Supply Chain

The network of suppliers and logistics for semiconductor production – from raw wafer suppliers, chemical and gas companies, to fab equipment makers, packaging/test houses, and distributors. Supply chain issues (like material shortages, logistics delays, or trade restrictions) can heavily impact chip production. Managing supply chain resilience (multi-sourcing, onshoring critical steps) is a major industry focus, especially after recent shortages and geopolitical events.

28 articles

IEEE Spectrum Semiconductors

Overcoming Core Engineering Barriers in Humanoid Robotics Development

Mar 19, 2026

A technical examination of the sensing, motion control, power, and thermal challenges facing humanoid robotics engineers — with component-level design strategies for real-world deployment.What Attendees will LearnWhy motion control remains the hardest unsolved problem — Explore the modelling complexity, real-time feedback requirements, and sensor fusion demands of maintaining stable bipedal...

IEEE Spectrum Semiconductors

ENIAC, the First General-Purpose Digital Computer, Turns 80

Mar 19, 2026

Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...

Semiconductor Today

Infineon and DG Matrix partner to drive solid-state transformer technology for AI data centers and industrial power applications

Mar 25, 2026

Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...

3D InCites

Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference

Mar 24, 2026

This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted as a platform for the industry’s brightest engineers, researchers, suppliers, and students from across the microelectronics packaging ecosystem to come together to share innovations shaping next-generation computing systems.  With record...

EE Journal

Renesas’ Radiation‑Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission

Apr 02, 2026

Düsseldorf, April 2, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in...