TSMC is facing challenges in ramping up its AI chip production, leading to anticipated shortages that will last for several years. Analysts indicate that the demand for AI chips will outstrip TSMC's production capabilities during this period.
The article discusses TSMC's reliance on optimistic AI forecasts from its customers to gauge the future of the GenAI market. As the leading foundry, TSMC's insights will be critical in understanding potential shifts in demand for advanced chips.
TSMC reported a 35% year-over-year profit increase in Q4, reaching $16 billion on revenues of $33 billion, marking its first annual revenue surpassing $100 billion. The company anticipates continued revenue growth moving forward.
TSMC plans to increase its investment in the United States to $465 billion by constructing five additional fabs in Arizona. This expansion follows a new trade deal between the US and Taiwan.
The article discusses a new lithography strategy that integrates a large exposure field with high-resolution imaging and algorithmic early zone correction. This approach aims to minimize alignment errors in the fabrication process of next-generation fan-out panel-level packaging (FOPLP).
The article features a Q&A session with TSMC, where they discuss their upcoming strategic initiatives. This dialogue aims to shed light on TSMC's future direction in the semiconductor landscape.
At CES 2026, Taiwanese startups are showcasing AI systems that emphasize real-world applications and system integration rather than just theoretical advancements. This shift indicates a maturation in AI technology, supported by Taiwan's robust electronics supply chain.
The article discusses the evolving dynamics of wafer demand and node economics in the semiconductor industry, particularly as artificial intelligence (AI) influences the foundry landscape. It highlights the partnership between Apple and TSMC as a pivotal factor in shaping modern semiconductor manufacturing.
TSMC's N2 technology positions the company to maintain a leadership role in advanced semiconductor nodes for the foreseeable future. Analysts predict that this will give TSMC a competitive edge over its rivals.
Researchers from Stanford, TSMC, ETH Zurich, and other institutions have published a paper on channel-last gate-all-around nanosheet oxide semiconductor transistors. These transistors are designed to improve performance as the industry moves beyond traditional transistor miniaturization.
Researchers from UT Austin, TSMC, and TDK Headway Technologies have published a paper on a new method to enhance the performance of magnetic tunnel junctions (MTJs) using AI/ML techniques. The study focuses on improving tunnel magnetoresistance and reducing resistance in MTJs that utilize magnesium oxide barriers.
TSMC has successfully concluded its 6th ESG AWARD, receiving over 5,800 proposals from employees, showcasing strong internal engagement in sustainability initiatives. This response highlights TSMC's commitment to corporate sustainability and employee involvement.
Socionext has achieved two successful tape-outs of complex 3D-IC designs in just seven months, targeting AI and HPC applications. This rapid iteration showcases advancements in packaging, EDA tools, and collaboration within the foundry ecosystem.
EMASS, a subsidiary of Nanoveu, is nearing the tape-out of its ECS-DoT SoC, which is built on a 16-nm process node. The project is progressing towards critical milestones including GDS sign-off and fabrication at TSMC.
TSMC has commenced volume production of its 2nm (N2) technology in the fourth quarter of 2025, as scheduled. This new technology incorporates first-generation nanosheet transistors, promising significant performance improvements.
TSMC is recognized as the most trusted semiconductor foundry due to its long-standing reputation for technological leadership and operational excellence. This trust is crucial in an industry where reliability directly impacts performance and innovation.
TSMC is enhancing its customer experience through a new customized technical documentation platform, reinforcing its commitment to customer-centric innovation. This initiative aligns with TSMC's reputation as 'The Trusted Foundry' in the semiconductor industry.
The article discusses the evolving standards of datacenter performance driven by advancements in AI technology. It emphasizes the need for datacenters to adapt to these new benchmarks to remain competitive.
The top 10 foundries experienced an 8.1% quarter-over-quarter revenue growth in Q3, reaching nearly $45.1 billion, according to TrendForce. This growth is attributed to advancements in processes better than 7nm.
The article discusses the ongoing trend in the AI semiconductor market where companies other than Nvidia and TSMC must rely on high sales volumes to remain competitive. This situation is perceived as repetitive yet continues to surprise industry observers.