At MWC, Intel Outlines CPU-Driven Case for Telecom Networks
Telecom operators are updating 5G infrastructure with AI and preparing for 6G. The post At MWC, Intel Outlines CPU-Driven Case for Telecom Networks appeared first on EE Times.
Intel Corporation – a leading Integrated Device Manufacturer (IDM) known for its x86 microprocessors. Intel designs and fabricates its own chips (with a long history of advanced fabs in the U.S.) and is now also expanding into foundry services for external customers. Since its founding in 1968 Intel has been an IDM (designing and building its chips in-house), and it has driven many process technology innovations (e.g., high-k metal gate, FinFET at 22nm).
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Telecom operators are updating 5G infrastructure with AI and preparing for 6G. The post At MWC, Intel Outlines CPU-Driven Case for Telecom Networks appeared first on EE Times.
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the...
This Week in Chips: Key developments across the semiconductor and adjacent universes.
SummaryFully homomorphic encryption (FHE) allows computing on encrypted data without decryption, but it’s currently slow on standard CPUs and GPUs.Intel’s Heracles chip accelerates FHE tasks up to 5,000 times faster than top Intel server CPUs.Heracles uses a 3-nanometer FinFET technology and high-bandwidth memory, enabling efficient encrypted computing at scale.Startups and...
Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.
AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.
A new technical paper, “Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems,” was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract “Rapid progress in generative AI has given rise to Compound AI systems – pipelines comprised of...
Intel’s efforts in the phone business did not end well, but 21 years ago, the company’s mobile targets were ambitious: ‘Thecnext decade will see the way people interact with computers ... The post When Intel Was Bullish On Phones appeared first on Electronics Weekly.
Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and...
Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...
This Week in Chips: Freshy chip news from the semi galaxy, and neighboring dwarf stars
Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...