Chips for data center infrastructure – beyond standard CPUs and GPUs, this covers networking ASICs (high-speed switch/router chips), SmartNICs and DPUs for offloading network/storage tasks, memory chips (high-density DRAM, HBM, NAND for SSDs in enterprise), and accelerators for cloud workloads (AI ASICs, video transcoders, FPGA acceleration boards). Data center applications prize performance, throughput, and energy efficiency at scale.
45 articles
Original Article By SemiVision Research [Reading time: 15 mins]
In booth #2027 at the IEEE Applied Power Electronics Conference (APEC 2026) in San Antonio, Texas (22–26 March), Navitas Semiconductor Corp of Torrance, CA, USA is exhibiting a 250kW solid-state transformer (SST) platform developed by the Power Electronics Laboratory of Switzerland’s École Polytechnique Fédérale de Lausanne (EPFL) that enables the...
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner
OXFORD, England-March 10, 2026-Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch. Designed to unlock peak performance in AI datacenters, Salience Labs’ all-optical switch technology improves network latency, throughput and reliability metrics while...
Every generation of mobile networks, from 1G to 5G, has rewritten the rules of how the world lives and works. The coming 6G revolution, by decade’s end, will represent a new direction still, toward a universal data fabric where millions of agents collaborate in real-time across the digital and physical...
Original Article By SemiVision Research [Reading time: 15 mins]
Co-packaged optics technology will have a big impact on system power and the cost of data movement. The post CPO Is Extending The Limits Of What’s Possible In AI Data Centers appeared first on Semiconductor Engineering.
For reaching farther into another data center, developers are now talking about scale-across. The post Scale-Up, Scale-Out Get a New Partner appeared first on Semiconductor Engineering.
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic partnership with optical communication device, module and subsystem maker O-Net Technologies (Group) Co Ltd of Shenzhen, China and Enablence Technologies Inc of Ottawa, Ontario, Canada...
As electronics demand higher energy density, one component has proved challenging to shrink: the capacitor. Making a smaller capacitor usually requires thinning the dielectric layer or electrode surface area, which has often resulted in a reduction of power. A new polymer material could help change that.In a study published 18...
Looming over the internet lasers and firestarting phones companies were touting at Mobile World Congress in Barcelona this month, was a more nebulous but much larger announcement: a pan-European cloud called EURO-3C.EURO-3C’s backers – Spanish telecoms giant Telefónica, dozens of other European companies, and the European Commission (EC) – aim...
The America’s Talent Strategy: Building the Workforce for the Golden Age report, published last year by the U.S. Departments of Commerce, Education, and Labor, identified a significant engineering and skills gap. The 27-page report concluded that the shortage of talent in essential areas—including advanced manufacturing, artificial intelligence, cloud computing, and...
The rapid ascent of artificial intelligence and semiconductor manufacturing has created a paradox: Industries are booming yet they face a critical shortage of skilled workers. Demand for data center technicians, fabrication facility workers, and similar positions is growing. There aren’t enough candidates with the right skill sets to fill the...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced the first volume production orders by...
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique...
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by...
the most read stories on our website cover TI's 800V DC power architecture for AI data centers, a quantum‑centric supercomputing reference architecture and Honda cancelling EV models. The post Most Read – Honda cancels EVs, IBM quantum blueprint, Elon Musk fab appeared first on Electronics Weekly.
Datacentre capex increased 57% in 2025 as AI deployments, complemented by general infrastructure investments, accelerated, says Dell’Oro, which expects hyperscalers and AI model developers to sustain strong capex momentum in ... The post 2025 datacentre capex up 57% appeared first on Electronics Weekly.
Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers. The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.
Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI data centers. The post Buck ICs improve AI data center power appeared first on EDN.
Original Article By SemiVision Research [Reading time: 25 mins]
Infineon Technologies AG of Munich, Germany has introduced two new high-voltage intermediate bus converter (HV IBC) reference designs to help customers accelerate the transition to AI server power architectures powered by ±400V and 800V DC. Enabled by Infineon’s 650V CoolGaN switches, the designs target hyperscalers, power architects, and server OEMs...
Happy 80th anniversary, ENIAC! The Electronic Numerical Integrator and Computer, the first large-scale, general-purpose, programmable electronic digital computer, helped shape our world.On 15 February 1946, ENIAC—developed in the Moore School of Electrical Engineering at the University of Pennsylvania, in Philadelphia—was publicly demonstrated for the first time. Although primitive by today’s...
This is a sponsored article brought to you by PNY Technologies.In today’s data-driven world, data scientists face mounting challenges in preparing, scaling, and processing massive datasets. Traditional CPU-based systems are no longer sufficient to meet the demands of modern AI and analytics workflows. NVIDIA RTX PROTM 6000 Blackwell Workstation Edition...
Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — and Wiwynn Corp of Taipei, Taiwan, a cloud IT infrastructure provider for data centers, have announced a strategic partnership to deliver optically connected, rack-scale AI systems...
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated...
A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract “The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and...
At the Optical Fiber Communication Conference and Exhibition (OFC 2026) in Los Angeles (15–19 March), Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) demonstrated how its solutions...
A couple of folks have asked me to write on nuclear power. Nuclear offers additional sources for power generation, a pressing concern thanks to demand from giant data centers. Also, investment by Microsoft, Sam Altman and others signals their urgency to accelerate past slow moving utilities plans. I have some...
Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) has received a new volume order from one of its major hyperscale customers for 800G single-mode data-center transceivers to...
To stay competitive, many small businesses need advanced wireless communication networks, not only to communicate but also to leverage technologies such as artificial intelligence, the Internet of Things, and robotics. Often, however, the businesses lack the technical expertise needed to install, configure, and maintain the systems.Bhaskara Rallabandi, who spent more...
Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centers. The TDM24745T is a new OptiMOS™ quad‑phase power module designed to meet the...
QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. The post SiC modules raise power density for AI servers appeared first on EDN.
Arm unleashes its first silicon AGI CPU to power agentic AI in data centers, challenging x86 rivals. The post Arm Launches First Silicon CPU, Targets Data Center Agentic AI Workloads appeared first on EE Times.
Original Article By SemiVision Research [Reading time: 25 mins]
Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonics products for optical networks and lasers for industrial and consumer markets) plans to establish a new US manufacturing facility in Greensboro, North Carolina. The 240,000ft2 facility will produce indium phosphide (InP)-based optical devices that serve as critical...
News highlights Cambridge, England – Mar. 24, 2026 – Arm Holdings plc (NASDAQ: ARM) today announced the next evolution of the Arm compute platform, extending into production silicon products for the first time in the company’s history. This begins with the launch of the Arm AGI CPU, an Arm-designed CPU for AI data centers,...
Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...
Last week’s Nvidia GTC conference highlighted new chip architectures to power AI. But as the chips become faster and more powerful, the remainder of data center infrastructure is playing catch-up. The power-delivery community is responding: Announcements from Delta, Eaton, and Vertiv showcased new designs for the AI era. Complex and...
The undying thirst for smarter (historically, that means larger) AI models and greater adoption of the ones we already have has led to an explosion in data-center construction projects, unparalleled both in number and scale. Chief among them is Meta’s planned 5-gigawatt data center in Louisiana, called Hyperion, announced in...
Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...
Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received an initial order from a major new customer that is “a global leader in networking products and solutions” and a “major supplier to the data-center optical transceiver market”. The customer is developing advanced...
Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ... The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.
Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST's photonic chip packaging; USC's new memory; virtual process simulation for automotive. The...