Learn how formal verification uses math to prove the absence of runtime errors in complex embedded software for critical defense/space systems, offering stronger reliability than testing.
A Comprehensive Report (2026)
A technical exploration of IEEE 802.11bn’s physical and MAC layer enhancements — including distributed resource units, enhanced long range, multi-AP coordination, and seamless roaming — that define Wi-Fi 8.What Attendees will LearnWhy Wi-Fi 8 prioritizes reliability over raw throughput — Understand how IEEE 802.11bn shifts the design philosophy from peak...
“Can I get an interview?” “Can I get a job when I graduate?” Those questions came from students during a candid discussion about artificial intelligence, capturing the anxiety many young people feel today. As companies adopt AI-driven interview screeners, restructure their workforces, and redirect billions of dollars toward AI infrastructure,...
U.S. doctoral programs in electrical engineering form the foundation of technological advancement, training the brightest minds in the world to research, develop, and design next-generation electronics, software, electrical infrastructure, and other high-tech products and systems. Elite institutions have long served as launchpads for the engineers behind tomorrow’s technology. Now that...
News highlights Cambridge, England – Mar. 24, 2026 – Arm Holdings plc (NASDAQ: ARM) today announced the next evolution of the Arm compute platform, extending into production silicon products for the first time in the company’s history. This begins with the launch of the Arm AGI CPU, an Arm-designed CPU for AI data centers,...
An engineering deep dive into TSMC's COUPE optical engine, explaining why the co-design position of Himax makes them critical near-term suppliers for NVIDIA’s CPO, but without a long-term moat.
At the Bharat Electricity Summit (BES 2026) in Yashobhoomi, New Delhi (19–21 March), Infineon Technologies AG of Munich, Germany announced a strategic technology partnership with Zenergize, an emerging Indian company designing and manufacturing AI-integrated power electronics hardware for the solar, EV charging, and renewable energy sectors. Infineon has had a...
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Original Article By SemiVision Research [Reading time: 14 mins]
Original Article By SemiVision Reserach [Reading time: 10 mins]
Infineon Technologies AG of Munich, Germany and solid-state transformer (SST) solutions firm DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC)...
Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) has introduced a flyback topology that extends the power range of flyback converters to 440W — well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback...
Last week’s Nvidia GTC conference highlighted new chip architectures to power AI. But as the chips become faster and more powerful, the remainder of data center infrastructure is playing catch-up. The power-delivery community is responding: Announcements from Delta, Eaton, and Vertiv showcased new designs for the AI era. Complex and...
The undying thirst for smarter (historically, that means larger) AI models and greater adoption of the ones we already have has led to an explosion in data-center construction projects, unparalleled both in number and scale. Chief among them is Meta’s planned 5-gigawatt data center in Louisiana, called Hyperion, announced in...
In booth #1753 at the Applied Power Electronics Conference (APEC 2026) at the Henry B. Gonzalez Convention Center in San Antonio, Texas, USA (22–25 March), Toshiba America Electronic Components Inc – the North American semiconductor and storage business of Tokyo-based semiconductor maker Toshiba Corp – is highlighting its latest power...
Renesas Electronics Corp of Tokyo, Japan has introduced what is claimed to be the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar micro-inverters, AI data centers and onboard electric vehicle...
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted as a platform for the industry’s brightest engineers, researchers, suppliers, and students from across the microelectronics packaging ecosystem to come together to share innovations shaping next-generation computing systems. With record...