Learn the importance of integrating digital isolators in smart home devices to ensure safety and reliability. The post Integrating Digital Isolators in Smart Home Devices appeared first on EE Times.
A cellular data service upgrade prompts new hardware acquisitions: four total devices. Smart or superfluous? Read on! The post Cellular hotspots: Multi-option evaluation thoughts appeared first on EDN.
One morning in May 2019, a cardiac surgeon stepped into the operating room at Boston Children’s Hospital more prepared than ever before to perform a high-risk procedure to rebuild a child’s heart. The surgeon was experienced, but he had an additional advantage: He had already performed the procedure on this...
There are many ways to categorize engineers—to “slice and dice” them, if you will. I’m speaking figuratively, of course (we don’t want anyone to get any unfortunate ideas…especially since… the incident). Just sticking to the electronics realm, we have analog and digital, hardware and software, those who simulate and those...
In booth 1637 at SATShow Week in the Walter E. Washington Convention Center in Washington DC (24–26 March), MACOM Technology Solutions Inc of Lowell, MA, USA is showcasing its latest RF and optoelectronics solutions for satellite communications (SATCOM) that can enable higher frequency bands, improved power efficiency and more scalable...
German startup Q.ANT reaches full production capacity as demand surges for energy-efficient photonic AI processors. The post Q.ANT Hits Full Production Capacity for Photonic AI Processors appeared first on EE Times.
A technical examination of the sensing, motion control, power, and thermal challenges facing humanoid robotics engineers — with component-level design strategies for real-world deployment.What Attendees will LearnWhy motion control remains the hardest unsolved problem — Explore the modelling complexity, real-time feedback requirements, and sensor fusion demands of maintaining stable bipedal...
Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — says that it has expanded its focus and readiness to support the rapidly evolving satellite communications (SatCom) market. With a portfolio spanning low-noise...
The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs worldwide. The post Scoping out the chiplet-based design flow appeared first on EDN.
Closing the gap between warpage simulation results and actual measurement data. The post Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages appeared first on Semiconductor Engineering.
High‑NA EUV's reduced field size is driving new innovation in optical proximity correction and mask synthesis. The post Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026 appeared first on Semiconductor Engineering.
Matching a simulated device to its real-world counterpart with sub-nanometer accuracy. The post Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles appeared first on Semiconductor Engineering.
Co-packaged optics face scaling challenges such as bandwidth density mismatches, assembly complexity, and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering.
Chips that didn’t need cooling may require it now. The post Liquid Cooling Drives Other Localized Cooling appeared first on Semiconductor Engineering.
Progress is steady, but fundamental questions remain. The post 2D Semiconductors Inch Forward appeared first on Semiconductor Engineering.
Using AI to transform semiconductor operations, which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering.
Original Article By SemiVision Research [Reading time: 25 mins]
4.5 min read.
Original Article By SemiVision Research [Reading time: 10 mins]
Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature that can enable verification of data rates up to 7.5 Mbps.