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Heterogeneous Integration

Advanced approaches to intimately integrate different types of chips or technologies into a unified system beyond just PCBs. This includes chiplet integration in packages, photonic-electronic integration, and 3D stacking of diverse technologies (like logic+memory, or GaN on silicon). R&D in heterogeneous integration is critical as More-than-Moore" progress – allowing specialized chiplets (analogs

14 articles

Semiconductor Today

CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects

Mar 12, 2026

Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interconnects with integrated nanolasers for next-generation computing) have announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300mm integrated photonics process...

3D InCites

Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley

Mar 11, 2026

March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)– Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer...

Semiconductor Today

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

Mar 10, 2026

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade...

Semiconductor Today

Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies

Mar 10, 2026

Spain-based multi-national Indra Group is leading the research, development and innovation (RDI) project GIGaNTE (Gallium Nitride and Advanced Packaging Technologies Research Initiative), a strategic initiative to provide Spain with the necessary capabilities to autonomously develop technologies based on gallium nitride (GaN) for advanced defence applications, especially in high-reliability radar and...

Electronics Weekly

CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin.

Mar 16, 2026

The post CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin. appeared first on Electronics Weekly.

SemiWiki

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

Mar 17, 2026

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More The post AI-Driven Automation in Semiconductor Design: The Fuse...

EDN

Scoping out the chiplet-based design flow

Mar 19, 2026

The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs worldwide. The post Scoping out the chiplet-based design flow appeared first on EDN.

Semiconductor Engineering

Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration

Mar 19, 2026

Co-packaged optics face scaling challenges such as bandwidth density mismatches, assembly complexity, and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering.

Semiconductor Today

POET and LITEON to co-develop optical modules for AI applications

Mar 18, 2026

POET Technologies Inc of Toronto, Ontario, Canada –– which designs and implementats highly integrated optical engines and light sources for artificial intelligence networks –– has announced a strategic collaboration with optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan. The partnership aims to co-develop next-generation optical communication modules built...

IEEE Spectrum Semiconductors

Why Thermal Metrology Must Evolve for Next-Generation Semiconductors

Mar 23, 2026

An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver.What Attendees will LearnWhy heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted...

3D InCites

Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging

Mar 27, 2026

Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...

Semiconductor Today

Polar Light awarded €1.1m EU grant for 18-month 2ndGenMicroLED project

Mar 26, 2026

Polar Light Technologies AB — which stems from research by founder professor Per-Olof Holtz and his team at Linköping University (with support from Sweden’s innovation agency Vinnova) — has been awarded a European Union (EU) Eurostars grant.With a total budget of €1.1m, the 18-month project ‘2ndGenMicroLED’ aims to deliver the...

The Semiconductor Newsletter

Advanced Packaging in the Semiconductor Industry

Mar 25, 2026

A Comprehensive Report (2026)

IEEE Spectrum Semiconductors

Are U.S. Engineering Ph.D. Programs Losing Students?

Mar 25, 2026

U.S. doctoral programs in electrical engineering form the foundation of technological advancement, training the brightest minds in the world to research, develop, and design next-generation electronics, software, electrical infrastructure, and other high-tech products and systems. Elite institutions have long served as launchpads for the engineers behind tomorrow’s technology. Now that...

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Hot Topics

Heterogeneous Integration

CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects

Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies

CHIPS Act investment. Advanced packaging. AI-driven system design. Microelectronics US connects 3,000+ industry leaders shaping North America’s semiconductor future. April 22–23, Austin.

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

Scoping out the chiplet-based design flow

Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration

POET and LITEON to co-develop optical modules for AI applications

Why Thermal Metrology Must Evolve for Next-Generation Semiconductors

Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging

Polar Light awarded €1.1m EU grant for 18-month 2ndGenMicroLED project

Advanced Packaging in the Semiconductor Industry

Are U.S. Engineering Ph.D. Programs Losing Students?