The March 2026 Edition of EE Times Europe Magazine analyzes how AI is transforming factory automation and operations and reviews Europe's de-risking semiconductor strategy. The post EE Times Europe Magazine – March 2026 appeared first on EE Times.
A new technical paper, “Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems,” was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract “Rapid progress in generative AI has given rise to Compound AI systems – pipelines comprised of...
A new technical paper, “Revealing and Engineering Contact-Origin Noise in Ultrathin Tellurium Transistors,” was published by researchers at Pohang University of Science and Technology. Abstract “Tellurium (Te) has emerged as a promising p-type semiconductor for ultrathin electronics owing to its strong air stability, excellent hole transport, narrow bandgap, and BEOL-integration...
Wheelchair users with severe disabilities can often navigate tight spaces better than most robotic systems can. A wave of new smart-wheelchair research, including findings presented in Anaheim, Calif., earlier this month, is now testing whether AI-powered systems can, or should, fully close this gap.Christian Mandel—senior researcher at the German Research...
The rapid ascent of artificial intelligence and semiconductor manufacturing has created a paradox: Industries are booming yet they face a critical shortage of skilled workers. Demand for data center technicians, fabrication facility workers, and similar positions is growing. There aren’t enough candidates with the right skill sets to fill the...
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced sample availability of its first heterogeneously...
For fourth-quarter 2025, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $165m, down 9.4% on $182.1m a year ago but roughly flat on Q3/2025’s $165.9m...
The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Goleta, near Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) has announced the first volume production orders by...
Synaptics is introducing its SYN765x single-chip device for using AI at the edge with smart IoT devices. It combines support for real-time intelligence with integrated Wi-Fi 7, aiming at battery-powered ... The post Synaptics SYN765x integrates Wi-Fi 7 and AI for smart devices appeared first on Electronics Weekly.
Jensen Huang was crowned 'The Inference King' with Groq-powered Rubin CPUs, unveiling dramatic architectural leaps at GTC this year. The post GTC 2026 Keynote: Long Live the Inference King appeared first on EE Times.
DigiKey has collaborated with STMicroelectronics and Ultra Librarian for a new version of the eDesignSuite tool. eDesignSuite This is a free no-license-required online design platform developed by ST. It aims ... The post DigiKey, ST, Ultra Librarian partner for eDesignSuite integration appeared first on Electronics Weekly.
Intel’s efforts in the phone business did not end well, but 21 years ago, the company’s mobile targets were ambitious: ‘Thecnext decade will see the way people interact with computers ... The post When Intel Was Bullish On Phones appeared first on Electronics Weekly.
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique...
WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration...
My podcast guest this week is Ferric CEO Noah Sturcken. Noah and I discuss how Ferric’s innovations—specifically their ferromagnetic materials and on-chip power converters—are addressing the critical power, efficiency, and integration hurdles facing today’s AI processors. We also explore how IVRs enable higher instantaneous power delivery, simplify board design, and...
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by...
Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots Infineon enables the key functional blocks...
Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and...
Telink unveiled TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V, multi-protocol support including Bluetooth, Zigbee, Thread, Matter, 2.4GHz Proprietary, and automotive-grade AEC-Q100 certification for IoT applications. The post Telink TL322X+ML3228A Launched at Embedded World 2026 appeared first on EE Times.