Daily: Proposal to trade US investment for AI chips

4 min read.

Optics Primer, Part 3: Co-Packaged Optics (CPO)

From EML lasers and DSPs to silicon photonics and external CW lasers. How CPO works and the impact on the optical supply chain.

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.

BluGlass enters AUS$1.25m development program with US tier-1 defence prime for visible GaN DFB lasers and gain chips

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has entered a new AUS$1.25m multi-phased development program, expected to progress over a 14–24-month period, to deliver its gallium nitride (GaN)...

Do Offshore Wind Farms Pose National Security Risks?

When the Trump administration last year sought to freeze construction of offshore wind farms by citing concerns about interference with military radar and sonar, the implication was that these were new issues. But for more than a decade, the United States, Taiwan, and many European countries have successfully mitigated wind...

How AI Is Boosting Gender Equality In High Performance Racing

Laminated: The Corporate version of Strategy

or the business of tier 2 Fabless Semiconductor Companies

Smartphone production grows 2.5% to 1.25 billion units in 2025

Global smartphone production grew 2.7% quarter-on-quarter from 328 million units in third-quarter 2025 to 337 million units in fourth-quarter 2025, supported by strong shipments of Apple’s new iPhone lineup, according to market research firm TrendForce...

AI Infrastructure Value Chain & Investment Bottlenecks Analysis for US/EU Markets

Large–Small Company Linkages in the AI Infrastructure Stack

Skyworks and MediaTek demo early 6G FR3 and PC1 RF front-end innovations at MWC

Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) is showcasing an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at the Mobile World Congress 2026 (MWC26) in Barcelona, Spain (2–5 March). Presented in collaboration with Taiwanese fabless semiconductor company MediaTek Inc —...

From Middle East War to Taiwan’s Semiconductor Fabs: Why a Regional Conflict Could Shake the Entire World

Original Article By SemiVision Research [Reading time: 15 mins]

Week 10, 2026

The Semiconductor Newsletter

Diode-Based Phase Detectors: Key Principles and Example Circuits

We examine phase detectors that leverage either the nonlinear characteristics or switching capabilities of diodes to perform multiplication.

Military AI Policy Needs Democratic Oversight

A simmering dispute between the United States Department of Defense (DOD) and Anthropic has now escalated into a full-blown confrontation, raising an uncomfortable but important question: who gets to set the guardrails for military use of artificial intelligence — the executive branch, private companies or Congress and the broader democratic...

Laser-Based 3D Printing Could Build Future Bases on the Moon

Through the Artemis Program, NASA hopes to establish a permanent human presence on the Moon in its southern polar region. China, Russia, and the European Space Agency (ESA) have similar plans, all of which involve building bases near the permanently shadowed regions (PSRs)—craters that contain water ice—that dot the South...

Apple’s First Made-in-U.S. Chips Fall Short of Claim

Apple's U.S.-based chips actually rely on Taiwan for final assembly. The post Apple’s First Made-in-U.S. Chips Fall Short of Claim appeared first on EE Times.

Custom Compute Engine Biz Growing More Than Marvell Ever Hoped

Optimizing In-Memory AI Accelerators Across Multiple Workloads (KAUST, Compumacy)

Researchers from KAUST and Compumacy for Artificial Intelligence Solutions have released “Joint Hardware-Workload Co-Optimization for In-Memory Computing Accelerators”. Abstract “Software-hardware co-design is essential for optimizing in-memory computing (IMC) hardware accelerators for neural networks. However, most existing optimization frameworks target a single workload, leading to highly specialized hardware designs that do not...

10-Year Roadmap for AI + Hardware (UIUC, UCLA, Stanford et al.)

Researchers from University of Illinois Urbana-Champaign, UCLA, Stanford University, Nvidia, Google, et al. have released “AI+HW 2035: Shaping the Next Decade”. Abstract “Artificial intelligence (AI) and hardware (HW) are advancing at unprecedented rates, yet their trajectories have become inseparably intertwined. The global research community lacks a cohesive, long-term vision to...

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.