A small unpackaged die designed to function as part of a larger multi-chip module. Chiplets implement modular functions and are combined on a package (via interconnects on an interposer or substrate) to form a system. This disaggregated approach lets different chiplets use different optimal process nodes for cost and yield benefits.
16 articles
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.
The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More The post Reducing Risk Early:...
UMC has formed a partnership with HyperLight, a spin out from Harvard University’s Laboratory for Nanoscale Optics, to mass produce thin-film lithium niobate (TFLN) chiplets before the end of this ... The post UMC and Hyperlight hook up on TFLN appeared first on Electronics Weekly.
The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much …...
The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important,...
This special section will review key building blocks of chiplet design while separating hype from reality. The post What the special section on chiplets design has to offer appeared first on EDN.
A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate (BER). Meeting stringent...
The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took...
The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs worldwide. The post Scoping out the chiplet-based design flow appeared first on EDN.
Analyzing the CPU, GPU, and LPU chip ratios unveiled at the Nvidia GTC keynote, the impact of the Groq LPX chip on disaggregated decoding, and its potential for speculative decoding in AI inference
At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More The post...
Edge, in-sensor AI processors; TMDC-based transistors; DRAM read disturbance threshold; replay-based validation for chiplets; LLM-specific algorithmic attacks; noise in tellurium transistors; FMEDA safety metrics; HW reverse engineering; slowdowns in multi-GPU LLM inference. The post Chip Industry Technical Paper Roundup: Mar. 31 appeared first on Semiconductor Engineering.
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...
Groq LP30, LPX Rack, Attention FFN Disaggregation, Oberon & Kyber Updates, Nvidia's CPO Roadmap, Vera ETL256, CMX & STX
Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering.
Security must be addressed at the platform level to ensure every security-relevant chiplet has an identity that can be consistently validated. The post Developing A Security Framework For Chiplet-Based Systems appeared first on Semiconductor Engineering.