The article provides a roundup of significant developments in edge AI, quantum chips, and embedded computing, highlighting the release of the ESD November 2025 eBook. It encourages readers to explore additional resources on the Embedded website for more insights.
Ambient computing enhances the Internet of Things (IoT) by enabling real-time responses to monitored parameters through a smart network. This integration allows for efficient tracking of data such as movement and temperature with minimal human intervention.
Melexis has launched the first automotive-qualified infrared thermometer designed for surface-mount device (SMD) applications. This innovation addresses the limitations of traditional NTC thermistors in automotive environments.
The article discusses a webinar on Defacto's SoC Compiler AI, which aims to simplify the complex process of System-on-Chip design by utilizing human language. This innovation addresses the challenges posed by intricate EDA tool flows that often lead to significant time losses in configuration.
Robert shares his hands-on experience with the Zephyr RTOS and highlights his contribution of a sensor driver for the MTCH9010 liquid leak detector. The article provides insights into the practical applications of the RTOS in sensor technology.
Same Sky’s Audio Group has expanded its receiver lineup with new models designed for over-the-ear applications, focusing on compact mechanical envelopes. The CMR receiver family offers a wide acoustic output range with sound pressure levels from 103 to 135 dB.
SEEQC has formed a strategic partnership with Taiwan's ITRI to create a manufacturing process line for its Single Flux Quantum superconducting control chips. This collaboration aims to enhance the scalability of SEEQC's digital quantum technology initiatives.
The article discusses a recent white paper from Siemens that focuses on using GenAI to assist verification engineers in transitioning to Portable Stimulus Specification (PSS). It highlights a shift in the EDA industry towards practical applications of AI rather than just attention-grabbing developments.
The interview with Jens Milnikel highlights the innovative technologies and strategic vision of ams OSRAM's CMOS Sensors ASICs division. It emphasizes the importance of human stories and partnerships in establishing the company as a leader in sensing solutions.
The article discusses the importance of efficiently controlling magnetization in advancing spintronic technologies, which leverage electron spin for enhanced electronic device performance. It highlights the potential of magnons in achieving this control, paving the way for faster and more energy-efficient devices.
The EU is advancing its semiconductor industry through the upcoming CHIPS Act 2.0, which aims to attract investments and support competitive R&D pilot programs. This initiative is part of a broader strategy to enhance the EU's position in the global semiconductor landscape amidst changing geopolitical conditions.
The article highlights key collaborations that are advancing technologies in AI processing, IoT connectivity, and energy harvesting. These innovations are pivotal for enhancing edge intelligence and supporting next-generation communication standards.
Korean semiconductor giants, including Samsung and SK hynix, are transitioning their focus from traditional memory products to AI-driven technologies like High Bandwidth Memory (HBM). This shift is occurring in the context of heightened global competition, U.S. export controls, and supportive government initiatives.
Ironwood Electronics has introduced a manual-actuated test socket for QFN24 devices that enables solderless evaluations. This socket features a double-latch mechanism for controlled compression, facilitating quick device changeovers in testing environments.
The article discusses the limitations of traditional post-silicon validation methods in semiconductor development, particularly as technology advances into smaller nodes. It highlights the need for more sophisticated approaches to manage variability and ensure performance in modern chips.
SiTime has unveiled a new precision oscillator designed specifically for aerospace and defense applications, focusing on enhancing reliability for GNSS receivers. This oscillator features multi-layer reliability to combat jamming and spoofing threats.
The article discusses the potential of using large language models (LLMs) to directly reference specifications for test generation in semiconductor design, aiming to reduce reliance on human translation. However, it highlights that current specifications are not completely reliable due to various shortcomings.
Marvell Technology Inc. has partnered with Microsoft to expand cloud-based security services in Europe using its LiquidSecurity hardware security modules. This move builds on Microsoft's previous deployments in Asia and North America and follows recent European certifications for Marvell.
The article discusses how mixed-signal electronic systems can experience power rail disturbances that affect sensitive analog measurements. Engineers need to identify the source of these disturbances to mitigate issues like ADC output spurs and sensor reading drift.
An interdisciplinary team has developed the first electronic-photonic-quantum system on a single chip, marking a significant milestone in quantum technology. This achievement, published in Nature Electronics, showcases advancements in quantum computing, communication, and sensing.