Original Article By SemiVision Research [Reading time: 12 mins]
Nvidia Vera, Arm AGI CPU, Meta, x86, more
A new technical paper, “Quantifying Uncertainty in FMEDA Safety Metrics: An Error Propagation Approach for Enhanced ASIC Verification,” was published by Robert Bosch GmbH. Abstract “Accurate and reliable safety metrics are paramount for functional safety verification of ASICs in automotive systems. Traditional FMEDA (Failure Modes, Effects, and Diagnostic Analysis) metrics,...
A new technical paper, “SoK: From Silicon to Netlist and Beyond Two Decades of Hardware Reverse Engineering Research,” was published by the Ruhr University Bochum and the Max Planck Institute for Security and Privacy. Abstract “As hardware serves as the root of trust in modern computing systems, Hardware Reverse Engineering...
A new technical paper, “Characterizing CPU-Induced Slowdowns in Multi-GPU LLM Inference,” was published by the Georgia Institute of Technology. Abstract “Large-scale machine learning workloads increasingly rely on multi-GPU systems, yet their performance is often limited by an overlooked component: the CPU. Through a detailed study of modern large language model...
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
In a landmark case, a jury found this week that Meta and YouTube negligently designed their platforms and harmed the plaintiff, a 20-year-old woman referred to as Kaley G.M. The jury agreed with the plaintiff that social media is addictive and harmful and was deliberately designed to be that way....
In today’s technological landscape, the only constant is the rate of obsolescence. As engineers move deeper into the eras of 6G, ubiquitous artificial intelligence, and hyper-miniaturized electronics, a traditional degree is only a starting point.To remain competitive in today’s job market, technical specialists must evolve into future-ready professionals by cultivating...
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...
The South Korean fabless startup reports accelerating global adoption of its DX-M1 AI chip across eight countries and seven application domains — and is now using Embedded World 2026 as the launchpad for its European commercial push. The post DEEPX Sets New Pace in Physical AI Commercialization—27 Global Deals in...
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.ICRA 2026: 1–5 June 2026, VIENNARSS 2026: 13–17 July 2026, SYDNEYSummer...
Discover which tech sectors absorb soaring memory prices and who cracks first in the new elasticity-driven supercycle. The post Who Breaks First in the Memory Supercycle? appeared first on EE Times.
We’re all familiar with mixing red, yellow, and blue paint in various ratios to instantly make all kinds of colors. This works great for oils or watercolors, but fails when it comes to cans of spray paint. The paint droplets can’t be blended once they are aerosolized. Consequently, although spray...
Nearly five decades after Intersil released the ICL7106 and ICL7107 in 1978, the chips at the heart of the world's cheapest digital meters are still in production.
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This sponsored article is brought to you by NYU Tandon School of Engineering.Within a 6 mile radius of New York University’s (NYU) campus, there are more than 500 tech industry giants, banks, and hospitals. This isn’t just a fact about real estate, it’s the foundation for advancing quantum discovery and...
AI is rapidly reshaping semiconductor defect detection, but not along a single trajectory. The post Why AI in Semiconductor Inspection Is Becoming a Two-Layer Game appeared first on EE Times.
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has completed its private placements (announced on 19 March) of...
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