Week 11, 2026

The Semiconductor Newsletter

Embedded World 2026 Confronts Mounting Integration Complexity

Embedded World 2026 reveals rising AI integration challenges. The post Embedded World 2026 Confronts Mounting Integration Complexity appeared first on EE Times.

3D DRAM with CBA Technology (Georgia Tech)

A new technical paper, “System-Technology Co-Optimization of Bitline Routing and Bonding Pathways in Monolithic 3D DRAM Architectures,” was published by researchers at Georgia Tech. Abstract “3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery,...

Rising Attacks on Power Grids Push Utilities to Prepare

In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...

Utilities Study How to Protect Grids From Rising Physical Threats

In the fictional nation of Beryllia, the 2026 World Chalice Games were set to begin as the country faced an unrelenting heat wave. The grid, already under strain from the circumstances, was dealt a further blow when a coordinated set of attacks including vandalism, drone, and ballistic attacks by an...

Systematic Training and Validation of AI-based Systems With Digital Twins and Scenario Engineering

A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was published by researchers at RWTH Aachen University and RIF e.V. Abstract “Artificial intelligence (AI) has emerged as a pivotal technology for autonomous systems across various domains, but quality assurance remains challenging due to...

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More The post AI-Driven Automation in Semiconductor Design: The Fuse...

Pathfinding Method That Models ECC Overhead for Chiplet Interconnects (UCLA)

A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate (BER). Meeting stringent...

IEEE Young Professionals Help Bridge the U.S. Tech Skills Gap

The America’s Talent Strategy: Building the Workforce for the Golden Age report, published last year by the U.S. Departments of Commerce, Education, and Labor, identified a significant engineering and skills gap. The 27-page report concluded that the shortage of talent in essential areas—including advanced manufacturing, artificial intelligence, cloud computing, and...

AI-RAN: The Technology Pushing Mobile Networks Toward AI-Native 6G

AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.

A battery charger that loudly hums: Dump it or just make it dumb?

An archaic DieHard device has seemingly died hard; is hacking it to resurrect a portion of its original function a worthwhile endeavor? The post A battery charger that loudly hums: Dump it or just make it dumb? appeared first on EDN.

TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation

One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley. The 32nd annual TSMC Technology Symposium represents one of the...

Nagoya University and NU-Rei report first gallium oxide thin-film epi growth on silicon

At the Japan Society of Applied Physics (JSAP) Spring Meeting 2026 at the Insitute of Science Tokyo (15-18 March), a research group from Nagoya University’s Center for Low-temperature Plasma Sciences, in collaboration with university spinout NU-Rei Co Ltd, is presenting six advances in the growth of gallium oxide (Ga2O3), which...

EPC91202 evaluation board added for three-phase BLDC motor drive inverter

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has introduced the EPC91202 evaluation board, a complete three-phase brushless DC (BLDC) motor drive inverter designed to accelerate the...

ABLIC Expands Market Presence with High-Value Analog Solutions in Europe and the US

ABLIC develops high-value-added analog semiconductors and has become a global leader in niche fields. Over the past few years, the company has laid the groundwork for business expansion through acquisitions and organizational restructuring. In 2026, ABLIC is poised to translate these efforts into a clear growth trajectory while accelerating business expansion in Europe and the United States. We spoke with Seiji Tanaka, Representative Director and President of ABLIC,...

Women Get Data-Driven Health Boost As The FA Tackles Sports Science's Male Bias

Synopsys Bets on AI Agents to Power Automotive Digital Twins

Synopsys leverages AI agents and digital twins to slash automotive software validation times. The post Synopsys Bets on AI Agents to Power Automotive Digital Twins appeared first on EE Times.

Mobile Tops Peak Landline

In 1990, there were 9.8 landline subscriptions per 100 people worldwide, a figure that nearly doubled to 19.2 by 2006, according to the International Telecommunication Union. While landline subscriptions peaked ... The post Mobile Tops Peak Landline appeared first on Electronics Weekly.

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More The post Synopsys Explores AI/ML Impact on...