliability, and system robustness. The post Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs appeared first on Semiconductor Engineering.

Hardware Deployment for Secure AI Using Confidential Computing

Key considerations for secure AI, along with limitations and recommendations to overcome the limitations for secure AI deployments. The post Hardware Deployment for Secure AI Using Confidential Computing appeared first on Semiconductor Engineering.

Radar SLAM Application on Vision DSPs based on Novel IO-ICP

A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications. The post Radar SLAM Application on Vision DSPs based on Novel IO-ICP appeared first on Semiconductor Engineering.

Blog Review: Apr. 1

Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering.

AI’s Potential And Limitations In Chip Design

Full automation is still a goal, but humans will still be in the loop for the foreseeable future. The post AI’s Potential And Limitations In Chip Design appeared first on Semiconductor Engineering.

Preparing For The Multiphysics Future of 3D ICs