The article expresses concern over Qualcomm's acquisition of Arduino, suggesting that while Qualcomm produces high-quality semiconductors, the merger may not be beneficial for Arduino's identity. The author hints at skepticism regarding the future direction of Arduino under Qualcomm's ownership.
Ambient computing enhances the Internet of Things (IoT) by enabling real-time responses to monitored parameters through a smart network. This integration allows for efficient tracking of data such as movement and temperature with minimal human intervention.
Melexis has developed a new algorithm for people detection, counting, and localization using its MLX90642 far-infrared thermal array. This solution offers a privacy-preserving alternative for monitoring people in various environments.
Lancaster University has received the prestigious Queen Elizabeth Prize for Education for its contributions to the BBC micro:bit. This award represents the highest educational honor in the UK.
The paper introduces a method for enhancing the functional stability of neural networks by employing hardware redundancy at the neuron level. This approach allows the system to maintain operation despite individual hardware failures.
Melexis has launched the first automotive-qualified infrared thermometer designed for surface-mount device (SMD) applications. This innovation addresses the limitations of traditional NTC thermistors in automotive environments.
Murata has commenced mass production of 1.25-kV multilayer ceramic capacitors (MLCCs) featuring a capacitance of 15 nF in a compact 1210-size package. This development aims to enhance stability in various electronic applications.
Taiyo Yuden has introduced the HVX(-J) and HTX(-J) series of conductive polymer hybrid aluminum electrolytic capacitors. These new capacitors are designed to handle increased ripple current, enhancing their performance in various applications.
Taoglas has introduced three chip antennas designed to enhance signal integrity for Wi-Fi 6/7, ultra-wideband (UWB), and ISM connectivity. These products aim to improve performance in wireless communication applications.
OKW has introduced CONNECT fast-assembly handheld plastic enclosures that come with optional integrated cable glands. This innovation simplifies the installation process for power and data connections in handheld devices.
Robert shares his hands-on experience with the Zephyr RTOS and highlights his contribution of a sensor driver for the MTCH9010 liquid leak detector. The article provides insights into the practical applications of the RTOS in sensor technology.
A new family of larger connectors offers compatibility with through-hole PCB mounting, enhancing strength and enabling reflow soldering for surface-mount devices. This innovation addresses a common challenge in connector design, balancing durability with modern assembly techniques.
OMC is witnessing increased demand for its industrial fibre-optic datalinks and optoelectronic cable assemblies due to the global push for electrification. This demand is particularly driven by the need for reliable and interference-resistant technologies in high voltage applications.
ASRock Industrial showcased its advancements in secure device integration and FIDO Device Onboard (FDO) technology at the FIDO Taipei Seminar. This marks a significant achievement as ASRock becomes the first industrial computer company in Taiwan to receive FDO certification.
Researchers from Tokyo University of Science and National Institute of Advanced Industrial Science and Technology have introduced approximate domain unlearning, a method that enhances vision-language models (VLMs) by removing irrelevant information while maintaining performance. This approach addresses the limitations of current class unlearning methods, which are inadequate for practical applications in domain-specific recognition.
SEGGER has introduced a new capability for its Flasher in-system programmers, allowing them to run custom applications and perform board testing. This enhancement applies to their entire line of Flasher devices, including various models designed for different programming needs.
Littelfuse has launched a new high-current X4-Class Power MOSFET that enhances thermal management and efficiency while minimizing component count in various applications. This innovation is particularly relevant for energy, charging, drone, and industrial systems.
The interview with Jens Milnikel highlights the innovative technologies and strategic vision of ams OSRAM's CMOS Sensors ASICs division. It emphasizes the importance of human stories and partnerships in establishing the company as a leader in sensing solutions.
The Oura Ring 4 appears similar to its predecessor but has notable internal differences. This suggests advancements in technology and functionality that may not be immediately visible externally.
The article discusses the upcoming EU Cyber Resilience Act and its implications for digital product manufacturers. It emphasizes the need for compliance with new security regulations.