Apple’s First Made-in-U.S. Chips Fall Short of Claim
Apple's U.S. manufacturing claim is undermined by the fact that final chip assembly still occurs in Taiwan, highlighting the persistence of global supply chains.
Apple’s latest push to market its first U.S.-made chips has hit a snag, as the company’s chips still depend on Taiwanese fabs for final assembly. The revelation underscores the continued reliance on global supply chains even as U.S. policy pushes for domestic manufacturing. Meanwhile, a joint study from UIUC, UCLA, Stanford and industry leaders outlines a 10‑year roadmap for AI and hardware, highlighting the need for tighter hardware‑software co‑design. In the compute arena, custom engine businesses are outpacing expectations, signaling a shift toward specialized silicon for cloud and edge workloads. In automotive, STMicroelectronics has introduced new high‑side drivers designed to withstand harsh transients, a key component for next‑generation electric and hybrid powertrains.
Apple's U.S. manufacturing claim is undermined by the fact that final chip assembly still occurs in Taiwan, highlighting the persistence of global supply chains.
A multi‑institution study charts the next decade of AI and hardware evolution, stressing the importance of joint hardware‑software optimization.
Custom silicon businesses are accelerating faster than industry leaders predicted, reshaping the cloud and edge silicon market.
STMicroelectronics launches new automotive high‑side drivers capable of handling harsh transients, a critical upgrade for EV and hybrid power electronics.
Showcases a breakthrough in additive manufacturing that could enable lunar infrastructure, blending semiconductor lasers with space exploration.
Highlights cutting‑edge research on in‑memory computing, a promising direction for next‑generation AI acceleration.