Preparing for sub-1nm; Iran war fallout on chips; Embedded World announcements; ramping Japan; foundry rankings; MIPI PHY IP; clocking tech; cybersecurity policy; imec's new consortium; neuromorphic computing. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
UMC has formed a partnership with HyperLight, a spin out from Harvard University’s Laboratory for Nanoscale Optics, to mass produce thin-film lithium niobate (TFLN) chiplets before the end of this ... The post UMC and Hyperlight hook up on TFLN appeared first on Electronics Weekly.
Nissan, Uber and Wayve are to collaborate on a plan to put robotaxis on Tokyo streets this year. The plan is to use Nissan Leaf EVs with Wayve’s ADAS tech. ... The post Nissan joins Uber and Wayve for Tokyo robotaxi roll-out appeared first on Electronics Weekly.
The leading ten foundries achieved around $169.5 billion in revenue in 2025, a 26.3% YoY increase that set a new industry record, reports TSMC. In Q4 the combined revenue of ... The post 26.3% 2025 revenue rise for ten top foundries appeared first on Electronics Weekly.
Antevia Networks, the telecoms equipment vendor, and Benetel, an Irish manufacturer of O-RAN compliant radio units, have hoooked up to deliver private 5G networks. The agreement follows successful integration testing ... The post Antevia Networks and Benetel hook up for private 5G deployments appeared first on Electronics Weekly.
The University of Sheffield is leading a £12.5 million national research centre to strengthen the UK’s ability to design electronic systems and support the UK Semiconductor Strategy. The Centre for ... The post Sheffield University to lead UK electronics design R&D push appeared first on Electronics Weekly.
Original Artcle By SemiVision Research [Reading time: 10mins]
Original Article By SemiVision Research [Reading time: 25 mins]
Democrats currently lead voting intentions for the midterms by 7 percentage points, with 47% of those surveyed saying they would vote for a Democratic candidate if the election took place ... The post Dems Ahead In Mid-Terms appeared first on Electronics Weekly.
Taiwan remains the semiconductor industry's stronghold in 2026, with a tech roadmap aimed at next-generation AI systems. The post The Silicon Hegemon appeared first on EE Times.
Inference-centric design. ROIC is clear. Implications for the industry.
A closer look at the PRC's Advanced Semis Packaging Industry
LPKF develops glass components for ion traps, vacuum chambers and quantum sensors in three projects / Laser micromachining of glass provides the precision required for quantum computer components / Future cluster QVLS-iLabs (QVLS = Quantum Valley Lower Saxony) receives €15 million in funding to accelerate commercialization of quantum technologies. ANNOVER/...
6 min read.
The University of Sheffield is leading a new £12.5m national research center to strengthen the UK’s ability to design the next generation of advanced electronic systems and support the ambitions of the UK Semiconductor Strategy...
Engineering is so much more than solving problems or writing efficient code. It is about creating solutions that affect billions of lives and contributing to a profession built on innovation, responsibility, and collaboration. Although technical skills remain critical, what truly will accelerate the growth of the next generation of engineers...
Leveraging ST’s 40-nm process and an Arm Cortex-M33 core, STM32C5 MCUs deliver increased speed for cost-sensitive embedded devices. The post Low-cost MCUs enable smarter embedded devices appeared first on EDN.
TI’s MSPM0G5187 and AM13E23019 MCUs integrate the TinyEngine NPU, enabling efficient edge AI in systems ranging from simple to complex. The post TinyEngine NPU powers AI in TI MCUs appeared first on EDN.
The i.MX 93W applications processor from NXP combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. The post Edge AI SoC integrates tri-radio appeared first on EDN.