Mistral AI, the French AI developer, says it has taken on debt of $830 million to run a datacentre. The datacentre, at Bruyeres-le-Chatel near Paris, is used to train of ... The post Mistral raises $830m appeared first on Electronics Weekly.
OQ Technology, a Luxembourg-based satellite operator pioneering 5G Non-Terrestrial Network (NTN) connectivity through its direct-to-device (D2D) global satellite network, has launched two satellites – ERMIS-1 and ERMIS-2 – aboard SpaceX’s ... The post Greeks launch satellites for D2D comms appeared first on Electronics Weekly.
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A new technical paper, “Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor,” was published by Teikyo University and RIKEN. Abstract “We theoretically investigated the readout process of a spin–qubit structure based on a gate-all-around (GAA) transistor. Our study focuses on a logical qubit composed of two physical...
Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.
Musk unveils TeraFab, aiming to disrupt chipmaking with AI-driven, human-free fabs. The post TeraFab: What If It Is Done Differently? appeared first on EE Times.
To stay competitive, many small businesses need advanced wireless communication networks, not only to communicate but also to leverage technologies such as artificial intelligence, the Internet of Things, and robotics. Often, however, the businesses lack the technical expertise needed to install, configure, and maintain the systems.Bhaskara Rallabandi, who spent more...
Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centers. The TDM24745T is a new OptiMOS™ quad‑phase power module designed to meet the...
Toshiba Corp of Kawasaki, Japan has signed a memorandum of understanding (MoU) to start discussions regarding a business integration of the semiconductor business of its subsidiary Toshiba Electronic Devices & Storage Corp (TDSC), the semiconductor business of ROHM Co Ltd, and the power device business of Mitsubishi Electric Corp. The...
The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of the most critical applications of robots is material handling, where grippers are used to move objects, such as automotive parts, logistics packages, food ingredients, and...
KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields. This sensor is a Type-II superlattice (T2SL) infrared sensor with over 1 million pixels, capable of detecting both...
Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module), providing a drop-in, pin-compatible upgrade for the QSMP-15 that now features an industrial-grade STM32MP2 MPU. The QSMP-20 also takes advantage of lower cost DDR3 RAM with shorter...
RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition targets engineers developing high-reliability power systems where component qualification is a formal requirement—giving them a path to AEC-Q compliance without rebuilding their qualification process from...
Kista, Sweden – March 30, 2026 – Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced general availability of its 7-15GHz DaybreakTM beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defense arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network...
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers...
Charlie Peppiatt has served as Chief Executive Officer of Gooch & Housego since September 2022. He joined the company from TT Electronics, where he was Executive Vice President following TT’s acquisition of Stadium Group plc. Prior to that, Charlie served as Chief Executive Officer of Stadium Group from 2013 until...
The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.
How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running. The post TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive appeared first on EDN.
Why the takeover interest in BESI reflects a broader transformation in semiconductor equipment Step by step, this industry is coalescing around a central battleground. As front-end and back-end technologies converge, control over key interconnect steps is emerging as a critical differentiator. In today’s article, Gabriela Pereira, Senior Technology & Market Analyst,...