SST and UMC have successfully qualified SST's embedded SuperFlash Gen 4 (ESF4) memory for automotive applications, achieving automotive-grade 1 (AG1) certification. Production is set to commence using UMC's advanced 28HPC+ foundry process technology.
Voyant Photonics' CEO discusses the company's ambition to make LiDAR technology as ubiquitous as cameras through the development of solid-state 4D FMCW sensing. This innovation was highlighted during an interview at CES, showcasing the potential for widespread adoption of LiDAR in various applications.
Richard Hegberg, CEO of Caspia Technologies since 2024, shares insights about his extensive background in the semiconductor industry, including leadership roles at several notable companies. The article provides a platform for discussing the future outlook of Caspia Technologies within the semiconductor landscape.
The article discusses the critical need for predictive maintenance in modern manufacturing to avoid costly downtime. It highlights the unsustainability of traditional reactive maintenance methods in light of the significant financial impacts of unexpected failures.
The article discusses the increasing complexity of PCB design due to the rise of heterogeneous multi-die designs. It emphasizes the importance of advanced analysis in addressing these challenges while maintaining a focus on complete system integration.
TDK showcased its innovative solutions at CES 2026, focusing on enhancing sensing, inference, and context awareness in wearables and smart glasses. This development signifies a potential shift in how edge devices process and interpret data.
Moshe Tanach, co-founder and CEO of NeuReality, discusses his background and leadership in engineering roles at major semiconductor companies. His experience spans complex wireless and networking products, highlighting his expertise in the industry.
The article discusses the importance of selecting the right prototyping partner in the semiconductor industry, highlighting S2C's role in advanced FPGA-based SoC prototyping. The author expresses anticipation for an upcoming update from S2C at the DVCon event in March.
The article focuses on deriving design equations for a second-order Phase-Locked Loop (PLL) that incorporates a lag-lead filter by analyzing its Bode plots. This approach aims to enhance the understanding of PLL performance in various applications.
The article discusses how evolving regulations and lifecycle security strategies are influencing automotive cybersecurity. It highlights the importance of quantum-ready cryptography in enhancing the security of software-defined vehicles.
The article provides insights into recent developments in smart factories, processors for smart manufacturing, and inertial measurement units (IMUs). It highlights Qualcomm's strategic expansion and Nvidia's advancements in physical AI technologies.
The Mostek MK4116 and MK4164 DRAM chips were pivotal in shaping the microcomputer landscape of the late 1970s and early 1980s. Their introduction established industry standards that influenced subsequent DRAM designs.
The article discusses the growing challenge of verification in chip design, which now consumes up to 70% of the design cycle due to increasing complexity and a shortage of design verification engineers. It highlights the introduction of Bronco AI agents aimed at addressing these verification bottlenecks.
Cadence Design Systems has launched the first LPDDR5X 9,600 Mbits/s memory IP system solution designed for enterprise and data center applications. This solution integrates Cadence's memory IP with Microsoft's RAIDDR ECC algorithm to enhance reliability.
The semiconductor market is experiencing significant growth driven by the increasing adoption of AI applications, with a McKinsey survey indicating that 88% of businesses utilized AI in 2025. Additionally, mentions of AI in earnings calls by S&P 500 companies surged from 53 to 306 in just three years.
The article discusses the increasing complexity of System-on-Chip (SoC) designs, which demand enhanced prototype capacity and efficiency. S2C aims to address these challenges with a high productivity toolchain for SoC bring-up.
Siemens has launched a new cloud-based digital twin software aimed at accelerating the development of software-defined vehicles (SDVs). This offering promises to significantly reduce setup times from months to just days.
The article discusses the concept of smart manufacturing, which integrates digital technologies like IIoT, AI, and data analytics into industrial processes. Smart factories are highlighted as the core component of Industry 4.0, utilizing various sensors to gather critical operational data.
The article emphasizes the importance of the Engineering Track at DAC 2026, where industry practitioners share practical insights and lessons. It highlights the value of real-world experiences in enhancing engineering practices within the semiconductor sector.
EMASS's new ultra-low-power SoC is designed to enhance intelligence at the sensor edge, focusing on minimizing size, power consumption, and latency. This innovation was highlighted during an exclusive interview at CES, showcasing its potential applications in various tech sectors.