Regulatory clarity promised for space manufacturing of pharmaceuticals

UK government agencies are announcing their intention to work together to support in-space manufacturing of pharmaceuticals. This is in terms of regulatory clarity and official support. It sees potential in ... The post Regulatory clarity promised for space manufacturing of pharmaceuticals appeared first on Electronics Weekly.

Most Read – RS buys BPX, Nvidia photonics, AI-RAN in 6G

There's Rohm licensing TSMC’s GaN process technology, Nvidia building 6G wireless networks, and RS Group buying a specialist distributor of industrial automation and control. The post Most Read – RS buys BPX, Nvidia photonics, AI-RAN in 6G appeared first on Electronics Weekly.

Ceva integrates modem IP for satellite and terrestrial terminals

Launched at MWC in Barcelona, the PentaG-NTN is a 5G-NTN (non-terrestrial network) modem IP subsystem for satellite user terminals supporting LEO and MEO constellations. It enables satellite operators, constellation and ... The post Ceva integrates modem IP for satellite and terrestrial terminals appeared first on Electronics Weekly.

Last-level cache has become a critical SoC design element

LLC, positioned between external memory and internal subsystems, stores frequently accessed data close to compute resources. The post Last-level cache has become a critical SoC design element appeared first on EDN.

Is Your IoT Strategy Ready for the New Landscape?

Shifting regulations will push the market beyond price comparisons toward providers offering flexibility, resilience, and clearer guidance. The post Is Your IoT Strategy Ready for the New Landscape?   appeared first on EE Times.

Marktech adds 230nm and 265nm deep UV, 310nm UVB and 340nm UVA LEDs

Marktech Optoelectronics Inc of Latham, NY, USA has announced an expanded portfolio of high-power UV LED light sources with new UV emitters spanning 230nm to 400nm. These devices strengthen the firm’s offerings across the ultraviolet light spectrum — from deep-UV LED (DUV LED, far-UVC LED) sterilization wavelengths to longer UVB...

Chip Industry Week In Review

AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared first on Semiconductor...

TI and Nvidia hook up on humanoid robots

TI is combining its motor control, sensing and power technologies with Nvidia’s robotics compute, ethernet based sensing and simulation technologies to validate perception, actuation and safety of humanoid robots earlier and ... The post TI and Nvidia hook up on humanoid robots appeared first on Electronics Weekly.

Here come the Feelies

NTT DOCOMO has developed a new system powered by FEEL TECH haptic technology that allows fans to experience physical sensations transmitted from artists, creating a stronger sense of closeness with ... The post Here come the Feelies appeared first on Electronics Weekly.

AI startups pull in $220 billion in Jan/Feb 2026

In the first two months of 2026, AI startups have attracted $220 billion, with $189 billion raised in February alone, says a report from BestBrokers.com. This is almost three times ... The post AI startups pull in $220 billion in Jan/Feb 2026 appeared first on Electronics Weekly.

Imec accelerates DNA data storage

Imec and Atlas Data Storage, a specialist in production-scale DNA data storage, have joined forces to to accelerate the development of digital data storage using synthetic DNA. The collaboration combines ... The post Imec accelerates DNA data storage appeared first on Electronics Weekly.

The Last Line of Defense for Copper: The Rise of Co-Packaged Copper (CPC) in AI Data Center Interconnect Architectures

Original Article By SemiVision Research [Reading time: 15 mins]

Apple’s spring 2026 soirée: The rest of the story

With smartphone and tablet news already discussed, what else did Apple unveil this week? Read on for all the goodies and their details. The post Apple’s spring 2026 soirée: The rest of the story appeared first on EDN.

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.

From TV Repairman to Electromagnetic Compatibility Expert

No one had very high career aspirations for teenager David A. Weston—except for Weston himself. Growing up in London, he scored low on the U.K. national assessment test given to students finishing primary school. The result meant that his next path was either to become a laborer or attend a...

Siemens expands semiconductor-based circuit protection portfolio, debuts circular soft starter

SENTRON Electronic Circuit Protection Device (ECPD) will soon be available with integrated Residual Current Monitoring function A three-phase ECPD version for high-voltage (400V) applications is on the roadmap for upcoming releases First circular SIRIUS 3RW5 -Z R11 refurbished soft starter with identical product features but typically up to 50 percent...

Broadcom May Become The Biggest Counterbalance To Nvidia

Reducing Risk Early: Multi-Die Design Feasibility Exploration

The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More The post Reducing Risk Early:...

STMicro MCUs Aim to Redefine Entry-Level Performance For Less than $1

STMicro launches STM32C5 MCUs—triple performance, enhanced security, all for under $1. The post STMicro MCUs Aim to Redefine Entry-Level Performance For Less than $1 appeared first on EE Times.

An Interview with Rivian’s Mukund Chavan About RAP1

Rivian designed its own autonomy SoC. Why?