The article discusses the 'Big Allis' generator manufactured by Allis-Chalmers, which experienced a significant design flaw during the 1965 Northeastern blackout. This historical event highlights the importance of design integrity in large-scale power generation systems.
The article provides a roundup of significant developments in edge AI, quantum chips, and embedded computing, highlighting the release of the ESD November 2025 eBook. It encourages readers to explore additional resources on the Embedded website for more insights.
X-FAB's XbloX platform offers a standardized and flexible set of silicon carbide (SiC) process technologies that streamline the development of advanced power devices. This platform enables faster production timelines, with the potential to start production up to nine months earlier than traditional methods.
The paper introduces a new method for automated stripboard circuit layout design using Answer Set Programming (ASP), focusing on both synthesis and multi-objective optimization. It demonstrates the ability to create compact, manufacturable layouts while addressing complex design constraints effectively.
SEEQC has formed a strategic partnership with Taiwan's ITRI to create a manufacturing process line for its Single Flux Quantum superconducting control chips. This collaboration aims to enhance the scalability of SEEQC's digital quantum technology initiatives.
A new family of larger connectors offers compatibility with through-hole PCB mounting, enhancing strength and enabling reflow soldering for surface-mount devices. This innovation addresses a common challenge in connector design, balancing durability with modern assembly techniques.
The Aerospace Industries Association (AIA) and Accuris have released NAS410 Revision 6, which enhances nondestructive testing (NDT) for improved inspection reliability and safety in aircraft operations. This update also aims to create new career opportunities for aerospace professionals.
Smartphone production experienced a 9% increase in Q3 2025, reaching 328 million units due to seasonal demand and new product launches. This growth reflects a significant uptick in the market as it enters its peak season.
The article highlights advancements in environmentally friendly extraction of rare earth minerals, TSMC's plans to construct ten 2nm fabrication facilities, and the installation of a Bell-1 Quantum Computer by Equal1 at the ESA’s Φ-lab. These developments reflect significant trends in sustainability, cutting-edge technology, and the ongoing evolution of semiconductor manufacturing.
IDC forecasts that 1.25 billion smartphones will be sold in 2025, marking a year-over-year growth of 1.5%. Apple is expected to see a more robust growth of 6.1% in its shipments during the same period.
The EU is advancing its semiconductor industry through the upcoming CHIPS Act 2.0, which aims to attract investments and support competitive R&D pilot programs. This initiative is part of a broader strategy to enhance the EU's position in the global semiconductor landscape amidst changing geopolitical conditions.
Ascent Solar Technologies has supplied lightweight, flexible CIGS thin-film photovoltaic modules for testing in cislunar space. These modules are designed for integration into various applications, including aerospace.
CADmore Metal has introduced cold metal fusion (CMF) technology for 3D printing titanium components, claiming it produces stronger, cheaper, and faster parts. This innovation addresses the challenges that have historically plagued the 3D printing of titanium.
The production index for the semiconductor manufacturing sector increased to 51.4% in November, indicating a slight recovery. However, employment in the industry continued to decline for the tenth consecutive month.
The article discusses the prevalence of toxic work environments in the engineering field, particularly among semiconductor professionals. It highlights the negative impact of toxic managers and teammates on career development and workplace morale.
An interdisciplinary team has developed the first electronic-photonic-quantum system on a single chip, marking a significant milestone in quantum technology. This achievement, published in Nature Electronics, showcases advancements in quantum computing, communication, and sensing.
Germany is reallocating funds initially designated for Intel to support new semiconductor projects. This move could significantly influence the landscape of Europe's technology sector.
Murata has launched a new multilayer ceramic capacitor (MLCC) with a capacitance of 15nF and a rated voltage of 1.25kV, featuring C0G characteristics in a compact 3225M package. This product is now in mass production, indicating its readiness for market deployment.
Nokia Bell Labs' Peter Vetter acknowledges that 5G has not met expectations and emphasizes the importance of infrastructure for the success of 6G. He warns that by 2030, 5G will reach its capacity limits, necessitating a focus on 6G development.
Zuken has launched Panel Builder 2026, an update to its E3.series design platform aimed at enhancing control panel and switchgear production. This new tool allows engineering and manufacturing teams to create intelligent wiring and assembly instructions directly from electrical design data.