MIT Pioneers Two-Chip Authentication to Secure Cryptographic Schemes
MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without storing cryptographic keys on external servers.
MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without storing cryptographic keys on external servers.
Marcel Franz takes the lead role at the Stewart Blusson Quantum Matter Institute The post Canada’s QMI Drives Quantum Advances, Global Collaboration appeared first on EE Times.
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has released its Phase 18 Reliability Report, providing new insights into eGaN device reliability. ..
The rapid proliferation of LLMs and other AI applications, and of high-end GPU platforms that run them, is putting intense pressure on the performance requirements for memory technologies. Designers need to be keenly aware of how to make the most of their memory and controller choices, which can be moving...
To celebrate Women's History Month, we spotlight Erna Hamburger, an engineer who graduated top of her class at EPFL in 1933 and spent decades breaking institutional barriers in electrical engineering and measurement science.
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has entered into separate, privately negotiated subscription agreements with investors pursuant to which it will place (i) $379m of its 3.5% convertible 1.5 lien senior secured notes due 2031 and (ii) 3,250,030...
The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took...
A growing number of Nigerian companies are turning to kit-based assembly to bring electric vehicles to market in Africa. Lagos-based Saglev Micromobility Nigeria recently partnered with Dongfeng Motor Corporation, in Wuhan, China, to assemble 18-seat electric passenger vans from imported kits.Kit-based assembly allows Nigerian firms to reduce costs, create jobs,...
A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage. The post Single-stage design removes 48-V bus in servers appeared first on EDN.
The ST64UWB family of ultra-wideband SoCs from ST provides increased range and processing capability for automotive applications. The post UWB SoCs extend ranging and radar performance appeared first on EDN.
Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers. The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.
AOS has introduced two MOSFETs—the 25 V AONC40212 and 80 V AONC68816—in 3.3×3.3 mm source-down DFN packages with double-side cooling. The post Double-side cooled MOSFETs reduce server heat appeared first on EDN.
Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI data centers. The post Buck ICs improve AI data center power appeared first on EDN.
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24V loads. Leveraging synchronous...
The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for...
LEUVEN (Belgium), MARCH 18, 2026— Today, imec, a world-leading research and innovation hub in advanced semiconductor technologies, announces the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. With this strategic milestone, imec reinforces its position as the industry’s launchpad into the...
Each year, the construction industry builds $2.1 trillion worth of structures in the U.S., and more than three-quarters of those projects face delays, according to the Associated General Contractors of America. One solution could be robots. Virginia Tech researchers, in collaboration with Procon Consulting, are developing a coordinated team of...
BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has partnered with US government relations, corporate advisory and public affairs firm Michael Best Strategies to enhance engagement with key decision...
Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More The post Siemens...