Latest semiconductor industry news and analysis
ABB has acquired Gamesa Electric’s power electronics business, marking its re-entry into the solar inverter market. This move aims to leverage opportunities within the growing renewable energy sector.
TDK has introduced a new series of DC link film capacitors optimized for SiC-based inverters, featuring low equivalent series inductance (ESL) of 8 nH and designed for high-frequency operation. This launch highlights TDK's commitment to advancing components that meet the evolving demands of power electronics.
The article discusses the challenges faced by sensor developers in balancing the accuracy of measurements for one phenomenon while addressing customer demands for additional functionalities. It highlights the importance of adapting to user feedback in the development of nanoscale sensors.
Singulus Technologies AG has secured a follow-on order for its TIMARIS micro-LED deposition system, indicating a successful initial deployment. This order will help the customer expand their micro-LED production capabilities in the USA.
Leankon is launching two compact integrated antennas that support WiFi 7, WiFi 6E, and Bluetooth, specifically designed for space-constrained wireless devices. These antennas target OEM and embedded applications that require multi-band connectivity.
CEA-Leti is showcasing advancements in the integration of quantum cascade lasers with silicon photonic platforms at SPIE Photonics West 2026. This research focuses on mid-infrared applications, highlighting significant progress in micro/nanotechnology.
Coherent Corp has introduced bondable diamond solutions designed for thermal management in semiconductor applications. This innovation allows for direct bonding to semiconductor die, significantly enhancing cooling performance by reducing thermal interface resistance.
The article discusses advancements in semiconductor technologies, specifically focusing on atomic layer deposition (ALD) for ruthenium (Ru) wiring, the development of vertical nanolasers, and the exploration of hydrogel semiconductors. These innovations highlight ongoing research efforts aimed at enhancing semiconductor performance and capabilities.
The article highlights recent advancements in semiconductor technology, including low temperature Cu-Cu bonding and innovations in EUV resists. It also discusses developments in quantum hardware and photonic integration, which are crucial for future applications.
The article discusses the evolving role of GPUs in AI computation as the technology expands beyond traditional data centers. It highlights the increasing relevance of FPGAs in the AI data path due to system constraints.
A Danish-led ESA project aims to enable the manufacturing of electronics on the Moon to reduce reliance on Earth-based supplies for future lunar missions. This initiative represents a significant step towards sustainable extraterrestrial operations.
Ligentec and X-Fab are collaborating to market X-Fab's XPH90 Silicon Photonics technology, integrating it into Ligentec's photonics platform. This partnership aims to create a unified ecosystem that enhances the capabilities of silicon photonics applications.
Toshiba has successfully integrated its SmartMCD technology for dual brushed DC motors into Mikroe’s SmartMCD TB9M001FTG automotive board. This development allows automotive system engineers to enhance their designs with advanced motor control capabilities.
ST's SRK1004 synchronous-rectifier controllers are designed to enhance efficiency and reduce space requirements in various power converter applications. These controllers are particularly useful in chargers and power adapters, showcasing advancements in power management technology.
GeoCue has partnered with Coptrz to distribute its LiDAR mapping products in the UK, aiming to enhance access to aerial mapping technology for professionals in surveying and engineering. This collaboration signifies a strategic move to broaden the market reach of GeoCue's innovative solutions.
Iceye has expanded access to its satellite-based Synthetic Aperture Radar (SAR) imagery for Ukraine and signed a new agreement with Sweden. This move enhances the availability of critical data for these nations.
The Tynemouth Corporation Watch Committee is considering the purchase of a portable electronic traffic analyzer, which is a key component for radar speed checks. This decision follows a report from the Chief Constable regarding the associated costs.
SK Hynix is making a significant investment of $13 billion in a new HBM packaging plant, positioning itself as a leader in the AI memory market. This move is indicative of the company's strategy to redefine its role in the memory sector.
Microsoft has decided to extend support for Windows 10 for an additional year in response to user backlash. However, the effectiveness of this extension remains questionable.
SST and UMC have successfully qualified SST's embedded SuperFlash Gen 4 (ESF4) memory for automotive applications, achieving automotive-grade 1 (AG1) certification. Production is set to commence using UMC's advanced 28HPC+ foundry process technology.