HPC

Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to Compete

The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the...

Xanadu and AMD Accelerate Quantum Computing for Aerospace and Engineering

TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD...

40 Years of Wireless Evolution Leads to a Smart, Sensing Network

Every generation of mobile networks, from 1G to 5G, has rewritten the rules of how the world lives and works. The coming 6G revolution, by decade’s end, will represent a new direction still, toward a universal data fabric where millions of agents collaborate in real-time across the digital and physical...

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade...

IBM publishes blueprint for integrating quantum computers into supercomputer clusters

IBM has published a quantum‑centric supercomputing reference architecture – a blueprint for integrating quantum computing into modern supercomputing environments. IBM’s progress in extending useful quantum computing to HPC is discussed ... The post IBM publishes blueprint for integrating quantum computers into supercomputer clusters appeared first on Electronics Weekly.

Sivers, O-Net and Enablence partner to develop external light sources for AI data centers

Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic partnership with optical communication device, module and subsystem maker O-Net Technologies (Group) Co Ltd of Shenzhen, China and Enablence Technologies Inc of Ottawa, Ontario, Canada...

IBM Unrolls Blueprint For Quantum-Classical HPC Computing

ENIAC, the First General-Purpose Digital Computer, Turns 80

Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...

Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology

Alchip Technologies has recently reported significant progress in the development of advanced 2nm  ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More The post Alchip’s Leadership in ASIC...

Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E

Rambus launches 16 GT/s HBM4E controller for AI and HPC, pushing 4 TB/s bandwidth per stack. The post Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E appeared first on EE Times.