Wafer fabrication

Data infrastructure semiconductor solutions provider Marvell Technology Inc of Santa Clara, CA, USA and Mojo Vision Inc of Cupertino, CA, USA — which is pioneering a wafers-in, wafers-out micro-LED platform designed to enable AI applications — have announced a long-term collaboration to develop a new class of optical interconnect solutions...

Semiconductor Today

CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects

Mar 12, 2026

Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interconnects with integrated nanolasers for next-generation computing) have announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300mm integrated photonics process...

SemiAnalysis

The Great AI Silicon Shortage

Mar 12, 2026

TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner

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Semiconductor Today

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

Mar 12, 2026

South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — has recently completed the development of its silicon carbide (SiC) planar MOSFET process platform, which it says is gaining traction in the next-generation compound power...

Semiconductor Today

La Luce Cristallina releases beta-version of 200mm barium titanate wafer

Mar 11, 2026

La Luce Cristallina of Austin, TX, USA says that the beta-version of its 200mm (8-inch) barium titanate (BaTiO3) wafer is now available to customers for evaluation in advanced electro-optic modulators for telecoms and datacoms applications. By enabling ultra-low-voltage operation, La Luce Cristallina’s BaTiO3 platform is said to advance co-packaged optics...

Semiconductor Today

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

Mar 10, 2026

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade...

Semiconductor Today

TNO and High Tech Campus Eindhoven begin construction of first 6-inch indium phosphide photonic chip foundry

Mar 13, 2026

The research institute TNO (the Netherlands Organization for Applied Scientific Research in Delft) and High Tech Campus Eindhoven are starting construction of what is reckoned will be the world’s first foundry for producing indium phosphide photonic chips on 6-inch wafers. The official opening was attended by European Commission executive vice-president...

Electronics Weekly

Memory shortage to last 4-5 years says SK boss

Mar 17, 2026

The memory shortage could last another four to five years, says the chairman of SK Group, Chey Tae-won. The supply of base wafers is lagging demand by more than 20%, ... The post Memory shortage to last 4-5 years says SK boss appeared first on Electronics Weekly.

Semiconductor Today

Halo selects Eyelit to power scalable SiC wafering production with composable MES

Mar 19, 2026

Eyelit Technologies of Holmdel, N.J, USA (which provides AI-powered optimized planning, scheduling and execution systems) says that its software solution suite has been selected by laser-based silicon carbide (SiC) wafering firm Halo Industries Inc of Santa Clara, CA, USA (a 2014 spin-out from Stanford University) to support its rapidly scaling...

Semiconductor Today

SemiQ launches QSiC Dual3 family of 1200V half-bridge MOSFET modules

Mar 23, 2026

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has launched the QSiC Dual3, a family of 1200V half-bridge MOSFET modules for motor drives in data-center cooling systems, grid converters in energy...

Semiconductor Engineering

Chip Industry Week In Review

Apr 03, 2026

Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...

Semiconductor Engineering

AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability

Apr 02, 2026

A focus on DRAM and NAND is squeezing NOR wafer capacity and backend test resources. The post AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability appeared first on Semiconductor Engineering.

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Hot Topics

Marvell and Mojo Vision to co-develop high-density micro-LED connectivity solutions

CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects

The Great AI Silicon Shortage

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

La Luce Cristallina releases beta-version of 200mm barium titanate wafer

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

TNO and High Tech Campus Eindhoven begin construction of first 6-inch indium phosphide photonic chip foundry

Memory shortage to last 4-5 years says SK boss

Halo selects Eyelit to power scalable SiC wafering production with composable MES

SemiQ launches QSiC Dual3 family of 1200V half-bridge MOSFET modules

Chip Industry Week In Review

AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability