Scintil releases DWDM laser source evaluation kit for scale-up AI networks

As AI systems scale from single-rack scale-up network systems to multi-rack configurations up to thousands of AI processors, copper interconnects have reached their limits in speed, density and reach. Future scale-up networks require an optical architecture that delivers higher bandwidth density at lower power with maximum processor utilization...

GaN fundamentals: 2DEG, crystal structure, and figure of merit

Here is why gallium nitride (GaN) is the natural successor to silicon MOSFETs in the 100–650 V class of power devices. The post GaN fundamentals: 2DEG, crystal structure, and figure of merit appeared first on EDN.

Navitas appoints former Lattice chief accounting officer as CFO

Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has appointed Tonya Stevens as chief financial officer (CFO), effective 30 March...

Navitas adds top-side-cooled QDPAK and low-profile TO-247-4L to package line-up in 5th-generation GeneSiC technology

Navitas Semiconductor Corp of Torrance, CA, USA — which provides GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors — has launched two new packages: top-side-cooled QDPAK and a low-profile TO-247-4L with asymmetrical leads in its 5th-generation GeneSiC technology platform. The latest 1200V SiC MOSFET products are claimed...

At MWC, Ericsson Details AI-Native 6G Timeline

At MWC, Ericsson is all about AI-native networks, aiming to nail down 6G by 2029. The post At MWC, Ericsson Details AI-Native 6G Timeline appeared first on EE Times.

HBM4E Raises The Bar For AI Memory Bandwidth

The speed at which accelerators can be fed with data has become just as critical as raw compute capability. The post HBM4E Raises The Bar For AI Memory Bandwidth appeared first on Semiconductor Engineering.

Human-Centered Agentic AI Comes To RTL Verification

The long-term objective is to let engineers spend more time on what really matters and less time on manual coordination. The post Human-Centered Agentic AI Comes To RTL Verification appeared first on Semiconductor Engineering.

CPO Is Extending The Limits Of What’s Possible In AI Data Centers

Co-packaged optics technology will have a big impact on system power and the cost of data movement. The post CPO Is Extending The Limits Of What’s Possible In AI Data Centers appeared first on Semiconductor Engineering.

Rethinking Voice AI At The Edge: A Practical Offline Pipeline

Achieve low-latency, human-like dialogue without sending data outside the local environment. The post Rethinking Voice AI At The Edge: A Practical Offline Pipeline appeared first on Semiconductor Engineering.

Serial Wire Debug (SWD) Protocol: Efficient Debug Interface For Arm-Based Systems

A compact, two-pin interface provides efficient access to debug and trace features while minimizing pin count. The post Serial Wire Debug (SWD) Protocol: Efficient Debug Interface For Arm-Based Systems appeared first on Semiconductor Engineering.

AI Power on the Edge

Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem. The post AI Power on the Edge appeared first on Semiconductor Engineering.

Scale-Up, Scale-Out Get a New Partner

For reaching farther into another data center, developers are now talking about scale-across. The post Scale-Up, Scale-Out Get a New Partner appeared first on Semiconductor Engineering.

Customizing Foundation IP For Ultra-Low-Voltage Designs

A case study on adapting memory compilers and logic libraries for power-critical optical networking chips. The post Customizing Foundation IP For Ultra-Low-Voltage Designs appeared first on Semiconductor Engineering.

A New Chip Supercycle? TSMC’s February Signals the AI Era Has Arrived

Original Article By SemiVision Research [Reading time: 10 mins]

Taiwan Extends Its Reach from Advanced Chips to Embedded Systems

Taiwan is both a manufacturing center and a global platform for innovation in next-generation embedded systems. The post Taiwan Extends Its Reach from Advanced Chips to Embedded Systems appeared first on EE Times.

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.

Eridu Cuts To The AI Networking Chase With High Radix Switch System

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — has recently completed the development of its silicon carbide (SiC) planar MOSFET process platform, which it says is gaining traction in the next-generation compound power...

Beyond the Backplate: Optical MEMS Microphones Unlock High-fidelity Audio

Optical MEMS microphones deliver studio-quality audio in ultra-small form. The post Beyond the Backplate: Optical MEMS Microphones Unlock High-fidelity Audio appeared first on EE Times.

IEEE Launches Global Virtual Career Fairs

In 2025 IEEE launched its first virtual career fair to help strengthen the engineering workforce and connect top talent with industry professionals. The event, which was held in the United States, attracted thousands of students and professionals. They learned about more than 500 job opportunities in high-demand fields including artificial...