Singulus Technologies AG has secured a follow-on order for its TIMARIS micro-LED deposition system, indicating a successful initial deployment. This order will help the customer expand their micro-LED production capabilities in the USA.
The article discusses advancements in semiconductor technologies, specifically focusing on atomic layer deposition (ALD) for ruthenium (Ru) wiring, the development of vertical nanolasers, and the exploration of hydrogel semiconductors. These innovations highlight ongoing research efforts aimed at enhancing semiconductor performance and capabilities.
A Danish-led ESA project aims to enable the manufacturing of electronics on the Moon to reduce reliance on Earth-based supplies for future lunar missions. This initiative represents a significant step towards sustainable extraterrestrial operations.
SST and UMC have successfully qualified SST's embedded SuperFlash Gen 4 (ESF4) memory for automotive applications, achieving automotive-grade 1 (AG1) certification. Production is set to commence using UMC's advanced 28HPC+ foundry process technology.
The TPQDR3914 Three Phase dv/dt Reactor from EMIS is designed to limit voltage rise generated by PWM switching in Variable Frequency Drives (VFDs), thereby reducing voltage stress on motors. This innovation aims to enhance the reliability and longevity of drive systems used in various applications.
ALLOS Semiconductors and Ennostar have formed a strategic partnership to produce 200mm GaN-on-Si LED epiwafers for micro-LED applications. This collaboration aims to establish a silicon fab-compatible supply chain for micro-LED products.
QD Laser Inc. has placed an order for an MBE 6000 production system from Riber S.A. to enhance its quantum dot laser manufacturing capabilities. This move aims to support the growing demand for advanced optoelectronic devices in the datacom sector.
The article features a discussion with PDF Solutions' CEO about the integration of AI in chip manufacturing, advancements in 3D-IC technology, and the trend towards shorter production cycle times. These topics highlight the evolving landscape of semiconductor manufacturing and the push for efficiency and innovation.
The article discusses the critical need for predictive maintenance in modern manufacturing to avoid costly downtime. It highlights the unsustainability of traditional reactive maintenance methods in light of the significant financial impacts of unexpected failures.
In Q4 2025, 75 companies successfully raised a total of $3 billion, indicating a trend towards larger funding rounds in the semiconductor sector. This funding is particularly focused on AI chips and the application of AI in chip manufacturing.
Micron Technology has signed a Letter of Intent to acquire Powerchip Semiconductor Manufacturing Corporation's P5 fabrication site in Taiwan. This acquisition is part of Micron's strategy to enhance its manufacturing capabilities in the region.
The article provides insights into recent developments in smart factories, processors for smart manufacturing, and inertial measurement units (IMUs). It highlights Qualcomm's strategic expansion and Nvidia's advancements in physical AI technologies.
The article reflects on a past meeting where SMIC's CEO highlighted the company's previously unrestricted access to Western technology. It underscores the significant financial backing SMIC received during its early years, which facilitated its growth in the semiconductor industry.
GalaxyCore showcases its 0.64 μm 50MP CIS technology, emphasizing its ability to maintain high image quality through various optimization techniques. This advancement highlights the importance of pixel, circuit, and system-level enhancements in modern imaging sensors.
III–V Epi Ltd is showcasing its specialized epitaxy manufacturing services at SPIE Photonics West 2026 in San Francisco. The company focuses on low-volume, fast-turnaround services for custom compound semiconductor wafer design and manufacturing.
Lumentum Holdings Inc is showcasing its high-power ultrafast and UV laser solutions at SPIE Photonics West 2026, aimed at meeting the demands of advanced manufacturing and sensing applications. These innovations are designed to enhance precision, throughput, and reliability in various industrial sectors.
Quobly, STMicro, and Soitec are addressing the significant challenge of scalable manufacturing in the quantum computing sector. Their efforts highlight the complexities involved in producing quantum technologies at scale.
SST and UMC have announced the immediate availability of their 28nm SuperFlash® Gen 4 Automotive Grade 1 platform, aimed at meeting the growing performance demands of automotive vehicle controllers. This development highlights the ongoing collaboration between SST and UMC in advancing semiconductor technology for the automotive sector.
Microchip has introduced the JANPTX family of military-grade TVS devices, which comply with the MIL-PRF-19500 qualification and feature a peak pulse power rating of 1.5 kW. This launch highlights Microchip's commitment to providing robust solutions for military applications.
The article discusses the concept of smart manufacturing, which integrates digital technologies like IIoT, AI, and data analytics into industrial processes. Smart factories are highlighted as the core component of Industry 4.0, utilizing various sensors to gather critical operational data.